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Silver alloy bonding wire with flash plating layer and manufacturing method thereof

A technology of silver alloy bond and manufacturing method, which is applied in the field of bonding wire, and can solve problems such as unsatisfactory anti-sulfurization performance and anti-aging performance, and affecting the service life of products

Inactive Publication Date: 2021-06-25
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing silver alloy bonding wire contains silver (Ag), gold (Au) and palladium (Pd), Pd (palladium) can improve the anti-aging performance of the wire, gold (Au) can resist sulfur, so that the silver alloy bonding Silk has certain anti-sulfurization ability and anti-aging ability, but its anti-sulfurization performance and anti-aging performance are still not ideal, which affects the service life of the packaged product

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0029]The silver alloy bonding wire with a flash coating in this embodiment includes a silver alloy core wire and a flash coating coated on the outside of the silver alloy core wire; the material of the flash coating is Au, and the thickness of the flash coating is 2-10 nm. The silver alloy core wire contains 1.5% Au, 3% Pd by weight, trace elements Cu 1500ppm, In 100ppm, Pt 200ppm, and the balance is Ag.

[0030] In this embodiment, the manufacturing method of the silver alloy bonding wire with the flash plating layer comprises the following steps:

[0031] (1) Making silver alloy core wire;

[0032] (1-1) Melting and casting: Au, Pd and trace elements are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0033] (1-2) wire drawing: drawing the wire rod obtained in step (1-1) to obtain a silver alloy core wire with a diameter of 200 μm;

[0034] (1-3) Interme...

Embodiment 2

[0041] The silver alloy bonding wire with a flash coating in this embodiment includes a silver alloy core wire and a flash coating coated on the outside of the silver alloy core wire; the material of the flash coating is Pd, and the thickness of the flash coating is 2-10 nm. The silver alloy core wire contains Au0.5% by weight, Pd 1%, trace elements Cu 2500ppm, In 200ppm, Pt 50ppm, and the balance is Ag.

[0042] In this embodiment, the manufacturing method of the silver alloy bonding wire with the flash plating layer comprises the following steps:

[0043] (1) Making silver alloy core wire;

[0044] (1-1) Melting and casting: Au, Pd and trace elements are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0045] (1-2) wire drawing: drawing the wire obtained in step (1-1) to obtain a silver alloy core wire with a diameter of 500 μm;

[0046] (1-3) Intermediate...

Embodiment 3

[0055] The silver alloy bonding wire with a flash coating in this embodiment includes a silver alloy core wire and a flash coating coated on the outside of the silver alloy core wire; the material of the flash coating is Au, and the thickness of the flash coating is 2-10 nm. The silver alloy core wire contains Au0.5% by weight, Pd 0.5%, trace elements Cu 4000ppm, Ca 200ppm, Sn 200ppm, and the balance is Ag.

[0056] In this embodiment, the manufacturing method of the silver alloy bonding wire with the flash plating layer comprises the following steps:

[0057] (1) Making silver alloy core wire;

[0058] (1-1) Melting and casting: Au, Pd and trace elements are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0059] (1-2) wire drawing: drawing the wire obtained in step (1-1) to obtain a silver alloy core wire with a diameter of 100 μm;

[0060] (1-3) Intermedi...

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Abstract

A silver alloy bonding wire with a flash plating layer is characterized by comprising a silver alloy core wire and the flash plating layer wrapping the silver alloy core wire. The flash plating layer is made of Au or Pd, and the thickness of the flash plating layer is 1-10 nm. The invention further provides a manufacturing method of the silver alloy bonding wire with the flash plating layer. The silver alloy bonding wire has the following beneficial effects that (1) the anti-vulcanization performance and the anti-oxidation performance are excellent; (2) the proportion of the first-welding sliding ball is extremely low, and the sphericity and the operability both meet the requirements.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a silver alloy bonding wire with a flash plating layer and a manufacturing method of the silver alloy bonding wire. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniatur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48H01L33/62C21D1/26C21D8/06C22C1/02C22C5/06C22F1/02C22F1/14C25D3/48C25D3/50C25D5/48C25D5/50C25D7/06
CPCH01L24/45H01L24/43H01L33/62C22C5/06C25D3/48C25D3/50C25D5/50C25D5/48C25D7/0607C22C1/02C22F1/14C22F1/02C21D8/06C21D1/26H01L2224/45139H01L2224/45444H01L2224/45464H01L2224/43848H01L2224/43825H01L2224/4321H01L2933/0066H01L2924/01049
Inventor 周振基周博轩王俊智于锋波石逸武郭骅德彭政展
Owner NICHE TECH KAISER SHANTOU
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