A kind of silver alloy bonding wire and its manufacturing method

A technology of silver alloy bond and manufacturing method, which is applied in the field of bonding wire, can solve problems such as unsatisfactory anti-sulfurization performance and anti-aging performance of silver alloy bonding wire, and affect the service life of products, so as to improve reliability and anti-aging performance excellent effect

Active Publication Date: 2020-05-19
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the anti-sulfurization and anti-aging properties of this silver alloy bonding wire are still not ideal, which affects the service life of the packaged product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The copper alloy bonding wire of this embodiment contains 7% by weight of Au, 2% of Pd, 250ppm of Ca, 150ppm of Si, and the balance is silver.

[0028] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0029] (1) Melting and casting: Au, Pd, Ca and Si are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0030] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 200um;

[0031] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 1000mm, the annealing temperature is 400°C, and the annealing rate is 100m / min;

[0032] (4) Continue to draw the silver alloy wire after the intermediate ann...

Embodiment 2

[0036] The copper alloy bonding wire of this embodiment contains Au 9%, Pd 3%, Ca 70ppm, Be 45ppm, Cu 50ppm, In 50ppm by weight, and the balance is silver.

[0037] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0038] (1) Melting and casting: Au, Pd, Ca , Be , Cu and In are added to the silver raw material in proportion, and a wire rod with a diameter of 8 mm is obtained through vacuum melting and directional continuous casting process;

[0039] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 150um;

[0040] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 500°C, and the annealing rate is 80m / min;

[0041] (4) Continue to draw the silver alloy wire after the i...

Embodiment 3

[0045] The copper alloy bonding wire of this embodiment contains 5% by weight of Au, 1% of Pd, 150ppm of Ca, 50ppm of Si, 30ppm of In, and the balance is silver.

[0046] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0047] (1) Melting and casting: Au, Pd, Ca, Si and In are added to the silver raw material in proportion, and a wire rod with a diameter of 8 mm is obtained through vacuum melting and directional continuous casting process;

[0048] (2) wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 280um;

[0049](3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 600mm, the annealing temperature is 550°C, and the annealing rate is 60m / min;

[0050] (4) Continue to draw the silver alloy wire after the in...

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Abstract

A silver alloy bonding wire is characterized by containing, by weight, 3.5-10% of Au, 1-5% of Pd, 2-500 ppm of micro-additive element, and the balance Ag, and the micro-additive element is the combination of one or more than two of the Ca, Cu, Be, In, Si and Ge. The present invention also provides a manufacturing method of the above silver alloy bonding wire. The silver alloy bonding wire of the present invention has the following beneficial effects that (1) the anti-sulfur performance is excellent; (2) the anti-aging performance is excellent, the reliability of a packaged product in a thermalshock test is improved, and on the equal aging conditions (-40 DEG C to 100 DEG C), the silver alloy bonding wire of the present invention can bear 200-250 rounds of thermal shock, but the conventional silver alloy bonding wire only can bear 100 rounds of thermal shock; (3) a routing window is large and has the good operability; (4) an FAB hot bulb is good, a slider does not exist, the bond strength of a welding spot is large, and the reliability is high.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a silver alloy bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the sem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/49C22C1/02C22C5/06C22F1/02C22F1/08
CPCC22C1/02C22C5/06C22F1/02C22F1/08H01L21/4889H01L23/49
Inventor 周振基周博轩麦宏全彭政展
Owner NICHE TECH KAISER SHANTOU
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