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Addition curing type silicon compound, optical element sealing material and semiconductor device

An addition-curing type, composition technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problem of not being able to fully meet the sulfidation resistance luminous efficiency, etc., and achieve excellent reliability and anti-sulfurization. Excellent performance and high luminous efficiency

Inactive Publication Date: 2012-04-04
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, these compositions cannot fully satisfy the anti-sulfurization and high luminous efficiency

Method used

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  • Addition curing type silicon compound, optical element sealing material and semiconductor device
  • Addition curing type silicon compound, optical element sealing material and semiconductor device
  • Addition curing type silicon compound, optical element sealing material and semiconductor device

Examples

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Embodiment

[0102] Hereinafter, the present invention will be specifically described by showing preparation examples, examples, and comparative examples, but the present invention is not limited to the following examples.

[0103] In addition, in the following examples, the viscosity means the value measured at 25 degreeC using the rotational viscometer.

preparation example 1

[0105] Uniformly mix 100 parts by mass of a compound represented by the following formula (hereinafter referred to as "compound A") (viscosity 2Pa.s); the viscosity is 0.02Pa.s, and the average composition formula HMe 2 SiO(MeHSiO) 2 (Ph 2 SiO) 2 SiMe 2 41 parts by mass of organohydrogenpolysiloxane represented by H; 0.14 parts by mass of toluene solution containing 1 mass % of chloroplatinic acid / 1,3-divinyltetramethyldisiloxane complex as platinum atom content; 0.05 parts by mass of ethynylcyclohexanol as a control agent; and 3 parts by mass of γ-glycidoxypropyltrimethoxysilane; prepare silicon composition (I). The silicon composition (I) was cured by heating at 150°C for 4 hours, and the hardness of Type A was 66.

[0106]

preparation example 2

[0108] Evenly mixed compound A26 mass parts; By average composition formula (PhSiO 3 / 2 ) 0.75 [(CH 2 =CH)Me 2 SiO 0.5 ] 0.25 The represented solid branched organopolysiloxane [the content of the vinyl group bonded to the silicon atom = 17 mol %, the phenyl group bonded to the silicon atom in all the organic groups bonded to the silicon atom Content ratio=50 mol%, the weight-average molecular weight=1600]74 mass parts of standard styrene conversion; By average composition formula HMe 2 SiO(Ph 2 SiO) 1 SiMe 2 32 parts by mass of organohydrogenpolysiloxane represented by H; 0.13 parts by mass of toluene solution containing 1 mass % of chloroplatinic acid / 1,3-divinyltetramethyldisiloxane complex as platinum atom content; acetylene 0.05 parts by mass of cyclohexyl alcohol; and, 3 parts by mass of γ-glycidoxypropyltrimethoxysilane; prepare the silicon composition (II). The silicon composition (II) was cured by heating at 150°C for 4 hours, and the hardness was 43 on Shore D...

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Abstract

The invention relates to an addition curing type silicon compound, an optical element sealing material and a semiconductor device. The addition curing type silicon compound at least comprises (A) chemical compounds represented in the formula (1), (B) organic silicon compounds with each molecule having at least two hydrogen atoms bonded on silicon. The organic silicon compound comprises no fatty group unsaturated bases. The compound in the invention further comprises (C) a hydrosilylation catalyst which comprises platinum group metals. The organic silicon compound is enough to make the compound in the invention cured when the hydrosilylation catalyst is present. The invention further provides an addition curing type silicon resin compound which has excellent vulcanization resistance and higher light emitting efficiency during an optical purpose.

Description

technical field [0001] The present invention relates to an addition curing type curable silicon composition, and particularly relates to an addition curing type silicon composition which is excellent in vulcanization resistance and provides a cured product with high luminous efficiency when used in optical applications, comprising the An optical element sealing material of the composition and a semiconductor device using the optical element sealing material. Background technique [0002] The addition-curable silicon composition, which is cured by a hydrosilylation reaction to provide a cured product, includes polyorganosiloxane containing an aliphatic unsaturated group such as an alkenyl group, and the like. The cured product obtained in this way is excellent in heat resistance, cold resistance and electrical insulation, and is transparent, so it can be used in various optical applications. [0003] Silicone resins used in optical applications are required to have high tran...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/10C09K3/10H01L23/29
CPCH01L2224/45144H01L2224/48091H01L2924/00014H01L2924/00
Inventor 池野正行小材利之木村真司
Owner SHIN ETSU CHEM IND CO LTD
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