1382results about "Electrochemical machining apparatus" patented technology

Abstract of the Disclosure A gapfill process is provided using cycling of HDP-CVD deposition, etching, and deposition step. The fluent gas during the first deposition step includes an inert gas such as He, but includes H2 during the remainder deposition step. The higher average molecular weight of the fluent gas during the first deposition step provides some cusping over structures that define the gap to protect them during the etching step. The lower average molecular weight of the fluent gas during the remainder deposition step has reduced sputtering characteristics and is effective at filling the remainder of the gap.

An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent. The invention further includes an electrolyte solution adapted for polishing stents composed of nickel-titanium alloy and a method of using the electrolyte in combination with the electro-polishing fixture.

The invention provides articles of manufacture comprising biocompatible nanostructures comprising nanotubes and nanopores for, e.g., organ, tissue and / or cell growth, e.g., for bone, kidney or liver growth, and uses thereof, e.g., for in vitro testing, in vivo implants, including their use in making and using artificial organs, and related therapeutics. The invention provides lock-in nanostructures comprising a plurality of nanopores or nanotubes, wherein the nanopore or nanotube entrance has a smaller diameter or size than the rest (the interior) of the nanopore or nanotube. The invention also provides dual structured biomaterial comprising micro- or macro-pores and nanopores. The invention provides biomaterials having a surface comprising a plurality of enlarged diameter nanopores and / or nanotubes.

A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.

A wafer chuck assembly for holding a wafer during electroplating and / or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.

Methods for forming a support frame for flexible leaflet heart valves from a starting blank include converting a two-dimensional starting blank into the three-dimensional support frame. The material may be superelastic, such as NITINOL, and the method may include bending the 2-D blank into the 3-D form and shape setting it. A merely elastic material such as ELGILOY may be used and plastically deformed in stages, possibly accompanied by annealing, to obtain the 3-D shape. Alternatively, a tubular blank could be formed to define a non-tubular shape, typically conical. A method for calculating the precise 2-D blank shape is also disclosed. A mandrel assembly includes a mandrel and ring elements for pressing the blank against the external surface of the mandrel prior to shape setting.

Plating accelerator is applied selectively to a substantially-unfilled wide (e.g., low-aspect-ratio feature cavity. Then, plating of metal is conducted to fill the wide feature cavity and to form an embossed structure in which the height of a wide-feature metal protrusion over the metal-filled wide-feature cavity is higher than the height of metal over field regions. Most of the overburden metal is removed using non-contact techniques, such as chemical wet etching. Metal above the wide feature cavity protects the metal-filled wide-feature interconnect against dishing, and improved planarization techniques avoid erosion of the metal interconnect and dielectric insulating layer. In some embodiments, plating of metal onto a substrate is conducted to fill narrow (e.g., high-aspect-ratio feature cavities) in the dielectric layer before selective application of plating accelerator and filling of the wide feature cavity.

Articles containing fine-grained and / or amorphous metallic coatings / layers on at least part of their exposed surfaces are imprinted with surface structures to raise the contact angle for water in the imprinted areas at room temperature by equal to or greater than 10°, when compared to the flat and smooth metallic material surface of the same composition.

Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and reflectivity of the nanostructures through steps of plating the conductive nanostructures followed by etching or oxidizing the underlying conductive nanostructures.

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.

A method of fabricating a component is provided. The fabrication method includes depositing a first layer of a structural coating on an outer surface of a substrate. The substrate has at least one hollow interior space. The fabrication method further includes machining the substrate through the first layer of the structural coating, to define one or more openings in the first layer of the structural coating and to form respective one or more grooves in the outer surface of the substrate. Each groove has a respective base and extends at least partially along the surface of the substrate. The fabrication method further includes depositing a second layer of the structural coating over the first layer of the structural coating and over the groove(s), such that the groove(s) and the second layer of the structural coating together define one or more channels for cooling the component. A component is also disclosed.

Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.

The invention discloses a microneedle array chip comprising metal microneedles and a substrate, wherein the microneedle consists of a needle head with a tip at its top, a needle bar and a needle seat, and is fixed onto the substrate via the needle seat; and the needle bar of the metal microneedle, having a cylindrical or conical shape, is inclined toward the substrate at a preset angle, and the needle head has a conical shape, or the upper surface of the tip is an oval plane or oval ring plane parallel to the substrate or inclined toward it at a preset acute angle. The metal microneedles in the microneedle array chip of the invention have firm structures to avoid fracture, and have sharp tips to facilitate puncturing. The maximal puncturing depth of the microneedles is easy to adjust and control. The microneedles in the array have good uniformity, and are safe and reliable to use. The hollow microneedles, like conventional syringe needles, have lateral openings, and thus can effectively avoid the blockage of the infusion poles by skin, thereby facilitating rapid diffusion and absorption of drugs, and resulting in significant therapeutic effects.

