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A kind of high anti-sulfur silver plating solution and using method thereof and high anti-sulfur silver plating layer

A high-sulfur-resistant and silver-plated technology, applied in the field of high-sulfur-resistant silver-plated layer and high-sulfur-resistant silver-plated solution, can solve the problem that the sulfur-resistant performance is difficult to meet the requirements, etc.

Active Publication Date: 2021-09-10
STATE GRID JIANGXI ELECTRIC POWER CO LTD RES INST +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the anti-sulfur properties of the above silver plating solutions have been improved, with the development of industry, their anti-sulfur properties are difficult to meet the requirements.

Method used

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  • A kind of high anti-sulfur silver plating solution and using method thereof and high anti-sulfur silver plating layer
  • A kind of high anti-sulfur silver plating solution and using method thereof and high anti-sulfur silver plating layer
  • A kind of high anti-sulfur silver plating solution and using method thereof and high anti-sulfur silver plating layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] surface treatment

[0050] Grinding: first use 800-mesh sandpaper for rough grinding, and then use 1000-mesh sandpaper for fine grinding.

[0051] Strong alkali chemical degreasing: Table 1-1 shows the strong alkali degreasing process.

[0052] Table 1-1 strong alkali degreasing process table

[0053] Element content unit NaOH 60 g / L Operating temperature 20 ℃ time 1 h

[0054] Pickling: The copper substrate after strong alkali chemical degreasing is first rinsed with distilled water, then soaked in the pickling solution, and then taken out. Table 1-2 is the pickling process table.

[0055] Table 1-2 is the pickling process table

[0056] Element content unit HNO 3

300 g / L Operating temperature 20 ℃ time 20 s

[0057] pre-silvered

[0058] Put the treated copper substrate into the silver plating liquid for pre-silver plating. Table 1-3 is the pre-silvering process table.

[0059] T...

Embodiment 2

[0071] surface treatment

[0072] Grinding: first use 800-mesh sandpaper for rough grinding, and then use 1000-mesh sandpaper for fine grinding.

[0073] Strong alkali chemical degreasing: Table 2-1 shows the strong alkali degreasing process.

[0074] Table 2-1 strong alkali degreasing process table

[0075] Element content unit NaOH 60 g / L Operating temperature 20 ℃ time 1.5 h

[0076] Pickling: The copper substrate after strong alkali chemical degreasing is first rinsed with distilled water, then soaked in the pickling solution, and then taken out. Table 2-2 is the pickling process table.

[0077] Table 2-2 is the pickling process table

[0078] Element content unit HNO 3

300 g / L Operating temperature 20 ℃ time 30 s

[0079] pre-silvered

[0080] Put the treated copper substrate into the silver plating liquid for pre-silver plating. Table 2-3 is the pre-silvering process table.

[0081]...

Embodiment 3

[0093] surface treatment

[0094] Grinding: first use 800-mesh sandpaper for rough grinding, and then use 1000-mesh sandpaper for fine grinding.

[0095] Strong alkali chemical degreasing: Table 3-1 shows the strong alkali degreasing process.

[0096] Table 3-1 strong alkali degreasing process table

[0097] Element content unit NaOH 60 g / L Operating temperature 20 ℃ time 1.2 h

[0098] Pickling: The copper substrate after strong alkali chemical degreasing is first rinsed with distilled water, then soaked in the pickling solution, and then taken out. Table 3-2 is the pickling process table.

[0099] Table 3-2 is the pickling process table

[0100] Element content unit HNO 3

300 g / L Operating temperature 20 ℃ time 35 s

[0101] pre-silvered

[0102] Put the treated copper substrate into the silver plating liquid for pre-silver plating. Table 3-3 is the pre-silvering process table.

[0103]...

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Abstract

The invention provides a silver plating solution with high sulfur resistance performance, including AgNO 3 25~40g / L, KI 370~420g / L, K 2 CO 3 1~5g / L,K 2 C 2 o 4 1~5g / L and water, and Cu(NO 3 ) 2 ·3H 2 O, C 25 h 22 Au 2 Cl 2 P 2 , Al[CH 3 (CH 2 ) 16 CO 2 ] 3 , (NH 4 ) 2 Mo 2 o 7 、Na 3 o 40 PW 12 ·xH 2 O, ZnI 2 and NiI 2 At least two of the In the silver plating solution provided by the present invention, metal ions such as copper, gold, aluminum, molybdenum, tungsten, zinc or nickel can be compounded into the silver plating layer through compounding of multi-metal ions in the silver plating process to form new composite oxides surface layer, thereby improving the anti-sulfurization performance of the silver plating surface. Experimental result shows, coating provided by the present invention is in 5% Na 2 The change in contact resistance of S after soaking for 5 days was small.

Description

technical field [0001] The invention belongs to the field of composite electroplating, and in particular relates to a high-sulfur-resistant silver-plating solution, a method for using the same, and a high-sulfur-resistant silver-plated layer. Background technique [0002] The southeast coastal area of ​​my country belongs to the high-temperature, high-humidity and high-salt atmospheric environment, coupled with the development of industry, the atmospheric environment of the substation in this area is harsh, and the corrosion and failure of conductor materials are very serious. There are serious corrosion and failure problems in the silver-plated layer of electrical contacts for high-voltage disconnectors. Corrosion has seriously threatened the service safety of high-voltage isolating switches, circuit breakers and other equipment. The main reason is that the silver-plated layer of electrical contacts is vulcanized in a high-temperature, high-humidity, and high-salt atmospher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/64C25D5/10
CPCC25D3/64C25D5/10
Inventor 周宇裴锋陈文刘欣田旭叶志国贾蕗路周友武
Owner STATE GRID JIANGXI ELECTRIC POWER CO LTD RES INST
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