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Copper alloy bonding wire and production method thereof

A manufacturing method and technology of bonding wire, applied in the field of bonding wire, can solve the problems of poor anti-aging performance, high temperature and high humidity resistance, lack of market competitiveness, complicated manufacturing process, etc., and achieve improved gold ball shedding, excellent Good workability and anti-aging performance

Inactive Publication Date: 2018-11-16
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pure copper wire has good workability and low cost, but poor aging resistance, high temperature and high humidity resistance, and low reliability
Palladium-plated gold-plated copper wire includes a core wire, a palladium pre-plating layer coated on the outside of the core wire, and a gold cladding layer coated on the outside of the palladium pre-plated layer. The core wire is made of pure copper; the palladium-plated gold-plated copper wire is used to ensure good For workability and reliability, thicker palladium pre-plating layer and gold cladding layer are required. The cost of raw materials is high, and the manufacturing process is relatively complicated, so that the manufacturing cost is too high and lacks market competitiveness.

Method used

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  • Copper alloy bonding wire and production method thereof
  • Copper alloy bonding wire and production method thereof
  • Copper alloy bonding wire and production method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] The copper alloy bonding wire of this embodiment contains 3% by weight of Ag, 100ppm of In, 100ppm of Ge, 100ppm of Ca, and the balance is copper.

[0031] The manufacture method of above-mentioned copper alloy bonding wire comprises the following steps:

[0032] (1) Melting and casting: adding Ag, In, Ge and Ca to the copper raw material in proportion, through vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0033] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a copper alloy wire with a diameter of 200um;

[0034] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the copper alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 550°C, and the annealing rate is 80m / min;

[0035] (4) Continue drawing the copper alloy wire after the intermediate anneal...

Embodiment 2

[0039] The copper alloy bonding wire of this embodiment contains Ag 5%, Ca 50ppm, Be 80ppm, Ge 50ppm by weight, and the balance is copper.

[0040] The manufacture method of above-mentioned copper alloy bonding wire comprises the following steps:

[0041] (1) Melting and casting: Ag, Ca, Be and Ge are added to the copper raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0042] (2) wire drawing: drawing the wire rod obtained in step (1) to obtain a copper alloy wire with a diameter of 150um;

[0043] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is carried out on the copper alloy wire. During the annealing process, nitrogen-hydrogen mixed gas is used as the annealing atmosphere. The effective length of the annealing furnace is 900 mm, and the annealing temperature is 600 ° C. The annealing rate is 60m / min;

[0044] (4) Continue drawin...

Embodiment 3

[0049]The copper alloy bonding wire of this embodiment contains 0.5% by weight of Ag, 150ppm of Ca, 150ppm of Ge, and the balance is copper.

[0050] The manufacture method of above-mentioned copper alloy bonding wire comprises the following steps:

[0051] (1) Melting and casting: Ag, Ca and Ge are added to the copper raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0052] (2) wire drawing: drawing the wire obtained in step (1) to obtain a copper alloy wire with a diameter of 280um;

[0053] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the copper alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 400°C, and the annealing rate is 80m / min;

[0054] (4) Continue drawing the copper alloy wire after the intermediate annealing treatment in...

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Abstract

The invention provides a copper alloy bonding wire. The copper alloy bonding wire is characterized by being prepared from the following components according to the weight: 0.3 to 5 percent of Ag, 1 to450ppm of a trace additive element and the balance of copper, wherein the trace additive element is one or a combination of more than two of Ca, In, Be and Ge. The invention further provides a production method of the copper alloy bonding wire. The copper alloy bonding wire provided by the invention has the following beneficial effects that (1) the working performance and the reliability are excellent; (2) the anti-ageing performance is good; (3) the copper alloy bonding wire has relatively proper wire hardness and the camber height of wire bonding is extremely reduced; (5) cracks and damagesto a welding electrode are not caused in an IC wire bonding process; (5) the copper alloy bonding wire can provide good bonding performance; (6) the cost is relatively low.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a copper alloy bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/08C22F1/02H01L33/62
Inventor 周振基周博轩麦宏全于锋波彭政展王贤铭
Owner NICHE TECH KAISER SHANTOU
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