134 results about "Electrochemical dissolution" patented technology

Aspects of the invention generally provide a method for polishing a material layer using electrochemical deposition techniques, electrochemical dissolution techniques, polishing techniques, and / or combinations thereof. In one aspect of the invention, the polishing method comprises applying a separate electrical bias, such as a voltage, to each of a plurality of zones of an electrode. Determining the separate biases comprises determining a time that at least one portion of the material layer is associated with each of the zones of the counter-electrode.

The invention provides a synchronous composite processing method of micro-hole electric sparks and different electrolytic areas and a special tool of the synchronous composite processing method. The synchronous composite processing method includes that a tube electrode is switched to impulse voltage, and a neutral salt solution with ultra-low concentration flows into a processing area via the inner side of the tube electrode at a high speed, and then flows out of the processing area along a gap between the tube electrode and a workpiece; an end face of the tube electrode is subjected to high-speed punch processing with axial feeding of electric sparks under the ultra-low concentration of the neutral salt solution, and a hole wall processed by the electric sparks is subjected to radical electrochemical finishing and machining under the action of low-pressure voltage. By the synchronous composite processing method, processing precision is guaranteed, punching efficiency is improved, and processing requirements on various kinds of holes of an aircraft engine are met. Different from conventional electric spark processing and electrolytic processing, the synchronous composite processing method adopts the neutral salt solution with the ultra-low concentration, so that processing efficiency in electrochemical dissolution can be greatly improved and corrosion degree of equipment can be decreased.

An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

A display element comprising a pair of electrodes having therebetween an electrolyte layer containing silver or a silver-containing compound, the display element being driven by the pair of electrodes so as to electrochemically dissolve silver or to electrochemically deposit silver, wherein the electrolyte layer contains an antioxidant selected from the group consisting of a phenolic antioxidant, a phosphoric acid antioxidant, a sulfur-containing antioxidant, an amine antioxidant and a hydroquinone derivative.

The invention discloses a device for continuous mask electrolytic machining of a metal microstructure. The device comprises a liquid spraying nozzle, an electrolytic power source, a workpiece positiveelectrode, a tool negative electrode, a gas spraying nozzle, a mask belt, a belt storage wheel, a belt recovery wheel, a driving source, a carrier roller and a tensioning wheel, wherein the mask beltwith a hollow pattern or seepage micropores is tightly pressed and attached to the surface of the tool negative electrode under the combined action of the belt recovery wheel, the tensioning wheel, the belt storage wheel and the like to form a wrap angle, and then is tightly pressed and attached to the to-be-machined surface of the rotatable or movable workpiece positive electrode; the belt recovery wheel continuously recovers the mask belt and drives the workpiece positive electrode and the tool negative electrode to do synchronous uniform motion; the liquid spraying nozzle sprays electrolyte at a high speed; and the workpiece positive electrode is subjected to uniform localized electrochemical dissolution alternately under the combined action of an electric field and a flow field untilthe workpiece is machined. The invention provides a new technology for continuous mask electrolytic machining of the metal microstructure, the process adaptability and stability of movable mask electrolytic machining can be improved, and a metal micro-nano structure with high precision and high surface quality is obtained.

The invention relates to an electrochemical dissolving method for iridium powder, which is comprises the following steps: adding a hydrochloric acid solution and iridium powder in a U-shaped electrolytic bath, loading the alternating current at two ends of electrode of the U-shaped electrolytic bath, directly dissolving iridium powder in hydrochloric acid to obtain a chloro-iridic acid aqueous solution; filtering the chloro-iridic acid aqueous solution, then distilling to obtain a chloro-iridic acid concentrate. The electrochemical dissolving method for iridium powder is characterized in that the raw material iridium powder is directly dissolved in hydrochloric acid without adding any other reagents, the impurities interference can be avoided when the high purity iridium powder is taken as a raw material, so that the high purity chloro-iridic acid H3IrCl6 aqueous solution is prepared.

A display element containing a pair of electrodes having therebetween an electrolyte layer containing silver or a silver-containing compound, the display element being driven by the pair of electodes so as to electrochemically dissolve silver or to electrochemically deposit silver, wherein the electrolyte layer contains a compound represented by on of Formulae (1) to (7) described in the specification or a derivative thereof.