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Method of manufacturing package and method of manufacturing light emitting device

A manufacturing method and a technology of a light-emitting device, which are applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as reduced visual recognition, and achieve the effect of reducing manufacturing costs

Pending Publication Date: 2020-05-08
NICHIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In a display device in which a plurality of light-emitting devices are evenly arranged, when external light such as sunlight is irradiated on the display device, the surface of the package of the light-emitting device reflects the external light, thereby reducing visibility.

Method used

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  • Method of manufacturing package and method of manufacturing light emitting device
  • Method of manufacturing package and method of manufacturing light emitting device
  • Method of manufacturing package and method of manufacturing light emitting device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0064] [Manufacturing method of light-emitting device]

[0065] refer to figure 1 A method of manufacturing a light emitting device will be described. In addition, refer to Figure 2A ~ Figure 2F A method of manufacturing the package will be described. It should be noted that, for the convenience of explanation, in Figure 2A ~ Figure 2F , Figure 8A ~ Figure 8G and Figure 10 , a partial sectional view of the mold 20 and a side view of the ejector pin 23 and the resin molded body 2 are schematically shown. In addition, colorless means that the surface of the resin molded body is white, and small dots mean that a part of the surface of the resin molded body is black.

[0066] The method of manufacturing a light emitting device includes steps S1 to S7 of manufacturing a package, step S11 of mounting a light emitting element in a recess formed in the package, and step S13 of filling the recess with a sealing member so as to cover the light emitting element.

[0067] The m...

no. 2 approach

[0120] [Manufacturing method of light-emitting device]

[0121] Next, a method of manufacturing the light emitting device of the second embodiment will be described. Hereinafter, the same reference numerals are assigned to the same steps as those in the first embodiment, and description thereof will be omitted. In the manufacturing method of the light-emitting device in this embodiment, the steps S11 and S13 performed after the package is completed are the same as the manufacturing steps in the aforementioned first embodiment, and thus description thereof is omitted.

[0122] [Manufacturing method of package]

[0123] refer to Figure 8A ~ Figure 8G A method of manufacturing the package will be described.

[0124] The manufacturing method of the package of this embodiment includes: step S1, in this step, prepare the lead frame 1 provided with the lead 4 and the resin molded body 2, wherein the resin molded body 2 is molded integrally with the lead 4 and has on the upper sur...

no. 3 approach

[0137] [Manufacturing method of light-emitting device]

[0138] Next, a method of manufacturing the light emitting device of the third embodiment will be described. Hereinafter, the same reference numerals are assigned to the same steps as those in the second embodiment, and description thereof will be omitted. In the manufacturing method of the light-emitting device in this embodiment, the steps S11 and S13 performed after the package is completed are the same as the manufacturing steps in the aforementioned first embodiment, and thus description thereof is omitted.

[0139] [Manufacturing method of package]

[0140] refer to Figure 8A ~ Figure 8G , Figure 9 and Figure 10 A method of manufacturing the package will be described.

[0141] In the manufacturing method of the package of the present embodiment, the step of adhering the ink 5 includes a step 6 in which, after the resin molded body 2 is placed in the cavity 21 filled with the ink 5 , it is applied to the cavi...

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Abstract

Provided are a method for manufacturing a package and a method for manufacturing a light-emitting device, wherein the manufacturing cost is reduced. This method for manufacturing a package includes: apreparation step (S1) for preparing a lead frame provided with a lead and a resin molded body that is integrally molded with the lead and that has a recess for accommodating a light-emitting elementon the upper surface; an arrangement step (S3) in which the resin molded body is arranged in the cavity of the mold in a state in which the inside of the recess of the resin molded body is closed; anadhesion step (S5) in which the cavity is filled with ink having a darker color than the inner surface of the recess, and the ink is adhered to at least a part of the side surface of the resin moldedbody and the upper surface of the resin molded body; and a removal step (S7) in which the resin molded body to which the ink has been adhered is removed from the mold.

Description

technical field [0001] The present disclosure relates to a method of manufacturing a package and a method of manufacturing a light emitting device. Background technique [0002] In a display device in which a plurality of light emitting devices are evenly arranged, when external light such as sunlight is irradiated on the display device, the surface of the package of the light emitting device reflects the external light, thereby reducing visibility. As a measure to make it less susceptible to such external light reflection, for example, there is a method of using a material with a low light reflectance for the package of the light-emitting device. [0003] For example, Patent Document 1 discloses a method of manufacturing a lamp used as a display or a backlight light source, which can achieve high contrast between lighting and non-lighting. In this manufacturing method, the step of applying pad printing to at least the upper surface of the package molded body and the side s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/52H01L33/62
CPCH01L25/0753H01L33/48H01L33/62H01L33/52H01L2933/0033H01L2933/005H01L2933/0066H01L33/58H01L2933/0058H01L33/54
Inventor 光永隆之
Owner NICHIA CORP
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