46results about How to "Excellent anti-vulcanization performance" patented technology

The present invention discloses a chromium-free passivation liquid for treating a tin-plated steel plate, wherein the pH value of the chromium-free passivation liquid is 3-4. The chromium-free passivation liquid comprises an inorganic compound containing at least one selected from silicon, titanium and zirconium, a metal compound containing at least one selected from aluminum, vanadium, manganese, cobalt, nickel and molybdenum, a soluble resin, an acid for adjusting the pH value of the passivation liquid to 3-4, and the balance of water and other unavoidable impurities, wherein the contents of silicon, titanium and zirconium are 0.1-20 g / L, the contents of aluminum, vanadium, manganese, cobalt, nickel and molybdenum are 0.1-20 g / L, and the soluble resin content is 0.1-20 g / L. The tin-plated steel plate treated by the chromium-free passivation liquid obtained with the technical scheme has characteristics of excellent corrosion resistance, excellent sulfurization resistance, excellent coating material adhesion and excellent processability.

The invention relates to silica gel for white-light LED package, and belongs to the technical field of material chemistry. The silica gel for the white-light LED package comprises a component A and a component B based at the mass ratio of 1: (1-10), wherein the component A is prepared from methylphenyl vinyl silicone resin, methylphenyl vinyl silicone oil, a tackifier and a catalyst; and the component B is prepared from methylphenyl vinyl silicone resin, methylphenyl hydrosilicone resin, an inhibitor and an inorganic filler. The silica gel for the white-light LED package is high in transparence; fluorescent powder is uniformly dispersed during use; the color-temperature concentration ratio after curing is high; and the sulfidation resistance is high.

The invention relates to an addition curing type silicon compound, an optical element sealing material and a semiconductor device. The addition curing type silicon compound at least comprises (A) chemical compounds represented in the formula (1), (B) organic silicon compounds with each molecule having at least two hydrogen atoms bonded on silicon. The organic silicon compound comprises no fatty group unsaturated bases. The compound in the invention further comprises (C) a hydrosilylation catalyst which comprises platinum group metals. The organic silicon compound is enough to make the compound in the invention cured when the hydrosilylation catalyst is present. The invention further provides an addition curing type silicon resin compound which has excellent vulcanization resistance and higher light emitting efficiency during an optical purpose.

A silver alloy bonding wire is characterized by containing, by weight, 3.5-10% of Au, 1-5% of Pd, 2-500 ppm of micro-additive element, and the balance Ag, and the micro-additive element is the combination of one or more than two of the Ca, Cu, Be, In, Si and Ge. The present invention also provides a manufacturing method of the above silver alloy bonding wire. The silver alloy bonding wire of the present invention has the following beneficial effects that (1) the anti-sulfur performance is excellent; (2) the anti-aging performance is excellent, the reliability of a packaged product in a thermalshock test is improved, and on the equal aging conditions (-40 DEG C to 100 DEG C), the silver alloy bonding wire of the present invention can bear 200-250 rounds of thermal shock, but the conventional silver alloy bonding wire only can bear 100 rounds of thermal shock; (3) a routing window is large and has the good operability; (4) an FAB hot bulb is good, a slider does not exist, the bond strength of a welding spot is large, and the reliability is high.

An aluminum-based dusty core wire, belonging to the hot spraying field of surface project, mainly applies in the working environment of high temperature and corrosiveness. The provided aluminum-based dusty core wire is characterized in that aluminum strip is used as the shell of dusty core wire, and Fe, Ni and Ti metal powder are added into dusty core, the weight ratio being: 40-60% Al, the rest being one of Fe, Ni and Ti metal powder or the random combination of them. Said aluminum-based dusty core wire is adding 0-5% B and 0-3% rare-earth (RE) by weight into dusty core. Experimental study of oxidation and corrosion expresses that the oxidation resistance and resistance to corrosion of aluminum-based coating prepared with aluminum-based dusty core wire are appreciable more excellent than those of the ferrum-based coating prepared with ferrum-based dusty core wire, and equal to the 45CT coating generally recognized that the oxidation resistance and resistance to corrosion are excellent. It provides an effective measure to solving the problem of corrosion and protection in the industry of petrochemistry, energy source, mechanics, and aerospace.

