The present invention provides a film LED
chip device basing on the combined low-resistance buffer structure and the manufacturing method thereof, the insulating buffer film is packaged on side wall of all
metal structures and is filled in all non-electrical connected areas, with
filling in insulating buffer film between all
metal convex points which connects the GaN base illuminating device and the electric polarized substrate, the filling-in thickness is a little under or even with the height of the metallic convex points, and with directly liking the GaN base illuminating device
crystal disc with the whole surface of the electric polarized inversely mounted substrate with the mode of whole surface linking of the
wafer, the metallic convex point of the conductive supporting thick
metal layer and the insulating buffer film form the combined low-resistance buffer structure of the invention together, not only the electric connection between the GaN base illuminating device and the electric polarized inversely mounted substrate is realized, but also the buffer layer filling is realized thereby reducing the
wafer rupture incidence rate of the subsequent
laser stripping technique in order to increase the good product ratio, besides the stripped
sapphire substrate disc which can execute finishing to the
sapphire substrate and is obtained after stripped operation can be recovered for reusing, the production cost is reduced.