The invention provides a surface
plasma ultra-
diffraction photoetching method based on a tip-insulator-
metal (TIM) structure. The surface
plasma ultra-
diffraction photoetching method is characterized in that a TIM
resonant cavity structure is formed by tip-insulator-
metal, a light is emitted in a substrate containing the
resonant cavity in a normal incidence manner, a probe tip of a probe stimulates local surface plasmas (LSP), the
waves of the stimulated local surface plasmas are reflected and coupled by a
metal reflection layer in a downward attenuation propagation process and reflected for multiple times to cause
resonance and form relatively-uniformly-distributed regular circular
light spot modes in a longitudinal distribution manner in a medium
recording layer clamped between a metal reflection layer and the probe. According to the surface
plasma ultra-
diffraction photoetching method based on the tip-insulator-metal structure, the problem that the write-through photoetching depth of a conventional probe is shallow is solved, the sizes of the light spots (
full width at half maximum, FWHM) at different depths of the medium
recording layer are identical, and the energies are uniform. According to the surface plasma ultra-diffraction photoetching method, the quality of the
light spot photoetched by the conventional write-through probe is greatly improved; the structure adopted by the method is simple; and the photoetching
line width can be greatly reduced.