This invention relates to an IC or discrete component super-thin leg-free packaging leading-line frame, including the substrate, the
chip bearing base and the fight line inward-feet bearing base, the
chip bearing base and the fight line inward-feet bearing base protruding upward to set up on the
substrate surface, and corresponding to the
chip bearing base and the fight line inward-feet bearing base, the substrate has corresponding chip region and the fight line inward-feet to depress on the
substrate surface; the chip bearing base and the fight line inward-feet base bottom being the
metal layer (11,12); above the chip bearing base and the fight line inward-feet
base metal layer, first
sputtering a
metal activation layer (2), and then
sputtering a
copper metal or
alloy layer (31, 32); above the fight line inward-feet bearing base
copper metal or
alloy layer,
sputtering a silver metal, or
nickel metal, or
palladium metal layer (52). This invention has strong
welding performance, excellent quality, lower costs, smoother production, and strong applicability, and for
cutting tools and blades, it can play a
maximum efficiency, multi-chip arranged flexibly, no plastic infiltration or other various difficulties, and for the environment protection.