213results about How to "Good thermal expansion" patented technology

A method for making a multilayered electronic device with at least one epitaxial layer grown on a single-crystal film bonded to a composite wherein at least one layer is polycrystalline, the method includes the step of bonding a single-crystal film at least one of the epitaxial layers on the single-crystal film wherein thermal coefficients of expansion for the substrate and the epitaxial layer are closely matched.

A low melting point glass consisting essentially of, as represented by mol % based on the following oxides:wherein SnO+ZnO+P2O5+B2O3 is at least 76 mol %, Li2O+Na2O+K2O is from 0 to 9 mol %, MgO+CaO+SrO+BaO is from 0 to 35 mol %, and the molar ratio of SnO to ZnO is less than 1.

A tactile warning surface structure having underfoot detectability is formed in place by a method wherein the shank portions of a plurality pins are inserted into and bonded to a plurality of holes formed in an upper surface of a concrete slab of a walkway. The holes are located within a defined area of the upper surface of the concrete slab and are spaced from each other in a predetermined pattern so that, when the shank portions of the pins are inserted into and bonded to the holes in the concrete slab with the upper end head portions of the pins projecting upward beyond the upper surface of the concrete slab at least a minimum distance, the pins in the defined area of the upper surface of the concrete slab form a tactile warning surface having underfoot detectability.

A titania-doped quartz glass containing 3-12 wt % of titania at a titania concentration gradient less than or equal to 0.01 wt %/μm and having an apparent transmittance to 440 nm wavelength light of at least 30% at a thickness of 6.35 mm is of such homogeneity that it provides a high surface accuracy as required for EUV lithographic members, typically EUV lithographic photomask substrates.

A semiconductor die has through silicon vias arranged to reduce warpage. The through silicon vias adjust the coefficient of thermal expansion of the semiconductor die, permit substrate deformation, and also relieve residual stress. The through silicon vias may be located in the edges and/or corners of the semiconductor die. The through silicon vias are stress relief vias that can be supplemented with round corner vias to reducing warpage of the semiconductor die.

The present invention relates to glass-ceramic proppants which can be used to prop open subterranean formation fractions, as well as other uses. Proppant formulations are further disclosed which use one or more proppants of the present invention. Methods to prop open subterranean formation fractions are further disclosed. In addition, other uses for the proppants of the present invention are further disclosed, as well as methods of making the glass-ceramic proppants.

The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.

A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs which include first fibers that conduct electricity and second fibers that do not conduct electricity, which have the second fibers disposed at positions where plated through holes will pass through, and which are impregnated with resin; a step of forming through holes at positions in the core portion where the second fibers are disposed; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the first fibers and thereby produce a core substrate.

The invention discloses an LCP (Liquid Crystal Polymer) or fluoride polymer high-frequency high-transmission double-sided copper clad laminate which comprises a first copper foil layer, a second copper foil layer, a first very low dielectric glue layer and at least one insulating polymer layer, wherein the first very low dielectric glue layer is positioned between the first and second copper foillayers; the Rz value of the inner surfaces of the first and second copper foil layers is 0.1-1.0 micron; the insulating polymer is at least one of a first LCP polymer layer or a first fluoride polymerlayer; the first very low dielectric glue layer is a glue layer with a Dk value of 2.0-3.5 and a Df value of 0.002-0.010; the first polyimide layer is an insulating polymer layer with a Dk value of 2.20-3.50 and a Df value of 0.002-0.010. The double-sided copper clad laminate and the FPC disclosed by the invention have excellent electrical properties and also have cost advantages, short manufacture procedure processes, low thermal expansion coefficients, stable dk/df performances in high-temperature and humidity environments, ultra-low water absorption rate, excellent UV laser drilling abilities, low rebound, suitableness for high-density assembly and excellent mechanical properties.

The invention discloses a carbon-free ladle brick and a preparation method thereof. The carbon-free ladle brick is prepared by using bauxite chamotte, a corundum raw material, magnesium oxide and alumina micro powder as main raw materials, adding iron oxide, a magnesium chloride solution, sodium hexametaphosphate and canary dextrin, mixing the above-mentioned materials by using special procedures, storing an obtained mixed for 30 min, carrying out compression molding and drying the mixture at a temperature of 200 DEG C for 24 h. According to the invention, iron oxide and alumina micro powder are enabled to exist in gaps between aggregate and powder and form hercynite with a low thermal expansion coefficient at a medium-high temperature, and no excess iron oxide enters into a matrix, which enables the ladle brick to have good high temperature stability and anti-stripping performance; therefore, the problem that molten steel carburetting caused by high temperature melting loss of a refractory brick influences smelting quality is overcome, and the prepared carbon-free ladle brick has excellent performances of high strength, washing resistance, a long service life, etc.

An aluminum-doped zinc oxide (AZO) thin film (200), a preparation method thereof, and a micro electro mechanical system (MEMS) device comprising same. The AZO thin film (200) is formed on a substrate (100), the aluminum dosage concentration of the AZO thin film (200) being increased gradually in the thin film thickness direction; in the preparation method, the AZO thin film (200) is prepared by using a sol-gel method; the MEMS device uses the AZO thin film (200) and form a composite thin film layer (300) on the AZO thin film (200) through chemical vapor deposition filming. The AZO thin film (200) has desirable conductivity, has good lattice matching with the composite thin film layer (300), has matched thermal expansion and low cost, and is nontoxic, pollution free, and simple in preparation.

An adhesive layer is interposed between a head slider and a support member for fixing the head slider to the support member. A deformation body is interposed between the head slider and the support member. The deformation body has a coefficient of thermal expansion larger than that of the adhesive layer. The deformation body expands in response to rise in temperature. An internal force is induced in the head slider so as to distance the head slider away from the support member. Since the adhesive layer serves to fix the head slider to the support member, the internal force is transformed into stress in the head slider. The thermal expansion induces stress in the head slider in response to the rise in temperature. The stresses are balanced with each other, so that the head slider is prevented from deformation.

The invention discloses a method for printing a combustion chamber lining by using GRCop-42 spherical powder. The GRCop-42 alloy spherical powder comprises the following chemical components in percentage by weight: 2-4wt% of Cu, 2-4wt% of Cr and Nb. The method comprises the following steps of: 1) heating the spherical powder in vacuum, cooling the spherical powder along with a furnace, then performing ultrasonic vibration, screening the spherical powder and preparing to discharge the spherical powder into the furnace; 2) establishing a process model of a part, and slicing the model in layers to form a laser scanning path of each layer; 3) setting process parameters of powder laying and printing equipment, placing a rear bottom plate substrate, and fully laying the GRCop-42 spherical powderin a powder cylinder; 4) starting the equipment and starting printing and forming; 5) after laser scans one layer, descending a forming cylinder by one layer, then ascending the powder cylinder by one layer, laying a layer of copper powder on the processed layer surface by using the powder in the powder cylinder through a scraper, then descending the powder cylinder, and repeating the steps on each layer until the printing of the structure is finished; 6) performing annealing treatment; and 7) cutting and separating the structure from the substrate, and performing sand blasting on the surfaceof the structure. The method solves the problem of domestic application of advanced materials, and meets the preparation requirement of an aerospace copper alloy structure.