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Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

A technology of copper sulfate solution and manufacturing method, applied in copper sulfate and other directions, can solve problems such as reduced conductivity and the like

Inactive Publication Date: 2018-11-16
JX NIPPON MINING & METALS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] For example, when copper sulfate is used as the raw material of the copper plating bath, there is a problem that aluminum is contained in the copper sulfate as the raw material of the copper plating bath along with the miniaturization of wiring, thereby causing aluminum to precipitate in the copper film and causing Reduced conductivity

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  • Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

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Embodiment

[0123] Hereinafter, although the Example of this invention is shown together with a comparative example, these Examples are provided in order to understand this invention and its advantage more fully, and are not intended to limit invention.

[0124]Commercially available copper sulfate (Cu: 99% or more, Na: 10ppm, Mg: 1.5ppm, Al: 4.5ppm, Ca: 3.9ppm, In: 5.6ppm, Sn: 10ppm, Ag: 3.5ppm) was used as a copper raw material It was mixed with ultrapure water having a resistivity of 15 MΩ·cm or more, and heated and stirred at 100° C. to prepare a copper sulfate raw material solution. Then, the copper sulfate raw material solution was moved to a concentration tank, and kept at a temperature of 100° C. for 2 to 10 hours, thereby evaporating water in the copper sulfate raw material solution and concentrating until the copper concentration became 150 to 250 g / L. The copper sulfate raw material solution heated and concentrated was moved to a crystallization tank, and in the crystallization...

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Abstract

The invention discloses copper sulfate, a copper sulfate solution, a plating solution, a method for producing copper sulfate, a method for producing a semiconductor circuit board, and a method for producing an electronic apparatus, and particularly provides copper sulfate which reduce an aluminum concentration, a copper sulfate solution, a plating solution, a manufacturing method of copper sulfate, a manufacturing method of a semiconductor circuit board and a manufacturing method of an electronic device. The copper sulfate has the Al concentration of 0.08 mass ppm or less.

Description

technical field [0001] The invention relates to copper sulfate, a copper sulfate solution, a plating solution, a method for manufacturing copper sulfate, a method for manufacturing a semiconductor circuit substrate, and a method for manufacturing electronic equipment. Background technique [0002] Copper sulfate is widely used in electrolytic solutions, pigments, insecticides, preservatives, mordants, materials for batteries, pharmaceuticals, and raw materials for plating solutions for electronic parts such as semiconductor devices. [0003] For example, as copper sulfate that can be used as a raw material for electroplating solutions for electronic parts such as electrolytes, pigments, insecticides, preservatives, mordants, battery materials, medicines, and semiconductor devices, Japanese Patent No. 3987069 (Patent Document 1) describes high-purity copper sulfate having a purity of 99.99% by weight and transition metals such as Fe, Cr, and Ni of 3 wtppm or less. In additio...

Claims

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Application Information

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IPC IPC(8): C01G3/10C25D3/58
CPCC01G3/10C25D3/58
Inventor 永浦友太石井雅史
Owner JX NIPPON MINING & METALS CO LTD
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