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62 results about "Free Radical Suppression" patented technology

Free Radical Suppression involves interference with, or restraint of, production in normal or pathological processes of chemically unstable, short half-life and highly reactive molecules carrying at least one unpaired or 'free' electron in the outermost electron shell. Appropriating electron(s) from a nearby molecule and damaging that molecule by altering the electron number in its outermost electron shell, Free Radicals produce tissue damage.

Crosslinked polyethylene composition having improved processability

Disclosed in the present invention is a crosslinked polyethylene composition having improved processability comprises: 100 parts by weight of polyethylene, 0.03-5 parts by weight of crosslinking agent, 0.03-5 parts by weight of crosslinking promoter, and 0.01-1.5 parts by weight of free radical inhibitor, wherein the polyethylene is a copolymer and/or homopolymer containing at least 90 wt. % of vinyl and at least one C3-C8 α-alkenyl, and has a density in the range of 0.920-0.970 g/cm3, a melt index in the range of 2.5-17.5 g/10 min; the crosslinking agent is a peroxide crosslinking agent; the crosslinking promoter is an organic substance containing maleimido, (meth)acrylate group, and/or allyl, and/or a polymer containing more than 50% of vinyl; the free radical inhibitor is an organic antioxidant, a quinhydrone and/or a substituted quinhydrone. The crosslinked polyethylene composition of the present invention has a crosslinking efficiency index of more than 1,100 Nm/g and a δ torque value of more than 10 Nm at the temperature of 200° C., a significantly higher safety process temperature and a significantly improved crosslinking retardation time compared to the conventional crosslinked polyethylene composition, which make it especially be suitable for the production of rotational molding articles.
Owner:SHENHUA (BEIJING) NEW MATERIALS TECH CO LTD

Method for preparing antioxidant pine pollen peptide by utilizing pine pollen meal

The invention belongs to the technical field of biology and in particular relates to a method for preparing an antioxidant pine pollen peptide by utilizing pine pollen meal. According to the method disclosed by the invention, lots of pine pollen meal residues and wastes are reutilized in the process of preparing aqueous extract of pine pollen, lots of high-quality protein resources in the residuesare fully utilized, and the environment stress is relieved. The prepared pine pollen peptide with antioxidant activity has the characteristics of being high in safety, reasonable in amino acid ratioand the like, and has wide market prospects in the field of foods. The provided preparation method is simple in process and low in reaction temperature, the oxidation resistance of pine pollen proteins can be improved, and the pine pollen peptide prepared under the optimal process condition has a superoxide anion inhibition rate of 18.7%, reaches a DPPH (1,1-diphenyl-2-picryl-hydrazyl) removal rate of 76.8%, reaches a hydroxyl radical inhibition rate of 94.6%, and provides high-quality natural antioxidants for industries of foods, medicines and the like.
Owner:YANTAI NEW ERA HEALTH IND

3D printing photosensitive resin with high precision, low layer thickness and high performance as well as preparation and use methods of 3D printing photosensitive resin

The invention relates to the technical field of 3D printing materials and particularly discloses 3D printing photosensitive resin with high precision, low layer thickness and high performance as wellas preparation and use methods of the 3D printing photosensitive resin. The 3D printing photosensitive resin is prepared from components in percentage by mass as follows: 4.0%-20% of acrylic resin, 4.5%-15.0% of POSS resin, 60%-90% of a diluent, 0.5%-10.0% of a photointiator, 0.05%-2.0% of a free radical inhibitor, 0.05%-2.0% of an ultraviolet absorber, 0.1%-1.5% of a leveling agent and 0.1%-1.0%of a defoaming agent. The 3D printing photosensitive resin has viscosity smaller than or equal to 35 cps at 25 DEG C, has printing precision of 2-4 mu m on XY planes, printing thickness of 2 mu m in the Z-axis direction, transmission depth not larger than 20 mu m and printing tolerance within 25 mu m and is suitable for 3D printing of precision devices.
Owner:BMF NANO MATERIAL TECH CO LTD
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