73results about How to "Improve anti-sulfur performance" patented technology

The invention relates to a high-refractive-index organosilicon material for light-emitting diode (LED) packaging and a preparation method of the high-refractive-index organosilicon material. The technical scheme includes that according to a formula ration, three materials of a phenyl vinyl silicone resin, a phenyl hydrogen silicone resin and nano silicon dioxide (particle size distribution 5-15nm) which is treated by a silane coupling agent are placed in a 2L internal mixer to be internally mixed for one hour, then a platinum catalyst with a platinum content of 200-1000ppm is added to a nitrogen atmosphere, internal mixing is performed for 10 minutes again, finally, an alkynol compound is added, and internal mixing is continuously performed for 10 minutes to obtain the high-refractive-index organosilicon material. Compared with existing high-refractive-index organosilicon materials for LED packaging, the high-refractive-index organosilicon material for LED packaging is higher in drawing strength and larger in cohesive force under the condition of the same refractive index and light transmittance.

The invention relates to a trifluoropropyl-group-modification methyl phenyl vinyl silicon resin. The general molecular formula of the trifluoropropyl-group-modification methyl phenyl vinyl silicon resin is (R13SiO0.5)a(R12SiO)b(R1SiO1.5)c, wherein R1 is Me, Vinyl, Ph and CF3CH2CH2-, the resin contains Me, Vinyl, Ph and CF3CH2CH2- at the same time and at least contains two pieces of Vinyl, and a, b and c are integers larger than 0. As a trifluoropropyl group is introduced into the structure, the heat stability of a modification material is improved, and the defect that an existing epoxy modification organosilicon material is poor in heat stability is effectively overcome; after LED packaging adhesive containing the silicon resin is mixed, heated and cured, colloid is high in bonding strength, good in heat stability and low in moisture permeability and oxygen permeability, and photoelectric attenuation caused by vulcanization can be effectively reduced.

The invention provides a silver alloy reflection film, and an electrochromic device provided with the same, which include silver, palladium and rare earth element. The rare earth element is selected from La and/or Yb. The silver alloy reflection film, and the electrochromic device provided with the same can effectively improve resistance of the reflection film to discoloration and sulfurization.

The invention relates to cobalt-based powder used for plasma arc surfacing and capable of resisting high-temperature corrosion and wear. The powder is prepared from components in percentage by mass as follows: 12%-14% of Cr, 20%-24% of Mo, 2.5%-3.2% of Si, 3%-6% of Al, 1%-3% of Ta, 0.3%-0.8% of Y2O3, 0.1%-0.2% of CeO2 and the balance of Co; the particle size of original powder ranges from 200 meshes to 350 meshes. Through reasonable component proportioning of Cr, Mo, Si, Al, Y2O3, CeO2 and other rare earth oxides, high oxidation resistance and sulfuration resistance of a cobalt-base alloy are guaranteed while the strength and the wear resistance are guaranteed.

The invention belongs to the technical field of metal surface spray and provides a method for spraying and preparing a high temperature sulfidation resistant alloy layer on the surface of cast iron. The method includes the following steps of: (1) pre-treating the surface of a cast iron workpiece before spraying, and exposing the clean and coarsening metal surface of the workpiece; (2) adopting a subsonic speed oxyacetylene flame hot spray method to spray prime coat on the surface of the cast iron workpiece, wherein the prime coat adopts nickel aluminum compound powder; and (3) adopting a high speed arc wire spray method to spray an FeCrAl working layer on the surface of the cast iron workpiece. The technique of the invention is characterized by simple and convenient operation and strong applicability, can save high alloy material and is convenient for promotion and use. Compared with the overall high temperature sulfidation resistant material, the cast iron part prepared by means of the method is low in cost, has excellent resistance to high temperature sulfidation and favorable wearing resistance, and can strikingly improve the service life of the cast iron part in a high temperature sulfidation environment.

