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Gold-gallium-cobalt alloy composite bonding wire with gold coating layer and manufacturing method thereof

A technology of a gold cladding layer and a manufacturing method, which is applied in the field of gold-gallium-cobalt alloy composite bonding wire and its manufacturing, can solve the problems of low tensile strength of gold bonding wire, unfavorable improvement of competitiveness of enterprises, and difficult control of elongation, etc. Achieve the effect of improving anti-oxidation ability and anti-vulcanization ability, improving the adaptability of the machine, and increasing the window of the wire-bonding operation.

Inactive Publication Date: 2018-06-12
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the international gold price continues to rise, the price of gold bonding wire has also risen all the way, resulting in high cost of end products, which is not conducive to enterprises to improve their competitiveness
In addition, the tensile strength of gold bonding wire is low (for example, the maximum tensile strength of gold bonding wire with a diameter of 20 microns is less than 5 gf after welding), and the elongation is not easy to control
[0004] New bonding wires are gradually being introduced to the market, such as silver alloy wires, gold alloy wires and gold-plated silver alloy bonding wires, etc., whose prices are relatively low and can meet the different needs of different customers; but for high-end LED Due to the oxidation of silver, the conventional silver alloy and gold-plated silver alloy wire will have defects such as bonding oxidation, silver ion potential migration, and poor eutectic solder joints, which also have limitations in reliability.

Method used

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  • Gold-gallium-cobalt alloy composite bonding wire with gold coating layer and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0035] The gold-gallium-cobalt alloy composite bonding wire with a gold cladding layer of the present embodiment includes a core wire and a gold cladding layer coated outside the core wire; the core wire contains Ga 5%, Co 0.8% by weight, The balance is gold; the thickness of the gold cladding layer is 100nm.

[0036] In this embodiment, the manufacturing method of the gold-gallium-cobalt alloy composite bonding wire having a gold coating layer comprises the following steps:

[0037] (1) Melting and casting: Ga and Co are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0038] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 200um;

[0039] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 As the annealing atmosphere, the ef...

Embodiment 2

[0053] The gold-gallium-cobalt alloy composite bonding wire with a gold cladding layer of the present embodiment comprises a core wire and a gold cladding layer coated on the outside of the core wire; the core wire contains 8% by weight of Ga, 0.05% of Co, The balance is gold; the thickness of the gold cladding layer is 180nm.

[0054] In this embodiment, the manufacturing method of the gold-gallium-cobalt alloy composite bonding wire having a gold coating layer comprises the following steps:

[0055] (1) Melting and casting: Ga and Co are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 7 mm is obtained;

[0056] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 50um;

[0057] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 As the annealing a...

Embodiment 3

[0071] The gold-gallium-cobalt alloy composite bonding wire with a gold cladding layer in this embodiment includes a core wire and a gold cladding layer coated outside the core wire; the core wire contains 3.5% by weight of Ga, 1.5% of Co, The balance is gold; the thickness of the gold cladding layer is 20nm.

[0072] In this embodiment, the manufacturing method of the gold-gallium-cobalt alloy composite bonding wire having a gold coating layer comprises the following steps:

[0073] (1) Melting and casting: Ga and Co are added to the gold raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0074] (2) Wire drawing: drawing the core wire obtained in step (1) to obtain a bonding wire core wire with a diameter of 200um;

[0075] In this step (2), during the wire drawing process, the wire is subjected to intermediate annealing several times, and N 2 As the annealing atmosphere, the ef...

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Abstract

The invention provides a gold-gallium-cobalt alloy composite bonding wire with a gold coating layer. The gold-gallium-cobalt alloy composite bonding wire is characterized by comprising a core wire anda gold coating layer coated outside the core wire. The core wire comprises the following components in weight percentage: 3-8% of Ga, 0.02-1.5% of Co, and the rest of gold. The thickness of the goldcoating layer is 20-200 nm. The invention further provides a manufacturing method of the gold-gallium-cobalt alloy composite bonding wire with the gold coating layer. The gold-gallium-cobalt alloy composite bonding wire improves the machine adaptability and reduces the setup time of a wire bonder. Meanwhile, the gold-gallium-cobalt alloy composite bonding wire is excellent in anti-oxidation performance and anti-vulcanization performance, high in tensile strength and good in welding spot connectivity.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold-gallium-cobalt alloy composite bonding wire with a gold coating layer and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Another important direction is the development of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48H01L33/62
CPCH01L24/43H01L24/45H01L33/62H01L2933/0066H01L2224/4321H01L2224/43H01L2224/45105H01L2224/45144H01L2224/45157H01L2224/45644H01L2224/45565H01L2924/01027H01L2924/01031H01L2924/01079
Inventor 周振基周博轩于锋波彭政展麦宏全
Owner NICHE TECH KAISER SHANTOU
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