The invention discloses a method for preparing aperture grads FeAl metal intermetallic compound Homogeneous filtering membrane, which adopts Fe and Al element powder of component matching and particle size matching. By the way of die pressing and isostatic cool pressing, make out platy or tubular filtering adobe, then adopts the way of magnetron sputtering, ion plating or vacuum evaporation to plate a layer of metal Al membrane and a layer of metal Fe membraqne on one surface of the filtering adobe evenly, and also adopts the way of non pressure sintering, prepare FeAl metal intermetallic compound homogeneous filtering membrane finally. The method doesn't need adding pore former during preparing process, lowers energy consumption almost without pollution. The prepared filtering membrane has good antioxidation performance, antisulfuration performance and anticorrosion performance, which increase the service life of inorganic membrane and can be widely used in strict environment field, in particular the filtering, separating, purifying and contracting in high temperature, strong corrosion and sulfuration environment filed.

The invention discloses a method for casting a large silver alloy buddha statue by use of a gypsum mold. The method can manufacture the large silver alloy buddha statue with smooth and compact surface and vivid appearance through the steps of preparation of the gypsum mold, drying and roasting of the gypsum mold, smelting of silver alloy, casting and the like. Rare earth elements are added to enable the silver alloy material to have good chemical stability such as vulcanization resistance, smoke and dust resistance, automobile exhaust gas pollution resistance, salt-spray corrosion resistance, color change resistance and the like, and the silver alloy material also has good casting and welding performances, has wide application prospect in the aspects of jewelry, decoration, building and everyday life of people and the like, and is harmless to the environment and human body; the gypsum mold casting process is adopted to cast the large silver alloy buddha statue successfully; and the gypsum mold and the roasting process can completely meet the casting requirement of art crafts such as large complex silver ornaments and silver sculptures.

The invention provides a gold alloy bonding wire and further provides a manufacturing method of the gold alloy bonding wire. The gold alloy bonding wire is characterized in that the gold alloy bondingwire comprises, by weight, 0.5-2% of Pd, 15-30% of Ag, 0.5-3% of Cu, 0.1-2% of Pt, 2-200 ppm of a minor additive element and the balance gold, wherein the minor additive element is one or two or moreof Ca, In, Co, Be, Ga, Mg, Ce and Ni. The gold alloy bonding wire has excellent high reliability and sulfidation resistance, high tensile strength and good welding spot connectivity, and can lower the cost.

The invention relates to a gold alloy bonding wire which is characterized by comprising, by weight, 2.1%-8% of Pd, 20%-30% of Ag, 2.1%-6% of Pt, 2-200 ppm of trace additive elements and the balance gold. The trace additive elements are a combination of one or more than two of Ca, In, Co, Be, Ga, Mg, Ce and Ni. The invention further comprises a manufacturing method of the above gold alloy bonding wire. The gold alloy bonding wire has the excellent strength of extension, is suitable for packaging of low wire arcs and high wire arcs, and meanwhile is high in vulcanization resistance and reliability and low in cost.

The invention discloses a silver alloy bonding wire. The silver alloy bonding wire is characterized by comprising the following components including, by weight:, 0.1-2% of Au, 0.1-3% of Pd, 1-7000 ppmof race additive elements, and the balance Ag, and the race additive elements are one or more than two of the combinations of Ca, Cu, Be, In and Ge. The invention further provides a manufacturing method for the silver alloy bonding wire. The silver alloy bonding wire has the following beneficial effects that (1) the anti-vulcanization performance is excellent; (2) the anti-aging performance is excellent, and the reliability of the packaging products in the thermal impact test is improved; (3) the electrical resistivity is low (as low as 2.0 0 microhms-cm); (4) a line operation window is largeand has excellent operation performance; and (5) the FAB ball burning is excellent, no ball sliding exists, the welding point bonding strength is high, and the reliability is high.

The invention discloses a method for preparing a thread anti-seizure coating by adopting an unbalanced magnetron sputtering technology. The method comprises the steps of 1, polishing and cleaning bolts; 2,carrying out a sand blasting treatment on the bolts; 3, arranging a Ni target, a Ag target and a Pd target on a plurality of independent targets on an unbalanced magnetron sputtering device, theunbalanced magnetron sputtering technology is adopted on the surface of the bolts to obtain a depositional Ni transition layer; 4, and adopting the unbalanced magnetron sputtering technology to continuously deposit an AgPd coating on the depositional Ni transition layer, and finally the thread anti-seizure coating is formed by the depositional Ni transition layer and the AgPd coating. According to the invention, the problem of seizure failure occurring in the dismounting and locking processes of bolts is solved, and the Ag in the AgPd coating located on the surface layer has good ductility and lubricity, and the heat stability of the coating is improved after the Pd is added, meanwhile, the AgPd composite coating has good oxidation resistance and relatively high hardness, so that the comprehensive performance of the coating is improved.