The invention provides a silver/graphene composite plating solution. The silver/graphene composite plating solution comprises a 3-80 g/L of AgNO3, 30-400 g/L of KI, 6-300 g/L of Na2S2O3, 1-20 g/L of HNO3, 0.1-10 g/L of a dispersing agent, 0.1-10 g/L of an auxiliary agent, 0.01-3 g/L of a defoaming agent, 0.5-5 g/L of graphene sheets and water. According to the provided silver/graphene composite plating solution, by adding the dispersing agent, the auxiliary agent and the defoaming agent, a complex on the surface of graphene can be controlled, so that graphene sheets are uniformly parallel to abase body surface, vulcanization of a silver layer is prevented, isolation of silver and harmful gas is realized, and the vulcanization resistance of a composite plating layer is improved; and experimental results show that a provided silver/graphene composite plating layer does not change color after being soaked in a Na2S solution with the volume fraction of 5% for 240 hours, and the sulfur resistance far exceeds the requirements of aviation industry standard QJ485-1988.

The invention provides a gold alloy bonding wire and further provides a manufacturing method of the gold alloy bonding wire. The gold alloy bonding wire is characterized in that the gold alloy bondingwire comprises, by weight, 0.5-2% of Pd, 15-30% of Ag, 0.5-3% of Cu, 0.1-2% of Pt, 2-200 ppm of a minor additive element and the balance gold, wherein the minor additive element is one or two or moreof Ca, In, Co, Be, Ga, Mg, Ce and Ni. The gold alloy bonding wire has excellent high reliability and sulfidation resistance, high tensile strength and good welding spot connectivity, and can lower the cost.

The invention relates to a gold alloy bonding wire which is characterized by comprising, by weight, 2.1%-8% of Pd, 20%-30% of Ag, 2.1%-6% of Pt, 2-200 ppm of trace additive elements and the balance gold. The trace additive elements are a combination of one or more than two of Ca, In, Co, Be, Ga, Mg, Ce and Ni. The invention further comprises a manufacturing method of the above gold alloy bonding wire. The gold alloy bonding wire has the excellent strength of extension, is suitable for packaging of low wire arcs and high wire arcs, and meanwhile is high in vulcanization resistance and reliability and low in cost.

One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.

Provided are: a chip resistor whose resistance value can be adjusted with high accuracy while maintaining high sulfurization resistance of electrodes of the chip resistor even in the case where the resistance value of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor (1) includes: an insulating film that covers a resistor substance (4) formed so as to make contact with both of a pair of electrodes (3, 3) formed on an upper surface (2A) of an insulating substrate (2). Each of the pair of electrodes (3, 3) includes: (1) a main electrode layer (3B) that contains silver as a main metal component and 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer (3A) that is lower in specific resistance than the main electrode layer (3B); (2) a laminate part where the auxiliary electrode layer (3A) and the main electrode layer (3B) are sequentially laminated in this order on a single surface of the insulating substrate (2); and (3) an exposed part (3A1) of the auxiliary electrode layer (3A) where a part of the auxiliary electrode layer (3A) is not covered with the main electrode layer (3B) on a far side from the resistor substance (4), and parts (3B1) that extend from a near side to the far side with respect to the resistor substance (4).

The invention relates to a copper alloy wire. The copper alloy wire contains 0.1-3% of Ag, 460-1000 ppm of a trace additive element and the balance of copper; and the trace additive element is the combination of one or more in Ca, Be, In and Ge. The invention further provides a manufacturing method of the copper alloy wire. The copper alloy bonding wire in the invention has the beneficial effectsthat: after being routed, the product has high resistance to humidity in high-temperature, high-humidity and high-voltage conditions; the adhesive power between a welding spot and a bonding pad is good; the copper alloy bonding wire has excellent operability and reliability; the anti-aging performance is good; the hardness of a wire rod is relatively proper; the routing camber height is greatly reduced; when IC routing is carried out, breakage and damage to a welding electrode are avoided; the good bonding performance is provided; and the cost is relatively low.

The invention relates to the technical field of coal mine fillers, and particularly discloses a waste coal mine filler based on coal gangue. The filler comprises the following components in percentage by mass: 30%-40% of coal gangue, 20%-40% of cement, 10%-20% of sand, 5%-10% of fly ash, 10%-15% of lime, 0.5-1.5 kg/m < 3 > hybrid fibers and 3.5%-15% of an inorganic additive; the hybrid fibers are two or more selected from steel fibers, glass fibers, carbon fibers or basalt fibers; and the lengths of different fibers are different. The filler has high corrosion resistance, the strength can bear high stress generated by surrounding rock deformation, meanwhile, the fire resistance is high, and the grouting requirement of an underground coal mine roadway can be met.

