Preparation method of tin and silver composite plating layer with high reflectivity
A composite coating, high reflectivity technology, applied in the field of semiconductor lighting sources, can solve the problems of interface Ag atoms agglomeration, change interface flatness, increase contact resistance, etc., to simplify the preparation process, ensure stability, and improve the effect of uniformity
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[0030] (1) Add 3g of stannous sulfate, 18g of concentrated sulfuric acid, and 3mL of brightener into deionized water to prepare a 100mL tin plating solution.
[0031] In this embodiment, pure copper is used as the cathode substrate, and electroplating is performed by direct current electrodeposition after polishing and cleaning, and the cathode current density is 2A / dm 2 , Plating time is 10 minutes.
[0032] (2) Add 4.2g of silver nitrate, 9g of nicotinic acid, 7.7g of ammonium acetate, 4.5g of potassium hydroxide, 7g of potassium carbonate and 3.2mL of light ammonia into deionized water to prepare a 100mL silver plating solution.
[0033] In this example, the sample with deposited tin coating is used as the cathode substrate. After cleaning and drying with acetone and alcohol, electroplating is carried out by direct current electrodeposition, and the cathode current density is 0.4A / dm 2 , the electroplating time is 1 minute, and the tin-silver composite coating is obtained,...
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