This invention relates to an IC or discrete component super-thin leg-free packaging leading-line frame, including the substrate, the chip bearing base and the fight line inward-feet bearing base, the chip bearing base and the fight line inward-feet bearing base protruding upward to set up on the substrate surface, and corresponding to the chip bearing base and the fight line inward-feet bearing base, the substrate has corresponding chip region and the fight line inward-feet to depress on the substrate surface; the chip bearing base and the fight line inward-feet base bottom being the metal layer (11,12); above the chip bearing base and the fight line inward-feet base metal layer, first sputtering a metal activation layer (2), and then sputtering a copper metal or alloy layer (31, 32); above the fight line inward-feet bearing base copper metal or alloy layer, sputtering a silver metal, or nickel metal, or palladium metal layer (52). This invention has strong welding performance, excellent quality, lower costs, smoother production, and strong applicability, and for cutting tools and blades, it can play a maximum efficiency, multi-chip arranged flexibly, no plastic infiltration or other various difficulties, and for the environment protection.