52 results about "Ultrasonic soldering" patented technology

A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and / or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time / speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.

The invention provides an In tin-coated copper foil stripe lead and connecting method thereof. The method tenaciously connects a conductor electrode on a glass substrate to a ribbon conductor with certainty at low cost without causing damage. An indium-solder-coated copper foil ribbon conductor (1) obtained by depositing an indium solder (3) (100-90% indium and 10-0% silver) in a thickness of 100um or smaller on one side of a copper foil or tin-coated copper foil (2) having a thickness of 300 um or smaller and optionally further depositing the solder thinly on the other surfaces of the foil is placed on an exposed part of a molybdenum-based metallic back electrode layer (4B) on a glass substrate (4A). An ultrasonic soldering iron (5) is then placed against the upper side of the copper foil ribbon conductor (1) to melt the indium solder (3) and connect the copper foil ribbon conductor 1 to the electrode layer (4B). Another method includes soldering an indium solder (3) (having the same composition as shown above) to the electrode layer (4B) beforehand, subsequently placing a ribbon-form copper foil or tin-plated copper foil (2) thereon, and connecting the copper foil (2) to the electrode layer 4B with an ultrasonic soldering iron (5).

The invention discloses an aluminum alloy seal structure local flame heating ultrasonic braze welding method which is used for conducting sealing and braze welding encapsulation on aluminum alloy cavities of built-in electronic components. The aluminum alloy seal structure local flame heating ultrasonic braze welding method comprises the first step of polishing and clearing an aluminum alloy surface of a joint to be brazed through abrasive paper; the second step of placing low-temperature Sn-based brazing filler metal on one side of the lap joint end of an aluminum alloy sealing surface; the third step of conducting local reciprocating heating on the brazing filler metal through gas flame flow to make the brazing filler metal melt and maintain a liquid state, and no heating on parent metal; the fourth step of applying ultrasonic vibration on a cavity of the aluminum alloy to be welded; the fifth step of finishing sealing the test piece through natural cooing after the ultrasonic vibration is finished. According to the aluminum alloy seal structure local flame heating ultrasonic braze welding method, overall heating is not conducted when the aluminum alloy seal structure is welded, local heating is conducted only on the brazing filler metal area, heating on a sealing element is extremely small, and the electronic components in the sealing element are not affected by heat. The aluminum alloy seal structure local flame heating ultrasonic braze welding method has the advantages of being simple in technology, high in welding efficiency, and suitable for the engineering application.

The invention relates to an ultrasonic-assisted low-temperature glass brazing method. The ultrasonic-assisted low-temperature glass brazing method aims at solving the problems that in the existing process of brazing through low-temperature glass, as the viscosity of fusion glass under low temperature is large and a welding line is narrow, wetting spreading is not sufficient, and air hole remaining exists. The brazing method includes the steps that (1) low-temperature sealing glass powder and a binding material are mixed to obtain low-temperature glass brazing soldering paste; (2) a to-be-soldered raw material is cut and molded; (3) a soldered piece is subject to ultrasonic washing and polishing; (4) the low-temperature glass brazing soldering paste is coated to pre-connecting positions of the soldered piece; (5) the pre-connecting positions of the soldered piece are attached to form a to-be-soldered piece; and (6) heating is carried out to fuse the low-temperature glass brazing soldering paste, secondary ultrasonic vibration is applied to the surface of the to-be-soldered piece, and furnace cooling is carried out after vibration is stopped. The low-temperature sealing glass used in the method is low in sealing temperature, effective wetting spreading on the surface of the welded piece is carried out under the ultrasonication, obtained brazing connectors are free of macroscopic defects such as cracks and air holes, the residual stress is small, the strength is high, and the gas tightness is good.

The invention provides an ultrasonic soldering method, comprising an ultrasonic soldering device, the ultrasonic soldering device includes a frame, a heating device, a discharging mechanism and an ultrasonic mechanism; the discharging mechanism is arranged at the upper end of the frame, and the heating device is arranged at the lower end of the frame; the ultrasonic mechanism It is connected with the discharge mechanism; the present invention controls the amount of tin when soldering is different through the different sizes of the pads; avoiding that the size of the pads is large and the amount of tin is too small, causing the LED chip to be unable to be firmly welded on the pads; at the same time, it can avoid If the size of the pad is too small and the amount of tin is too much, the LED chip moves on the pad, resulting in unreliable connection; soldering through an ultrasonic mechanism can accurately control the amount of tin with high precision.

The invention provides an aluminium wire coil made by ultrasonic soldering and manufacturing method thereof. The invention plates on surface of wire by ultrasonic soldering so as to improve soldering force between the printed circuit board and copper foils and ensure the conductive property, omit pretreatment of soldering and increase work efficiency and production efficiency, prevent environmental pollution caused by using flux. The invention provides an aluminium wire coil made by ultrasonic soldering, comprising steps of forming insulating coating on surface of aluminium wire, dipping a wire end on which the coating is removed into a solder box applied ultrasonic wave to form a solder plated layer by ultrasonic soldering.

The invention relates to low-temperature ultrasonic SnBi-based brazing filter metal, a production method thereof and a method for ultrasonically brazing ceramics and / or ceramic-based composite, belongs to the technical field of ceramic and ceramic-based composite brazing, and solve the problems that brazing can only be performed under high temperature, effective connection is hard to form, and residual heat stress formed during cooling causes weld cracking in the prior art are solved. The low-temperature ultrasonic SnBi-based brazing filter metal comprises Bi, Cu, Al, mixed rare earth (RE) and Sn. The production method includes: heating a muffle furnace, feeding Ar gas into the muffle furnace, placing a crucible with Cu into the muffle furnace until Cu melts completely, sequentially adding Al, Sn, Bi and mixed rare earth, and preserving heat for 20-60 minutes. The brazing method includes: applying pressure, using an ultrasonic tool head to directly press a to-be-welded part in a clamp, heating to 170-200 DEG C under an atmosphere environment, and applying ultrasonic brazing. The method uses ultrasonic brazing to connect ceramics and or ceramic composite.