The invention provides a copper alloy bonding wire. The copper alloy bonding wire is characterized by being prepared from the following components according to the weight: 0.3 to 5 percent of Ag, 1 to450ppm of a trace additive element and the balance of copper, wherein the trace additive element is one or a combination of more than two of Ca, In, Be and Ge. The invention further provides a production method of the copper alloy bonding wire. The copper alloy bonding wire provided by the invention has the following beneficial effects that (1) the working performance and the reliability are excellent; (2) the anti-ageing performance is good; (3) the copper alloy bonding wire has relatively proper wire hardness and the camber height of wire bonding is extremely reduced; (5) cracks and damagesto a welding electrode are not caused in an IC wire bonding process; (5) the copper alloy bonding wire can provide good bonding performance; (6) the cost is relatively low.

The invention discloses a corrosion-resistant gold-based precise hardware material. The corrosion-resistant gold-based precise hardware material consists of gold, silver, copper, nickel, gadolinium, yttrium, praseodymium and platinum, and the weight parts of the components of the corrosion-resistant gold-based precise hardware material are as follows: 50-62 parts of gold, 10-17 parts of silver, 8-15 parts of copper, 6-13 parts of nickel, 1-7 parts of gadolinium, 2-8 parts of yttrium, 3-9 parts of praseodymium, and 5-11 parts of platinum. The corrosion-resistant gold-based precise metal material has the characteristics of being high in conductivity, high in thermal conductivity, high in corrosion resistance, high in vulcanization resistance and high in wear resistance.

The invention provides a silver alloy with high hardness and aging softening resistance. The silver alloy has the beneficial effects as follows: the silver ingredient of which the weight component is 92.5-95.0, particularly preferably 92.5 is adopted, so that on the one hand, the silver is large in ratio, so as to take up value advantage, and on the other hand, the other ingredients are added on the basis of the silver with the ratio. Therefore, the problem of poor aging softening resistance of the silver alloy prepared by the silver alloy production technology in modern society is solved when the mechanical property of the alloy is obviously improved, and the oxidation resistance of the silver alloy is improved by other alloy ingredients. Therefore, the silver alloy has a great development prospect.

The invention discloses an insulating corrosion-resistant bonding wire with an inorganic amorphous coating. The bonding wire comprises a bonding wire substrate and an inorganic amorphous plating layer, and the inorganic amorphous plating layer is composed of the following components in percentage by weight: 40%-60% of SiO2, 15%-30% of Al2O3, 10%-25% of B2O and 0.1%-5% of Li2O. The bonding wire provided by the invention has higher corrosion resistance and vulcanization resistance, high tensile strength and good routing operation performance, and does not influence the bonding property of welding of the substrate bonding wire and a chassis; by using the method, the arc height can be reduced, the insulating corrosion-resistant inorganic amorphous plating layer can enhance the adhesion betweenthe wire and glue in the packaging process, the welding reliability is improved, the harmful substances such as C and S cannot be generated, and the corrosion resistance is far higher than that of anorganic coating; compared with palladium plating, gold plating and other metal plating materials, the bonding wire is low in preparation cost, wide in application range, free of pollution to the environment and suitable for the integrated circuit and LED packaging industry.

The invention provides a copper alloy wire with a plating on the surface. The copper alloy wire comprises a core wire and the plating which coats the outer surface of the core wire. The core wire comprises, by weight, 0.1 to 3% of Ag, 460 to 1000 ppm of trace addition element, and balance of copper. The trace addition element is one or the combination of two or more of Ca, Be, In and Ge. The plating is a gold plating, a palladium plating or a composite plating. Compared with the prior art, the copper alloy wire with the plating on the surface, which is provided by the invention, has the advantages that (1) a product has strong resistance to humidity under high temperature, high humidity and high pressure after routing, and the adhesion of a solder joint and a pad is great; (2) oxidation resistance is great; (3) anti-aging performance is great; (4) the wire has excellent workability and reliability; (5) the wire has suitable wire hardness, and the arc height of routing is greatly reduced; and (6) when IC routing is carried out, a welding electrode is not cracked and damaged; and (7) the wire can provide great bonding.