39results about How to "Achieve anisotropy" patented technology

A circulating etching method of a silicon nitride hole with high depth-to-width ratio comprises of the steps of 1 adopting a dry-method plasma process and fluorocarbon-based gas to perform silicon nitride thin film etching so as to form the hole and meanwhile generating a polymer depositing on the bottom and the side wall of the hole; 2 feeding oxidizing gas and diluting gas into an etching cavity. The deposition amount of fluorocarbon on the side wall of the deep hole can be controlled, the polymer depositing on the bottom of the deep hole can be removed so as to ensure continuous etching, and the two steps are repeatedly performed till the etching profile of the hole meets the requirement. When the fluorocarbon-based gas in the step 1 is increased and accordingly the fluorocarbon amount is increased, the hole is slightly oblique. When the oxidizing gas in the step 2 is increased, the hole is upright. Different hole etching profiles can be obtained as required by adjusting parameters to be between the two amounts.

The invention discloses a method for etching a metal tungsten material, which is characterized in that: an etching mask is formed on the metal tungsten material, and then a high-density plasma (such as inductively coupled plasma, transformer coupled plasma and the like) dry etching process is adopted to produce high-density and high-energy ions and free radicals and to realize the high-speed and anisotropic etching of the metal tungsten material. The etching speed can reach 2.95 micrometers per minute, and the verticality of an etching-resulted side wall can reach 60 degrees. Based on the method, a metal tungsten underlay substrate can be used as a main body material for preparing micro-electro-mechanical system (MEMS) devices.

The invention provides a thermal insulation workpiece based on fused deposition modeling and a preparation method thereof. Taking advantage of the designability of 3D printing, design optimization iscarried out from the following three aspects: material body-introduction of low thermal conductivity filler and microstructure into thermoplastic polymer-introduction of low melting point phase changematerial and printing process through design of a two-component spray head-introduction of sodium bicarbonate powder combined with post-treatment heating to improve the porosity of the workpiece. Thesynergistic effect of three aspects realizes excellent thermal insulation performance of the workpiece. Besides, a line deposited by adopting the spray head in the 3D printing process has a skin-corestructure, the change of micro-components of the deposited line can be realized by changing process parameters according to actual requirements, the regulation and control of microscopic performanceare realized, and further, the macroscopic anisotropy of the workpiece is realized.

The invention relates to a heat-insulating material, particularly relates to a polyether-ether-ketone modified pelletizing material with low heat-conducting coefficient as well as application thereof,and belongs to the technical field of a macromolecular modified material. The polyether-ether-ketone modified pelletizing material with low heat-conducting coefficient is obtained by extruding and pelletizing the following components in percentage by mass: 60 to 89.9 percent of polyether-ether-ketone resin, 10 to 39.5 percent of modified diatomite and 0.1 to 5 percent of carbon nanotube; the modified diatomite is obtained by sequentially performing purification, modification and roasting treatment on roasted diatomite and/or fluxing roasted diatomite raw materials; and the roasting temperature of the roasted diatomite and/or fluxing roasted diatomite raw materials is not less than 450 DEG C and the roasting time of the roasted diatomite and/or fluxing roasted diatomite raw materials is not less than 2 hours. Compared with the common polyether-ether-ketone modified pelletizing material, the polyether-ether-ketone modified pelletizing material with low heat-conducting coefficient has better heat-insulating effect and has high strength and size stability.

The invention provides an ultrasonic-assisted laser micro-cladding device for a gradient functional composite material. The ultrasonic-assisted laser micro-cladding device comprises a rack, a preset piece sample preparation assembly and an ultrasonic-assisted laser micro-cladding assembly, wherein the preset piece sample preparation assembly and the ultrasonic-assisted laser micro-cladding assembly are installed on the rack. The ultrasonic-assisted laser micro-cladding assembly comprises a laser micro-cladding head assembly and an ultrasonic-assisted workbench assembly. The invention also provides an ultrasonic-assisted laser micro-cladding method for the functional gradient composite material, which comprises the following steps: in the early stage of implementation, according to the gradient material theory, preparing a preset sheet sample through the procedures of controlling the component proportion of the copper-based composite material, performing a wet ball milling process, performing ultrasonic-assisted processing on the preset sheet, performing vacuum drying and demolding and the like; and then preparing the preset sheet sample into the graphene/copper-based gradient functional composite coating through a multi-channel and multi-layer processing mode under the action of a composite energy field based on an ultrasonic-assisted laser micro-cladding process. According to the method, the high-quality gradient functional composite coating can be formed in a metallurgical bonding mode through the laser micro-cladding technology.