The invention discloses an enhanced
high electron mobility
transistor and a manufacturing method thereof, which mainly solve the problems of low
threshold voltage and complicated process for realizing high
breakdown voltage in existing
power switching devices, which include: a substrate (1),
Transition layer (2),
barrier layer (3), gate groove (4), drain groove (5), P-type layer (6), P-type drain column (7), gate column (9), source
electrode (11 ), mesa (14), gate (15) and
passivation layer (16). An N-type column column (8) is arranged inside the grid column; an array hole (10) is provided in the
barrier layer on the left side of the grid column and in the
barrier layer on the right side of the P-type drain column; There is an
ohmic contact (12), and the P-type drain column and the
ohmic contact together form a drain (13); a
composite plate (17) is arranged on the upper part of the
passivation layer; and a protective layer (18) is arranged on the periphery of the
passivation layer and the
composite plate. The invention has the advantages of simple process, good forward blocking and reverse blocking, high
threshold voltage, and can be used as a switching device.