The object of the present invention is to provide a silver plated and / or a silver alloy plated article with high productivity, high reflectance in the visible light range, and excellent sulfidizing resistance. The present invention provides a silver electroplated and / or silver alloy electroplated article having an oxidation layer on its surface, wherein a silver plating layer and / or silver alloy plating layer is formed on a substrate by silver electroplating and / or silver alloy electroplating, and then subjected to oxidation treatment to form an oxidation layer on the surface thereof. The thickness of the oxidation layer formed on the surface of the plating layer is 0.05 μm or more.

The invention relates to a silver alloy bonding wire. The silver alloy bonding wire contains 11 to 30% of Au by weight, 0.1 to 10% of Pd by weight, 2 to 1000 ppm of a trace addition element, and the balance of Ag; the trace addition element is one element or a combination of two elements selected from Ca, Cu, Be, In, Si, Pt, and Ge. The present invention also provides a manufacturing method of thesilver alloy bonding wire. The silver alloy bonding wire of the invention has the advantages of excellent vulcanization resistance, excellent anti-aging property, excellent FAB burning, no ball slip,high bonding strength of welding points and high reliability. The silver alloy bonding wire can improve the reliability of a packaged product in a thermal shock test and can withstand 250 to 300 rounds of thermal shock under the same aging condition (-40 DEG C to 100 DEG C). During FAB burning, a nitrogen-hydrogen mixture gas of which the gas flow rate ranges from 0.3 to 0.6 L / min can be introduced or not introduced; and the use of the nitrogen-hydrogen mixture gas can be omitted with cost and safety considered.

The invention discloses a UV-LED packaging adhesive which is prepared by mixing a component A and a component B according to a mass ratio of 1:1; the component A includes the following components in parts by mass: 90-98 parts of adamantyl-containing methyl vinyl silicone resin, and 0.01-0.5 part of a platinum catalyst; the component B includes the following components in parts by mass: 30-50 partsof adamantyl-containing methyl vinyl silicone resin, and 50-70 parts of adamantyl-containing methyl hydrogenated silicone oil. The adamantyl-containing methyl vinyl silicone resin with special average molecular formula and the adamantyl-containing methyl hydrogen silicone oil with special average molecular formula are selected as base adhesives, and the packaging adhesive is obtained by reactionunder the catalysis of a platinum catalyst. Compared with the prior art, the packaging adhesive has the advantages of high refractive index, good vulcanization resistance and excellent ultraviolet resistance.

The invention discloses a stacked capacitor comprising a plurality of laminated single cells, a positive electrode lead-out terminal and a negative electrode lead-out terminal, wherein the positive electrode lead-out terminal and the negative electrode lead-out terminal are electrically connected to the single cells. Each single cell includes a positive electrode terminal, a negative electrode terminal, and a shielding rubber line positioned between the positive terminal and the negative terminal; the negative electrode terminals of all the single cells are connected together and connected tothe negative electrode lead-out terminal; the positive electrode terminals of all the single cells are connected together and connected to the positive electrode lead-out terminal; the negative electrode terminal of each single cell comprises a dielectric film, a solid electrolyte layer, a carbon paste layer and a silver paste layer that are orderly wrapped on a surface of a positive electrode foil; outer surfaces of the plurality of single cells are sealed and packaged with insulating resin layers, and the stacked capacitor further includes an anti-sulfuration protection framework which is arranged close to the negative electrode lead-out terminal and used for preventing sulfur and sulfide from contacting with the silver paste layer. The stacked capacitor provided in the present inventionis good in anti-sulfuration effect and high in reliability.

A silver alloy bonding wire with a flash plating layer is characterized by comprising a silver alloy core wire and the flash plating layer wrapping the silver alloy core wire. The flash plating layer is made of Au or Pd, and the thickness of the flash plating layer is 1-10 nm. The invention further provides a manufacturing method of the silver alloy bonding wire with the flash plating layer. The silver alloy bonding wire has the following beneficial effects that (1) the anti-vulcanization performance and the anti-oxidation performance are excellent; (2) the proportion of the first-welding sliding ball is extremely low, and the sphericity and the operability both meet the requirements.

