A compact MEMS motion sensor device is provided, including a
CMOS substrate layer, with plural anchor posts having an isolation
oxide layer surrounding a conductive layer. On one side of
CMOS substrate layer, the device further includes a
field oxide (FOX) layer, a first set and a second set of
implant doped
silicon areas, a first polysilicon layer, an
oxide layer embedded with plural
metal layers interleaved with via hole
layers, a
Nitride deposition layer, an under bump
metal (UBM) layer and a plurality of solder spheres. On the other side of
CMOS substrate layer, the present invention further includes a backside interconnect isolation
oxide layer, a first MEMS bonding layer, a first
metal compound layer, a second MEMS bonding layer, a MEMS layer, a first MEMS
eutectic bonding layer, a second metal compound layer, a second MEMS
eutectic bonding layer, and a MEMS cap layer.