The invention discloses a
copper-based heat exchange surface. A Ni-P-
PTFE composite clad layer covers on the surface of a
copper-based material and has the excellent coefficients of heat
conductivity, and simultaneously, can reduce the
surface energy of the
copper-based material to fulfill the aim of inhibiting scale. In addition, the invention also discloses a manufacturing method of the copper-based heat exchange surface. The copper-based heat exchange surface and the method have the advantages that Ni-P-PTFE is plated on the surface of the copper-based material, and water molecules cannot moisten the surface of PTFE fully so as to form attached scale deposits by utilizing the characteristic of low PTFE surface wettability; the
surface energy of the material is reduced on the premise ofensuring the excellent coefficients of heat
conductivity so as to fulfill the aim of inhibiting scale; in order to improve the heat
conductivity of the surface of red copper, basic plating solution containing
metal Ni is adopted in a chemical composite plating method, and the heat conductivity is high; and the copper-based heat exchange surface has the low
surface energy and low adsorptive capacity on scaling
crystal nuclei, and simultaneously, has the nonwetting characteristic and is not favorable for depositing and aggregating the scale deposits.