Copper alloy wire with plating on surface and manufacturing method thereof

A technology of copper alloy wire and manufacturing method, which is applied in the field of bonding wire, can solve the problems of poor aging resistance, high temperature and high humidity resistance, reliability needs to be improved, and insufficient oxidation resistance, so as to improve oxidation resistance, Improves oxidation resistance and sulfidation resistance, and enhances the effect of welding wire workability

Pending Publication Date: 2019-02-26
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pure copper wire has good workability and low cost, but poor aging resistance, high temperature and high humidity resistance, and low reliability
Palladium-plated gold-plated copper wire includes a core wire, a palladium pre-plating layer coated on the outside of the core wire, and a gold cladding layer coated on the outside of the palladium pre-plating layer. The core wire is made of pure copper; the anti-aging performance of the palladium-plated gold-plated copper wire Compared with pure copper wire, the high temperature and high humidity resistance has been improved, but the oxidation resistance is still insufficient, and its reliability still needs to be improved.

Method used

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  • Copper alloy wire with plating on surface and manufacturing method thereof
  • Copper alloy wire with plating on surface and manufacturing method thereof
  • Copper alloy wire with plating on surface and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097]The copper alloy wire with coating on the surface of the present embodiment comprises a core wire and a coating coated on the outside of the core wire; the core wire contains 0.8% by weight of Ag, 500ppm of Ca, 400ppm of In, and the balance is copper; the coating It is a composite coating. The composite coating is composed of a palladium coating coated on the outside of the core wire and a gold coating coated on the outside of the palladium coating. The thickness of the palladium coating in the composite coating is 100 nm, and the thickness of the gold coating is 50 nm.

[0098] The above-mentioned manufacturing method of the copper alloy wire with plating layer on the surface comprises the following steps:

[0099] (1) Melting and casting: Adding Ag, Ca and In to the copper raw material in proportion, after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0100] (2) Wire drawing: draw the wire obtained in step...

Embodiment 2

[0122] The copper alloy wire with a coating on the surface of this embodiment includes a core wire and a coating coated on the outside of the core wire; the core wire contains Ag 3%, Ca 150ppm, In 150ppm, Ge 300ppm by weight, and the balance is copper; The coating is a composite coating, and the composite coating is composed of a palladium coating coated on the outside of the core wire and a gold coating coated on the outside of the palladium coating. The thickness of the palladium coating in the composite coating is 200 nm, and the thickness of the gold coating is 10 nm.

[0123] The above-mentioned manufacturing method of the copper alloy wire with plating layer on the surface comprises the following steps:

[0124] (1) Melting and casting: Ag, Ca, In and Ge are added to the copper raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0125] (2) Wire drawing: drawing the wire obtain...

Embodiment 3

[0147] The copper alloy wire with coating on the surface of the present embodiment comprises a core wire and a palladium coating coated on the outside of the core wire; the core wire contains Ag 1.2%, Ca 200ppm, In 200ppm, Ge 300ppm by weight, and the balance is copper ; The thickness of the palladium coating is 300nm.

[0148]The above-mentioned manufacturing method of the copper alloy wire with plating layer on the surface comprises the following steps:

[0149] (1) Melting and casting: Ag, Ca, In and Ge are added to the copper raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0150] (2) Wire drawing: drawing the wire obtained in step (1) to obtain a core wire with a diameter of 200um;

[0151] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the core wire, and N is used during the annealing process. 2 As the annealin...

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Abstract

The invention provides a copper alloy wire with a plating on the surface. The copper alloy wire comprises a core wire and the plating which coats the outer surface of the core wire. The core wire comprises, by weight, 0.1 to 3% of Ag, 460 to 1000 ppm of trace addition element, and balance of copper. The trace addition element is one or the combination of two or more of Ca, Be, In and Ge. The plating is a gold plating, a palladium plating or a composite plating. Compared with the prior art, the copper alloy wire with the plating on the surface, which is provided by the invention, has the advantages that (1) a product has strong resistance to humidity under high temperature, high humidity and high pressure after routing, and the adhesion of a solder joint and a pad is great; (2) oxidation resistance is great; (3) anti-aging performance is great; (4) the wire has excellent workability and reliability; (5) the wire has suitable wire hardness, and the arc height of routing is greatly reduced; and (6) when IC routing is carried out, a welding electrode is not cracked and damaged; and (7) the wire can provide great bonding.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a copper alloy wire with a plated layer on the surface and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C9/00C22F1/02C22F1/08
CPCC22C9/00C22F1/02C22F1/08H01L21/4889H01L21/4892H01L21/4896H01L23/49
Inventor 周振基周博轩麦宏全王贤铭于锋波
Owner NICHE TECH KAISER SHANTOU
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