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Low-temperature ultrasonic SNBI-based solder and its preparation method, and its method for ultrasonically brazing ceramics and/or ceramic matrix composites

An ultrasonic and low-temperature technology, applied in welding/cutting media/materials, welding media, manufacturing tools, etc., can solve problems such as difficult to form effective connections and weld cracking, so as to improve brittleness, avoid cracking, and increase nucleation rate Effect

Active Publication Date: 2017-07-11
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention solves the problem that the brazing of ceramics and / or ceramic-based composite materials using the existing active brazing material can only be brazed at high temperature (850°C), and it is difficult to form an effective connection, and the weld seam cracks due to residual thermal stress during the cooling process. problem; and provide low-temperature ultrasonic SnBi-based solder and its preparation method, and ultrasonic brazing ceramics and / or ceramic-based composite materials

Method used

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  • Low-temperature ultrasonic SNBI-based solder and its preparation method, and its method for ultrasonically brazing ceramics and/or ceramic matrix composites
  • Low-temperature ultrasonic SNBI-based solder and its preparation method, and its method for ultrasonically brazing ceramics and/or ceramic matrix composites
  • Low-temperature ultrasonic SNBI-based solder and its preparation method, and its method for ultrasonically brazing ceramics and/or ceramic matrix composites

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specific Embodiment approach 1

[0023] Specific implementation mode 1: The chemical composition of the low-temperature ultrasonic SnBi-based solder in this implementation mode is shown in Table 1:

[0024] Table 1 is the chemical composition (by weight percentage) of low-temperature ultrasonic SnBi-based solder

[0025]

[0026] Among them, the chemical composition of trace mixed rare earth (RE) is shown in Table 2:

[0027] Table 2 is the chemical composition (by weight percent) of mixed rare earth (RE)

[0028]

[0029] The preparation method of low-temperature ultrasonic SnBi-based solder in the present embodiment is as follows:

[0030] Put Cu into the crucible, heat the muffle furnace to 1200 ° C, and fill it with Ar gas, put the crucible into the muffle furnace, keep it warm until Cu is completely melted, add Al, Sn, Bi, and mix Rare earth RE, and then keep it warm for 30 minutes; after cooling, a low-temperature ultrasonic SnBi-based solder is obtained.

[0031] In the present embodiment, the...

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Abstract

The invention relates to low-temperature ultrasonic SnBi-based brazing filter metal, a production method thereof and a method for ultrasonically brazing ceramics and / or ceramic-based composite, belongs to the technical field of ceramic and ceramic-based composite brazing, and solve the problems that brazing can only be performed under high temperature, effective connection is hard to form, and residual heat stress formed during cooling causes weld cracking in the prior art are solved. The low-temperature ultrasonic SnBi-based brazing filter metal comprises Bi, Cu, Al, mixed rare earth (RE) and Sn. The production method includes: heating a muffle furnace, feeding Ar gas into the muffle furnace, placing a crucible with Cu into the muffle furnace until Cu melts completely, sequentially adding Al, Sn, Bi and mixed rare earth, and preserving heat for 20-60 minutes. The brazing method includes: applying pressure, using an ultrasonic tool head to directly press a to-be-welded part in a clamp, heating to 170-200 DEG C under an atmosphere environment, and applying ultrasonic brazing. The method uses ultrasonic brazing to connect ceramics and or ceramic composite.

Description

technical field [0001] The invention belongs to the technical field of brazing of structural ceramics and composite materials thereof, and in particular relates to a low-temperature ultrasonic SnBi-based solder and a preparation method thereof, and a method for ultrasonically brazing ceramics and / or ceramic-based composite materials. Background technique [0002] Ceramics have high mechanical strength, good wear resistance, corrosion resistance, and good thermal stability. Sapphire is the most commonly used type of ceramic. [0003] Sapphire is widely used in optical devices and window materials due to its good optical properties. However, with the demand for large-aperture optical materials in modern optical systems, the size of sapphire obtained through artificial growth can no longer meet the demand. Currently, the only way to achieve large optical windows is by joining small pieces of sapphire together. Therefore, the connection technology of sapphire has become a hot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40C04B37/00
CPCB23K35/264B23K35/40C04B37/00C04B37/001
Inventor 闫久春徐陈晓光于汉臣
Owner HARBIN INST OF TECH
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