The invention discloses a special adhesive used for a high-temperature resistant electronic circuit pad board and added with organic modified montmorillonite, wherein the special adhesive is prepared from the following raw materials by weight: 100-110 parts of corn protein, 8-9 parts of acrylamide, 2-2.5 parts of maleic anhydride, 8-9 parts of ammonium persulfate, a proper amount of sodium hydroxide with the concentration of 40 wt%, a proper amount of distilled water, 50-55 parts of water glass with the modulus of 2.8, 9-10.5 parts of polyvinyl alcohol, 2-3 parts of ethyl silicate, 1.7-2 parts of amino sulfonic acid, 1-1.2 parts of a silane coupling agent kh550, 1-1.4 parts of trisodium phosphate, 5-6 parts of montmorillonite, 0.3-0.4 part of cetyltrimethyl bromide ammonium, a proper amount of anhydrous ethanol, 3-4 parts of magnesium oxide, 2-3 parts of sodium alginate, and a proper amount of dilute hydrochloric acid. According to the present invention, the prepared adhesive has advantages of high strength, improved curing speed, good thermal stability, good high-temperature resistance and good insulating property, and is suitable for the adhesion of the electronic circuit pas board.