33results about How to "Reduced manufacturing method" patented technology

A structure for the front portion of a vehicle is provided with a bumper face which is provided at the front end of the vehicle and a lower grille which is disposed at a bumper opening in the bumper face. The bumper face is provided with: a hook cover (20) which is formed integrally within the bumper opening with the bumper face and then separated from the bumper face; and a hook cover holding mechanism (26) which is formed integrally within the bumper opening with the bumper face and which supports and affixes in a removable manner the hook cover (20). The hook cover (20) has: a cover body (40) which closes a hook cover mounting section provided to the bumper face; and a cover engagement claw (32) which is engaged with a bumper engagement section provided to the hook cover mounting section. The hook cover holding mechanism (26) has a holding engagement claw (34) with which the cover engagement claw (32) is engaged in a supported manner when the hook cover (20) is elastically deformed.

An object of the invention is to prevent pinhole defects of single-crystalline silicon while decreasing carbon concentration in the second piece of single-crystalline silicon and thereafter in multi pulling method. The solution is to repeat a step heating and melting silicon raw materials filled in a quartz crucible 12 in a chamber 10 utilizing a heater 15 and a step pulling up a single-crystalline silicon 2 from a silicon melt 3 in the quartz crucible 12 so as to fabricate a plurality of single-crystalline silicon 2 utilizing the same quartz crucible 12. The furnace pressure in the chamber 10when melting the supplementary silicon raw materials provided into the quartz crucible 12 for pulling up the second single-crystalline silicon 2 and thereafter is set to be higher than the furnace pressure in the chamber 10 when melting the silicon raw materials provided into the quartz crucible 12 for pulling up the first single-crystalline silicon 2.

A vehicle front structure includes: a bumper face disposed at a vehicle front end; and a lower grill disposed at a bumper opening section of the bumper face. The bumper face includes: a hook cover (20), after formed integrally with the bumper face within the bumper opening section, separated from the bumper face; and a hook cover holding mechanism (26) formed within the bumper opening section integrally with the bumper face to detachably fix the hook cover (20). The hook cover (20) includes: a cover body section (40) for closing a hook cover attachment portion in the bumper face; and a cover snap-fit claw (32) for snap-fitting onto a bumper engaging portion in the hook cover attachment portion. The hook cover holding mechanism (26) includes a hold latch nail (34) for engaging with the cover snap-fit claw (32) by resilient deformation of the hook cover (20).

The purpose of the present invention is to provide: a silicon-containing polymer composition to be treated, which contains a metal impurity, by treating the silicon-containing polymer composition with an ion exchange resin having a specific structure, whereby the change in weight-average molecular weight ([Delta] Mw) before and after the treatment can be suppressed; the present invention relates to a method for purifying a silicon-containing polymer composition, a silicon-containing polymer composition, and a method for manufacturing a semiconductor device. The present invention is a method for purifying a silicon-containing polymer composition in which the change in weight-average molecular weight ([Delta] Mw) before and after treatment is reduced, characterized by treating a treated silicon-containing polymer composition containing an organic solvent with a gel-type cation exchange resin. The weight-average molecular weight change ([Delta] Mw) before and after the treatment is 70 or less. The ion exchange resin preferably has a highly acidic functional group. The total residual amount of 24 metal elements after the ion exchange treatment is 1 ppb or less.