69results about How to "Achieve electrical continuity" patented technology

A connector having a conductively coated member is provided, wherein the connector comprises a connector body capable of sealing and securing a coaxial cable, and further wherein the conductively coated member, such as an O-ring, physically seals the connector, electrically couples the connector and the coaxial cable, facilitates grounding through the connector, and renders an electromagnetic shield preventing ingress of unwanted environmental noise.

A shaped member having at least one window is located within a GFCI protected receptacle and is operated by movement of the contact arm of the GFCI to assume a first position to block at least one plug receiving opening in the receptacle and a second position which locates the window to allow the prong of a plug to freely enter the face of the receptacle. In operation, when the circuit interrupting device goes into a tripped state, the contact arm moves down to open the circuit. The downward movement of the contact arm, acting through a connecting linkage causes the shaped member to move to the first position, that of blocking at least one opening in the face of the receptacle. Resetting the circuit interrupting device by pressing in and then releasing the reset button of the GFCI causes the main contacts in the circuit interrupting device to close by the upward movement of the contact arm. As the contact arm moves up, it moves the connecting linkage to position the window of the shaped member to allow the prongs of a plug to freely enter the openings in the face of the receptacle. GFCI's normally have two separate sets of internally located contacts known as bridge contacts, one set for connecting a load to the source of electricity and a second set for connecting a user accessible load to the source of electricity. In the GFCI here disclosed the bridge contacts have been eliminated, thus reducing the cost of manufacture by coupling the conductors for both the load and the user accessible load to a single set of contacts.

A crimping tool with a quick-change crimp head for sealing and electrically crimping electrical contacts to insulated wires. The crimping tool includes a base unit with a receptacle that is configured to actuate and removably and replaceably receive the quick-change crimp head. A crimping die holder body includes a plurality of crimp-seal and continuity-crimping dies. These dies are mounted for movement in the crimping die holder body between an open configuration and a fully crimped configuration. The crimp-seal dies have arcuate die faces that define a substantially closed generally cylindrical form when the dies are in the fully crimped configuration. Actuators are mounted in the base unit. The actuators are adapted to cause the dies to move in the body. A sensor system is configured to prevent the crimping tool from unintentionally repeating a crimping operation on the electrical contact, and to verify continuity-crimp depth of indentation.

An inkjet head for ejecting ink droplets is disclosed which includes: a nozzle unit having metal thin plates and a piezoelectric device, adapted to eject the ink droplets; a printed circuit board supplying to the piezoelectric device a drive signal for causing the nozzle unit to eject the ink droplets; a support supporting the nozzle unit and the printed circuit board in opposing relationship to each other; an earth contact disposed on the nozzle unit; a ground contact disposed on the printed circuit board, held at a reference potential; an electrically conductive elastic member disposed between the earth and ground contacts, such that portions of the elastic member are in electrical contact with the earth and ground contacts, respectively; and a movement limiter limiting movement of the elastic member to thereby prevent the elastic member from being disengaged from the earth and ground contacts.

The invention concerns a method for making a waveguide microwave antenna with corrugated horn (5), which consists in forming the corrugations of the horn on the outer surface of a synthetic material foam block followed by surface metallization of the foam block configured to produce the antenna.

The invention relates to a preparation method of an anode of a flexible OLED display panel and a preparation method of the display panel. The preparation method of the anode comprises that a metal stretched protective layer is deposited in the surface of an organic light emitting layer; a transparent conductive film layer is formed in the surface of the metal stretched protective layer by vapor plating or re-sputtering; and the transparent conductive film layer is combined with the metal stretched protective layer to form the anode of the display panel. When the display panel is in a bent state, fracture of the transparent conductive film layer in the display panel is delayed, and the service life of the whole display panel in the bent state is prolonged; when the transparent conductive film layer of the flexible display panel has cracks, the metal stretched protective layer has good conductivity, and a fractured area of the transparent conductive film layer can realize a conductive performance via the metal stretched protective layer, normal display of the fractured area is protected, the optical fraction defective is reduced, and the total visual feeling is improved.

A burn-in process for a semiconductor integrated circuit device includes a first process of positioning bump electrodes of the semiconductor integrated circuit device with respect to pads of a socket having detachment mechanisms, a second process of pressing the bump electrodes against the pads by weighting the semiconductor integrated circuit device, and a third process of detaching the bump electrodes from the pads by exerting force on the semiconductor integrated circuit device in a direction opposite to a weighting direction of the second process. Automatic insertion and detachment of a semiconductor integrated circuit chip in a burn-in test is facilitated by detaching the bump electrodes from the pads by pushing up the semiconductor integrated circuit device.