161results about How to "Reduce interface stress" patented technology

The invention belongs to the technical field of composite preparation, and particularly relates to a powder metallurgy preparation method of a localization reinforced composite for manufacturing wear-resisting quick-wear parts of mining and building machines. The method comprises the following steps that (1) tungsten carbide powder and titanium carbide powder are used as reinforced particles, reduced iron powder and high-speed steel powder are used as a metal binder, and hard alloy powder is prepared according to a certain proportion; (2) the prepared hard alloy powder is put into a ball mill, and a process control agent is added for ball milling and mixing; and (3) a forming agent is added into the hard alloy powder subjected to uniform ball milling and mixing, and then the steps of mixing, prepressing, smashing, sieving particle making and the like are carried out. In a composite layer of the composite prepared through the method, discontinuous reinforcement areas are uniformly distributed in a continuous matrix area, cracks are not prone to being produced and expanding in the service process of the composite, and strength-toughness matching performance of the composite is achieved well; and the wear resistance of the composite can be obviously improved, and the service life of the composite can be obviously prolonged.

The invention provides a buffer layer for a sulfide solid-state battery. The buffer layer comprises a polymer material and ethylene carbonate, and is formed in situ on an electrode plate through a buffer layer solution; and due to the existence of a polymer, poor physical contact between an electrode and an electrolyte caused by volume deformation of a positive electrode material in a charging/discharging process can be improved. The buffer layer is existent between the positive electrode and the solid electrolyte of the solid-state battery and between the negative electrode and the solid-state electrolyte, so that the solid-solid interface impedance can be reduced; and meanwhile, good ionic conductivity of the buffer layer can improve the lithium ion transmission capacity. The sulfide composite positive electrode in the solid-state battery provided by the invention contains the polymer material, and the existence of the polymer can improve the poor physical contact between the electrode and the electrolyte caused by the volume deformation of the positive electrode material in the charging/discharging process; and meanwhile, the solid-state battery contains the buffer layer, so that the solid-state battery has low interface resistance and high ionic conductivity, and is excellent in capacity and cycling performance.

The invention belongs to the technical field of modification of surfaces of metal materials, and discloses an in-situ non-crystallizing modification method for the surface of a metal material. The method comprises the steps that amorphous alloy components matched with components of a metal matrix material are selected based on the components of the metal matrix material; then, required simple-substance element powder except main elements of a metal matrix is matched according to the amorphous alloy components; after being mixed, the element powder is preplaced on the surface of the metal matrix; laser is adopted to directly irradiate the mixed powder and the metal matrix to melt the mixed powder and the metal matrix and mix the melts; and an amorphous alloy is generated through the in-situ alloying reaction of the mixed element powder and the main elements of the metal matrix under the condition of quick cooling, and an amorphous alloy surface is prepared. According to the method, the interfacial stress of the amorphous alloy surface and the metal matrix is effectively reduced, the thickness of the amorphous alloy surface is increased, and the surface performance of the metal material is remarkably improved; and the amorphous alloy surface prepared through the method is different from an amorphous alloy coating prepared through a traditional method, the amorphous alloy surface is generated through the in-situ alloying reaction on the surface of the metal matrix, the interface bonding is high, and the performance is excellent.

Certain example embodiments relate to vacuum insulating glass units having edge seals formed in connection with solder alloys that, when reactively reflowed, wet metallic coatings pre-coated on the glass substrates' perimeters, and/or associated methods. The alloys may be based on materials that form seals at temperatures that will not de-temper glass and/or decompose a laminate, and/or remain hermetic and lack porous structures in their bulks. Example alloys may be based on inter-metallics of Sn and one or more materials selected from post-transition metals or metalloids; Zintl anions (e.g., In, Bi, etc.) from Group 13, 14, 15, or 16; and transition metals (e.g., Cu, Ag, Ni, etc.); and excludes Pb. Thin film coatings in certain example embodiments work with the solder material to form robust and durable hermetic interfaces. Because low temperatures are used, certain example embodiments can use compliant and visco-elastic spacer technology based on lamellar structures and/or the like.

A thin, freestanding, microporous polyolefin web with good heat resistance and dimensional stability includes an inorganic surface layer. A first preferred embodiment is a microporous polyolefin base membrane in which colloidal inorganic particles are present in its bulk structure. Each of second and third preferred embodiments is a thin, freestanding microporous polyolefin web that has an inorganic surface layer containing no organic hydrogen bonding component for the inorganic particles. The inorganic surface layer of the second embodiment is achieved by hydrogen bonding with use of an inorganic acid, and the inorganic surface layer of the third embodiment is achieved by one or both of hydrogen bonding and chemical reaction of the surface groups on the inorganic particles.

