The invention discloses a plasma etching remainder detergent, which contains fluoride, organic amine, a solvent and water. The detergent has strong washing capability, can effectively remove plasma etching remainder on a metal wire (Metal), a channel (Via) and a metal pad (Pad) wafer, has smaller etching speed to non-metal materials (such as SiO2, ion enhanced tetraethoxy silane silicon dioxide (PETEOS), silicon, low dielectric material and the like), partial metal materials (such as Ti, Al and Cu) and so on, can be used for batch immersion type cleaning mode, batch rotation spray type cleaning mode and uniwafer rotation type cleaning mode, has larger operation window, and has excellent application prospect in semiconductor wafer cleaning and other micro-electronic fields.