The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

A method of fabricating a component is provided. The method includes depositing a fugitive coating on a surface of a substrate, where the substrate has at least one hollow interior space. The method further includes machining the substrate through the fugitive coating to form one or more grooves in the surface of the substrate. Each of the one or more grooves has a base and extends at least partially along the surface of the substrate. The method further includes forming one or more access holes through the base of a respective one of the one or more grooves to connect the respective groove in fluid communication with the respective hollow interior space. The method further includes filling the one or more grooves with a filler, removing the fugitive coating, disposing a coating over at least a portion of the surface of the substrate, and removing the filler from the one or more grooves, such that the one or more grooves and the coating together define a number of channels for cooling the component.

A method is provided for forming a conductive interconnect, the method comprising forming a first dielectric layer above a structure layer, forming a first opening in the first dielectric layer, and forming a first conductive structure in the first opening. The method also comprises forming a second dielectric layer above the first dielectric layer and above the first conductive structure, forming a second opening in the second dielectric layer above at least a portion of the first conductive structure, the second opening having a side surface and a bottom surface, and forming at least one barrier metal layer in the second opening on the side surface and on the bottom surface. In addition, the method comprises removing a portion of the at least one barrier metal layer from the bottom surface, and forming a second conductive structure in the second opening, the second conductive structure contacting the at least the portion of the first conductive structure. The method further comprises forming the conductive interconnect by annealing the second conductive structure and the first conductive structure.

An ionic liquid ion source can include a microfabricated body including a base and a tip. The microfabricated body can be formed of a porous metal compatible (e.g., does not react or result in electrochemical decaying or corrosion) with an ionic liquid or a room-temperature molten salt. The microfabricated body can have a pore size gradient that decreases from the base of the body to the tip of the body, so that the ionic liquid can be transported through capillarity from the base to the tip.

An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

A method of forming a silicon anode material for rechargeable cells includes providing a metal matrix that includes no more than 30 wt % of silicon, including silicon structures dispersed therein. The metal matrix is at least partially etched to at least partially isolate the silicon structures.

A method is provided for manufacturing a component. The method includes connecting a component comprising an internal passage and formed by an additive manufacturing process to a power supply, the component functioning as an anode, connecting a cathode to the power supply, the cathode being disposed in an electrolyte solution, the cathode being positioned externally to the internal passage of the component, contacting the internal passage of the component with the electrolyte solution, and using the power supply, applying a potential difference and current flow between the component and the cathode.

The present invention pertains to a method for removing a substance (X) from a solid metal or semi-metal compound (M<1>X) by electrolysis in a melt of M<2>Y, which comprises conducting the electrolysis under conditions such that reaction of X rather than M<2 >deposition occurs at a electrode surface, and that X dissolves in the electrolyte M<2>Y. The substance X is either removed from the surface (i.e., M<1>X) or by means of diffusion extracted from the case material. The temperature of the fused salt is chosen below the melting temperature of the metal M<1>. The potential is chosen below the decomposition potential of the electrolyte.

Polishing compositions and methods for removing conductive material and barrier layer materials from a substrate surface are provided. Generally, variable amounts of abrasive particles are used for removing conductive material and barrier layer materials. In one aspect, a process is provided including providing an polishing composition between the first electrode and the substrate, wherein the polishing composition comprises a first concentration of abrasive particles, applying a bias between the first electrode and the second electrode, providing relative motion between the substrate and the polishing article, removing conductive layer material from the substrate, introducing abrasive particles to the polishing composition to form a second concentration of abrasive particles greater than a first concentration of abrasive particles, and removing barrier layer material from the substrate. The abrasive particles may be incrementally introduced or pulsed during a polishing process.

The invention provides an electrolytic machining method for a thin-wall machine case of an aero-engine, belonging to the technical field of electrolytic machining. The electrolytic machining method mainly aims at the machining of a surface concave-convex structure of a complicated thin-wall rotary body part in the aviation field, and is characterized in that a tool cathode is of a thin-wall strip-shaped structure or a rigid rotary body structure; window or lug boss structures with different shapes are distributed on the surface of the cathode. In a machining process, a workpiece anode automatically rotates and the tool cathode is fed to the anode in a peripheral movement process. In the whole machining process, electrodes do not need to be replaced, and the surface concave-convex structure of the thin-wall rotary body part is machined and molded once through rolling sleeve electrolytic action of a cathode window.

Devices for enhancing the sensitivity of a microsensor or any other micro device by providing on-line preconcentration. Microconcentrators that can be integrated with a sensor or a micromachined GC to enhance the signal to noise ratio can include a miniaturized sorbent trap fabricated on a microchip. The microconcentrator can be made on a silicon substrate so that a sensor can be integrated on the same chip. The microconcentrator is composed of at least one microchannel lined with a microheater for in-situ heating. Preconcentration may be achieved on a thin-film polymeric layer deposited above the heater in the microchannel. Rapid heating by the channel heater generates a “desorption pulse” to be injected into a detector or a sensor.