Polyisobutylene composition with improved gas barrier property and application thereof

Abstract

The invention discloses a polyisobutylene composition with improved gas barrier property, which comprises an alkenyl-terminated polyisobutylene low polymer, a phenyl-containing organic-group hydrosilane crosslinking agent, and a catalyst capable of completely curing the composition at preset temperature and/or under lighting conditions. At least one component in the composition is fluid; and the at least one component can be uniformly mixed with the rest components in the composition, so that the composition is fluid. The invention also discloses application of the polyisobutylene composition. The polyisobutylene composition has the characteristics of favorable flowability, favorable stability, long shelf life and the like, and is easy to use and suitable for storage and transportation. The curing product has pleasantly surprised optical transparency and excellent air tightness, and especially has the anti-vulcanization property which much exceeds the existing like materials. The polyisobutylene composition has favorable comprehensive mechanical properties, and has wide application prospects.

Description

technical field [0001] In particular, the present invention relates to a polyisobutylene composition having improved gas barrier properties, which is useful for encapsulating semiconductor devices, such as LEDs. Background technique [0002] In recent years, semiconductor light-emitting elements, especially white LEDs, which have the characteristics of long life and low power consumption, have been widely used as light sources. [0003] Most of the common white LED packaging structures include a bracket. The bottom of the bracket is treated with silver plating. The LED chip is fixed on the bracket. The positive and negative poles of the bracket are drawn out through gold wires. [0004] Traditional LEDs generally use epoxy resin as the packaging material, but it has problems such as poor temperature resistance, easy yellowing, poor dimensional stability, and aging resistance. Alternative, but because the silicone encapsulant is mainly made of polysiloxane, it has the charac...

AI Technical Summary

Problems solved by technology

For example, one of the solutions is to load an anti-sulfurization layer or anti-sulfurization structure on the packaging material (for example, refer to CN202915106U), but it cannot fundamentally eliminate the vulcanization problem, and it leads to complicated packaging process and greatly increased cost

For another example, another solution is to add components with high reactive functional groups to the silicone gel to increase the overall crosslinking density of the encapsulant (for example, refer to CN102965069A), thereby improving the anti-vulcanization effect of the encapsulant. However, the silicone encapsulant The inherent structural characteristics of intrinsic molecules determine the lack of gas barrier properties, so this scheme cannot fundamentally overcome the aforementioned problems

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