Provided in the invention is a gold alloy composite bond wire having a gold coating layer. The gold alloy composite bond wire comprises a core wire and a gold coating layer coating the outside of thecore wire. The core wire includes, by weight, 25 to 49% of Ag, 0.2 to 0.5% of Pd, 0.5 to 2% of In, 2 to 200 ppm of a micro adding element, and the balance being gold. The micro adding element is one of or combination of Ca and Be. The thickness of the gold coating layer is 20 to 200 nm. In addition, the invention also provides a manufacturing method of the gold alloy composite bond wire having a gold coating layer. According to the gold alloy composite bond wire, the anti-oxidation and anti-vulcanization performances of the wire rod are improved effectively; the secondary-welding tensile forceand the primary-welding tensile force are strengthened; the welding wire operationality of the gold alloy is enhanced effectively; the adhesion property among the wire rod, the chip and the substrateis enhanced; the trust performance is improved; and the cost is lowered.

A light emitting device includes a light emitting element, a substrate which contains a conductive member containing silver having the light emitting element mounted, and a sealing member which covers the light emitting element, and the sealing member is made of a cured silicone composite containing the following components (A), (B), (C), and (D):(A) an organopolysiloxane containing at least two alkenyl groups each bonded to a silicon atom per one molecule;(B) an organohydrogenpolysiloxane containing at least two hydrogen atoms each bonded to a silicon atom per one molecule;(C) a hydrosilylation catalyst; and(D) a zinc silanolate represented by the following formula (1):In the formula (1), R1 to R7 each independently represent a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 10 carbon atoms, which may be substituted by a fluorine atom, or each independently represent a hydroxy group or an alkoxy group; and m represents an integer of 1 or greater.

The invention discloses an anti-vulcanization bonding silver wire. The surface of the bonding silver wire is coated with an anti-vulcanization coating. The anti-vulcanization coating comprises the following components in percentage by weight: 1-35% of rosin, 1-35% of epoxy resin, 1-25% of ozokerite and 1-50% of polystyrene. According to the preparation method of the anti-vulcanization bonding silver wire, the bonding silver wire of a wire drawing finished product is coated with the coating liquid before being transferred to an annealing procedure, then annealing and drying are conducted, and the bonding silver wire with the anti-vulcanization coating is obtained. The bonding silver wire has the characteristics of resisting vulcanization, improving the quality of the bonding silver wire and the like.

The invention provides a high-anti-recovery silver alloy for jewelry. The high-anti-recovery silver alloy comprises the following elements, by weight percentage, 1-8% of copper, 0-6% zinc and 0.1-1.5%of nickel and the balance silver, a part of nickel combines with copper and / or zinc to form a metal compound, the metal compound wraps another part of nickel to form a quincunx product to be dispersed in a matrix with silver as the main body; and a part of nickel and copper and / or zinc form copper nickel, zinc nickel, zinc copper, copper zinc nickel and other metal compounds and then wrap another part of nickel to form quincunx products to be dispersed in a silver matrix system, and the metal compounds improve the anti-recovery performance of the silver alloy by changing the electrochemical properties of the silver alloy. According to the high-anti-recovery silver alloy for jewelry, the jewelry made of the silver alloy has high anti-recovery performance, and the anti-recovery performance cannot decrease along with scraping of the jewelry.

The invention relates to a preparation method of a tin and silver composite plating layer with high reflectivity, and belongs to the technical field of semiconductor illumination. The preparation method comprises the following steps of (1) electrically depositing a tin plating layer onto the surface of a copper substrate by tin sulfate and concentrated sulfuric acid; (2) electrically depositing asilver plating layer onto the surface of the tin plating layer by a nicotinic acid system; (3) annealing the obtained tin and silver composite plating layer, and enabling tin and silver atoms to disperse in a tin and silver solid-solid interface, so as to obtain an Ag3Sn thin film with high reflectivity. The preparation method has the advantages that after annealing, the plating layer is uniformlydistributed; the bonding strength between the plating layers is improved; the Ag3Sn thin film is formed at the surface of the plating layer, so that an HRBE (high reflective back electrode) with highreflectivity and excellent antioxidation property and sulfurizing property is obtained.