The invention discloses a method for preparing a titanium/diamond-like nanometer multilayer film on a silicon surface. The method concretely comprises the following steps of: drying a monocrystalline silicon substrate subjected to chemical cleaning in advance; putting the dried monocrystalline silicon substrate onto a rotating sample table of a cathode arcing device; performing vacuum pumping; introducing argon gas into a vacuum chamber; performing sputtering cleaning on the surface of the silicon substrate through an ion source; using high-purity metal titanium and graphite as targets, and using a direct current and pulse double-excitation-source cathode plasma discharge technology for respectively preparing a titanium nanometer function layer and a diamond-like film; and performing later-stage vacuum annealing treatment according to needs. The method has the advantages that the preparing process is simple; and the method can be used for preparing the diamond-like nanometer multilayer composite film with different surface structures. The titanium/diamond-like nanometer multilayer film prepared by the method provided by the invention has the advantages of high hardness, low stress and friction-reduction and abrasion-resistant performance.

The invention provides quick repair mortar for a high-speed railway concrete track slab. The quick repair mortar comprises, by mass, 100 parts of cement, 50 to 250 parts of fine aggregate, 5 to 25 parts of a mineral admixture, 0 to 8 parts of soluble latex powder, 0 to 20 parts of a polymer emulsion, 0.1 to 1.0 part of a water reducing agent, 0.2 to 2.0 parts of an expansion component, 0.1 to 1.5parts of a plasticizer, 0.1 to 1.2 parts of an early strength agent, 0.2 to 1.5 parts of a retarding component, 0.1 to 0.5 part of a defoaming agent and 0 to 30 parts of water. The mass parts of the soluble latex powder and the polymer emulsion are not 0 at the same time. The invention further provides a preparation method of the quick repair mortar and an application of the quick repair mortar innon-structural damage repair of ballastless high-speed railway concrete track slabs. The quick repair mortar has the characteristics of good workability, early strength, high strength, high volume stability, good durability and the like.

Methods for fabricating semiconductor memory devices may include forming a first conductive layer for a first electrode on a semiconductor substrate, forming a dielectric layer on the first conductive layer, and forming a second conductive layer for a second electrode on the dielectric layer. Portions of the second conductive layer and the dielectric layer can be removed, and a thermal process can be performed on the second conductive layer and the dielectric layer. The thermal process can reduce interface stress between the second conductive layer and the dielectric layer and/or cure the dielectric layer. In addition, the dielectric layer may be maintained in an amorphous state during and after the thermal process.

The invention discloses a method for printing a combustion chamber lining by using GRCop-42 spherical powder. The GRCop-42 alloy spherical powder comprises the following chemical components in percentage by weight: 2-4wt% of Cu, 2-4wt% of Cr and Nb. The method comprises the following steps of: 1) heating the spherical powder in vacuum, cooling the spherical powder along with a furnace, then performing ultrasonic vibration, screening the spherical powder and preparing to discharge the spherical powder into the furnace; 2) establishing a process model of a part, and slicing the model in layers to form a laser scanning path of each layer; 3) setting process parameters of powder laying and printing equipment, placing a rear bottom plate substrate, and fully laying the GRCop-42 spherical powderin a powder cylinder; 4) starting the equipment and starting printing and forming; 5) after laser scans one layer, descending a forming cylinder by one layer, then ascending the powder cylinder by one layer, laying a layer of copper powder on the processed layer surface by using the powder in the powder cylinder through a scraper, then descending the powder cylinder, and repeating the steps on each layer until the printing of the structure is finished; 6) performing annealing treatment; and 7) cutting and separating the structure from the substrate, and performing sand blasting on the surfaceof the structure. The method solves the problem of domestic application of advanced materials, and meets the preparation requirement of an aerospace copper alloy structure.

A cable termination housing for terminating a cable to one or more devices includes a bore for receiving a device mating portion, a component portion integrally formed within the housing, the component portion having a fastener that is slidable between a retracted position wherein fastener does not extend into the lug aperture of the cable assembly and an extended position wherein the fastener extends into the lug aperture. Preferably, the fastener is rotatable while in its extended position so as to couple with the device mating portion.

A high aperture active matrix liquid crystal display (AMLCD) includes pixel electrodes in respective pixels which overlap adjacent address lines. The color filters are formed on the active substrate in a manner such that the filters also overlap the address lines and function as an insulating layer between the pixel electrodes and address lines in the areas of overlap. Accordingly, line-pixel capacitances are reduced and the resulting AMLCD is easier to manufacture. The total number of process step in manufacturing is reduced, and plate-to-plate (active to passive plate) alignment is much easier and less important.

A solvent-free UV resin and application thereof belong to the technical field of environment-friendly paints. The solvent-free UV resin is composed of, by weight percentage, 20-40% low-viscosity oligomer, 10-20% of bifunctional active diluent, 10-20% of trifunctional active diluent, 20-40% of UV curing hyperbranched polyfunctional monomer, 0.1-0.8% of flatting agent and 2-10% of photoinitiator. The solvent-free UV resin can solve the problem VOC (volatile organic compounds) led by toxic organic solvent in UV curing paints.