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Copper alloy wire and manufacturing method thereof

A technology of copper alloy wire and manufacturing method, which is applied in the field of bonding wire, can solve problems such as poor anti-aging performance and high temperature and high humidity resistance, lack of market competitiveness, and complicated manufacturing process, so as to improve gold ball shedding, excellent Good workability and anti-aging performance

Pending Publication Date: 2019-03-01
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pure copper wire has good workability and low cost, but poor aging resistance, high temperature and high humidity resistance, and low reliability
Palladium-plated gold-plated copper wire includes a core wire, a palladium pre-plating layer coated on the outside of the core wire, and a gold cladding layer coated on the outside of the palladium pre-plated layer. The core wire is made of pure copper; the palladium-plated gold-plated copper wire is used to ensure good For workability and reliability, thicker palladium pre-plating layer and gold cladding layer are required. The cost of raw materials is high, and the manufacturing process is relatively complicated, so that the manufacturing cost is too high and lacks market competitiveness.

Method used

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  • Copper alloy wire and manufacturing method thereof
  • Copper alloy wire and manufacturing method thereof

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Effect test

Embodiment 1

[0031] The copper alloy wire of this embodiment contains 1.2% by weight of Ag, 200ppm of Ca, 200ppm of In, 300ppm of Ge, and the balance is copper.

[0032] The manufacturing method of above-mentioned copper alloy wire comprises the following steps:

[0033] (1) Melting and casting: adding Ag, Ca, In and Ge to the copper raw material in proportion, through vacuum smelting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0034] (2) wire drawing: the wire rod obtained in step (1) is drawn to obtain a copper alloy wire with a diameter of 200um;

[0035] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is carried out to the copper alloy wire, and N is used in the annealing process. ２ As the annealing atmosphere, the effective length of the annealing furnace is 900mm, the annealing temperature is 400°C, and the annealing rate is 60m / min;

[0036] (4) Continue to draw the copper alloy wire thr...

Embodiment 2

[0040] The copper alloy wire of this embodiment contains Ag 0.1%, Be 300ppm, In 300ppm, Ge 400ppm by weight, and the balance is copper.

[0041] The manufacturing method of above-mentioned copper alloy wire comprises the following steps:

[0042] (1) Melting and casting: Ag, Be, In and Ge are added to the copper raw material in proportion, and through vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0043] (2) wire drawing: wire rod obtained in step (1) is drawn to obtain a copper alloy wire with a diameter of 180um;

[0044] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the copper alloy wire. During the annealing process, nitrogen-hydrogen mixed gas is used as the annealing atmosphere. The effective length of the annealing furnace is 800mm, and the annealing temperature is 500°C. The annealing rate is 100m / min;

[0045] (4) Continue to draw the copper a...

Embodiment 3

[0050] The copper alloy wire of this embodiment contains 2.5% by weight of Ag, 400ppm of Ca, 400ppm of Ge, and the balance is copper.

[0051] The manufacturing method of above-mentioned copper alloy wire comprises the following steps:

[0052] (1) Melting and casting: adding Ag, Ca and Ge to the copper raw material in proportion, through vacuum smelting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0053] (2) wire drawing: wire rod obtained in step (1) is drawn to obtain a copper alloy wire with a diameter of 250um;

[0054] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is carried out to the copper alloy wire, and N is used in the annealing process. 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 600°C, and the annealing rate is 80m / min;

[0055] (4) Continue to draw the copper alloy wire through the intermediate ...

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Abstract

The invention relates to a copper alloy wire. The copper alloy wire contains 0.1-3% of Ag, 460-1000 ppm of a trace additive element and the balance of copper; and the trace additive element is the combination of one or more in Ca, Be, In and Ge. The invention further provides a manufacturing method of the copper alloy wire. The copper alloy bonding wire in the invention has the beneficial effectsthat: after being routed, the product has high resistance to humidity in high-temperature, high-humidity and high-voltage conditions; the adhesive power between a welding spot and a bonding pad is good; the copper alloy bonding wire has excellent operability and reliability; the anti-aging performance is good; the hardness of a wire rod is relatively proper; the routing camber height is greatly reduced; when IC routing is carried out, breakage and damage to a welding electrode are avoided; the good bonding performance is provided; and the cost is relatively low.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a copper alloy wire and a manufacturing method thereof. Background technique [0002] Bonding wire (also known as bonding wire) is a main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the semiconductor industry adop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C9/00C22F1/08
CPCH01L21/4885H01L21/4896H01L23/49C22C9/00C22F1/08
Inventor 周振基周博轩麦宏全王贤铭于锋波
Owner NICHE TECH KAISER SHANTOU
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