The invention discloses a silver alloy bonding wire. The silver alloy bonding wire is characterized by comprising the following components including, by weight:, 0.1-2% of Au, 0.1-3% of Pd, 1-7000 ppmof race additive elements, and the balance Ag, and the race additive elements are one or more than two of the combinations of Ca, Cu, Be, In and Ge. The invention further provides a manufacturing method for the silver alloy bonding wire. The silver alloy bonding wire has the following beneficial effects that (1) the anti-vulcanization performance is excellent; (2) the anti-aging performance is excellent, and the reliability of the packaging products in the thermal impact test is improved; (3) the electrical resistivity is low (as low as 2.0 0 microhms-cm); (4) a line operation window is largeand has excellent operation performance; and (5) the FAB ball burning is excellent, no ball sliding exists, the welding point bonding strength is high, and the reliability is high.

A silver alloy bonding wire is characterized by containing, by weight, 3.5-10% of Au, 1-5% of Pd, 2-500 ppm of micro-additive element, and the balance Ag, and the micro-additive element is the combination of one or more than two of the Ca, Cu, Be, In, Si and Ge. The present invention also provides a manufacturing method of the above silver alloy bonding wire. The silver alloy bonding wire of the present invention has the following beneficial effects that (1) the anti-sulfur performance is excellent; (2) the anti-aging performance is excellent, the reliability of a packaged product in a thermalshock test is improved, and on the equal aging conditions (-40 DEG C to 100 DEG C), the silver alloy bonding wire of the present invention can bear 200-250 rounds of thermal shock, but the conventional silver alloy bonding wire only can bear 100 rounds of thermal shock; (3) a routing window is large and has the good operability; (4) an FAB hot bulb is good, a slider does not exist, the bond strength of a welding spot is large, and the reliability is high.

The invention relates to silver alloy and a preparation method thereof. The silver alloy is composed of, by weight, 93.5-99.6% of silver, 0.1-2% of magnesium, 0.1-2% of aluminum, 0.1-2% of manganese and 0.1-5% of yttrium. The elongation at break of the silver alloy is larger than 47%, the Vickers hardness after cold work is subjected to plastic deformation is larger than or equal to 53%, and the silver alloy is invariant in color within at least 72 hours when placed in an Na2S water solution of 0.1 M under room temperature. The silver alloy has high ductility and cold hardening, the metallic luster of the silver alloy can be kept for a long term under a sulfuration atmosphere condition after being subjected to thermal refining, and the silver alloy has good anti-sulfuration performance andbroad application prospects.

The invention discloses a polyisobutylene composition with improved gas barrier property, which comprises an alkenyl-terminated polyisobutylene low polymer, a phenyl-containing organic-group hydrosilane crosslinking agent, and a catalyst capable of completely curing the composition at preset temperature and / or under lighting conditions. At least one component in the composition is fluid; and the at least one component can be uniformly mixed with the rest components in the composition, so that the composition is fluid. The invention also discloses application of the polyisobutylene composition. The polyisobutylene composition has the characteristics of favorable flowability, favorable stability, long shelf life and the like, and is easy to use and suitable for storage and transportation. The curing product has pleasantly surprised optical transparency and excellent air tightness, and especially has the anti-vulcanization property which much exceeds the existing like materials. The polyisobutylene composition has favorable comprehensive mechanical properties, and has wide application prospects.

The invention discloses a method for preparing a thread anti-seizure coating by adopting an unbalanced magnetron sputtering technology. The method includes: 1. polishing and cleaning the bolts; 2. sandblasting the bolts; , Ag target and Pd target are respectively placed on multiple independent target positions of the unbalanced magnetron sputtering equipment, and the unbalanced magnetron sputtering technology adopts the deposition of Ni transition layer on the surface of the bolt: 4. Using the unbalanced magnetron sputtering technology Continue to deposit the AgPd coating on the Ni transition layer, and finally the thread anti-seizure coating is composed of the Ni transition layer and the AgPd coating. The invention solves the problem of galling failure occurring in the process of disassembling, assembling and locking bolts, wherein the Ag in the AgPd coating on the surface layer has good ductility and lubricity, and the thermal stability of the coating is improved after adding Pd, At the same time, the AgPd composite coating has good oxidation resistance and high hardness, and the comprehensive performance of the coating can be improved.