A plasmaprocessing apparatus wherein a layer structure consisting of plural layers formed in stack one upon another on a semiconductorwafer placed on the sample holder located in the process chamber, is etched with plasma generated in the process chamber by supplying high frequency power to the electrode disposed in the sample holder, the apparatus comprising a ring-shaped electrode disposed above the electrode and around the periphery of the top portion of the sample holder, an outer circumferential ring of dielectric material disposed above the ring-shaped electrode and opposite to the plasma, and a power source for supplying power at different values to the ring-shaped electrode depending on the sorts of layers of the layer structure.
A method for conformal dry etch of a liner material in a high aspect ratio trench is achieved by depositing or forming an inhomogeneous passivation layer which is thicker near the opening of a trench bat thinner deep within the trench. The methods described herein use a selective etch following formation of the inhomogeneous passivation layer. The selective etch etches liner material faster than the passivation material. The inhomogeneous passivation layer suppresses the etch rate of the selective etch near the top of the trench (where it would otherwise be fastest) and gives the etch a head start deeper in the trench (where it would otherwise be slowest). This method may also find utility in removing bulk material uniformly from within a trench.
Detergent or bleach composition comprising a host-guest complex of diacyl and / or tetraacyl peroxide bleaching species in the form of an aggregate having a weight average particle size of at least 106 μm and an anti-deposition polymer.
The invention provides a three-dimension laser fine machiningsystem and method for crisp and hard materials. The method comprises the steps that a laser scanning machining scheme according to the model of a to-be-machined part, the model of a machining pattern and the machining requirements, specifically, the scheme comprises the process of determining the laser machining parameters and the process of determining the number of machining layers; scanning filling schemes corresponding to the machining layers are made in the pattern filling area; the laser focus is adjusted dynamically in the machining process, light spots are made to keep focusing in each machining position, and focus spots are uniform and coincident; the laser scanning filling schemes are changed every time one or more layers of materials are scanned and removed; and after one or more layers are scanned in the pattern filling area, laser contour scanning is conducted in the pattern contour area one or more times. The three-dimension laser fine machining system and method for the crisp and hard materials can achieve high-precision and efficient machining of the crisp and hard materials by making full use of the various advantages of fine light spotlaser scanning machining.
In a replacement gate approach, the dielectric cap layers of the gate electrode structures are removed in a separate removal process, such as a plasma assisted etch process, in order to provide superior process conditions during the subsequent planarization of the interlayer dielectric material for exposing the sacrificial gate material. Due to the superior process conditions, the selective removal of the sacrificial gate material may be accomplished with enhanced uniformity, thereby also contributing to superior stability of transistor characteristics.
In an exhaust gas purifying system (1) which is equipped with a NOxocclusion reduction type catalyst (11) and an oxidation catalyst (12) set on the upstream side of the catalyst (11) and in which sulfur purge control for regenerating the sulfur-poisoned catalyst (11) is conducted, in conducting the sulfur purge control, the air fuel ratio control for sulfur purge is conducted after the temperature difference (ΔTIO) between the inlet side and outlet side of the catalyst (11) has been reduced to a prescribed level (ΔT0) or below by raising the exhaust temperature. According to the invention, the sulfur poison on the catalyst (11) can be uniformly removed in the sulfur-purge regeneration control, whereby the service life of the catalyst (11) can be protected from being shortened by sulfur poisoning. Further, the catalyst (11) can be protected from the thermal deterioration caused by partial temperature rise inside the catalyst (11) on its downstream side, so that the service life of the catalyst (11) can be protected from being shortened by thermal deterioration.
In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask, a laser beam is moved in the region of the perforated mask on a circular path. The center point of the region lies concentrically with respect to the set position of the respective hole in the mask. Further, the diameter of the region is smaller than the diameter of the hole. At the same time, the diameter of the laser beam spot is chosen to be large enough that it always covers the center point of the perforated mask during the circular motion. As a result, an energy distribution of the laser energy, which is as uniform as possible, is achieved in the region of the perforated mask.
In a fuel cell, a porous portion is formed in a separator. At a surface of the porous portion opposite to a surface where a reactant gas passage is formed, a cooling gas passage is formed. The cooling gas passage may be fluidly connected to a reactant gas supply passage for supplying reactant gas to the fuel cell. The cooling gas passage is controllable in flow amount. The porous portion is formed only in a separator portion where a downstream portion of the reactant gas passage is located. At a separator portion where an upstream portion of the reactant gas passage is located, a coolant passage is formed. A rib and a rib-bottom portion have a great porosity. A groove may be filled with porous material. The porous portion may be replaced by a water exchange portion. A portion of the separator other than the region of the porous portion may be made by porous material. Due to these, a fuel cell can be obtained where removal of product water is improved, product water can be utilized for humidifying gas, and product water can be uniformly removed.