63results about How to "Improve deep plating ability" patented technology

The invention discloses a potassium chloride cyanide-free cadmium titanium alloy plating solution and a preparation method and electroplating process of the potassium chloride cyanide-free cadmium titanium alloy plating solution. The plating solution per liter comprises 20-35g of cadmium chloride, 80-140g of a complexing agent, 120-200g of potassium chloride, 1-5g of sodium fluoride, 2-5mL of a titanium salt supplement, 1-3mL of a brightening agent, 20-40mL of an auxiliary agent and 5-15mL of a displacement agent. According to the electroplating operation conditions, the pH value of the plating solution is 6.5-7.5, plating bath temperature is 20-35 DEG C, the cathode current density is 0.5-2A / dm<2>, and the area ratio of a cathode to an anode is 2:(1-3). The plating solution is stable, convenient to maintain and small in process hydrogen brittleness, and a cadmium titanium alloy coating is excellent in corrosion resistance and good in market prospect.

The invention discloses an electrolytic copper foil additive. The electrolytic copper foil additive comprises sodium phosphotungstate, polyethylene glycol and sodium 3,3'-dithiodipropane sulfonate, wherein the content of sodium phosphotungstate in an electroplating liquid is 20-300mg / L; the content of polyethylene glycol in the electroplating liquid is 10-200mg / L; and the content of sodium 3,3'-dithiodipropane sulfonate in the electroplating liquid is 20-300mg / L. According to the electrolytic copper foil additive, sodium phosphotungstate is added and hydrolyzed to obtain phosphotungstate radical, an electrode reaction is accelerated by virtue of the complexing action of phosphotungstic acid, and the covering power of a roughening treatment process and the uniformity of surface crystallization are improved. The invention further provides a surface treatment process for an electrolytic copper foil. The surface treatment process for the electrolytic copper foil comprises the steps of acidpickling, roughening, curing, passivating, silane coupling agent coating and drying; the treated copper foil is good in covering power presentation, a compact roughened layer can be formed, and the anti-oxidation and anti-peeling capacity are improved; the roughness Rz of the surface of the treated copper foil is not greater than 8[mu]m, the Rmax is not greater than 10.0[mu]m, the anti-peeling strength is not less than 2.0kg / cm; and additives containing arsenic, lead and other substances are not used in the treatment process, and the requirements of environment protection and sustainable development are met.

The invention provides a high-Tg board production process. The process comprises the following steps: (1) providing a TG board; (2) hole drilling: drilling a through hole in the TG board; (3) baking the board after the hole drilling step; (4) detecting the hole; (5) removing the glue of the through hole by virtue of Plasma; (6) conducting the high-pressure water washing, and cleaning the TG board;(7) conducting the laser hole-drilling operation, and drilling a blind hole in the PCB; (8) conducting the high-pressure water washing; (9) removing the glue of the blind hole by virtue of Plasma, wherein the Plasma-based glue-removing strength of the blind hole is smaller than the Plasma-based glue-removing strength of the through hole; (10) conducting the secondary water washing; (11) pattern manufacturing: manufacturing outer-layer patterns. According to the invention, the glue is removed by virtue of Plasma, so that the effect of removing the drilling sewage is effectively improved. The quality of products is improved. During the removing process of the drilling sewage, the Plasma-based glue removing of the through hole and the Plasma-based glue removing of the blind hole are separated. Therefore, glass fibers in the blind hole are effectively prevented from being protruded. During the plate surface electroplating process and the pattern electroplating process, the parameter matching performance of the two processes are considered. Therefore, the deep plating capability of the copper plating through hole is improved.

The invention relates to a high aspect ratio circuit board through hole electroplating process, and relates to the technical field of circuit board electroplating. A high aspect ratio circuit board through-hole electroplating process, comprising the following steps: using a titanium anode whose surface is coated with iridium and tantalum as an anode, and performing pulse electroplating on the circuit board provided with the through-hole in a copper electroplating solution; The pulse electroplating is forward and reverse pulse current electroplating, and the process conditions are: the forward current density is 1.2-1.8 A / dm 2 , the forward and reverse pulse current amplitude ratio is 1:2‑1:3; the forward pulse time is 100‑200 milliseconds, and the forward and reverse pulse time ratio is 10:1‑20:1; the copper electroplating solution is composed of the following Concentration of components: sulfuric acid 200-240g / L, copper sulfate pentahydrate 70-90g / L, chloride ion 50-80ppm, accelerator 10-20ppm, inhibitor 500-2000ppm and leveling agent 5-10ppm. The high aspect ratio circuit board through-hole electroplating process of the present application can effectively improve the uniformity of the plating layer on the surface of the circuit board and in the hole, reduce the thickness difference between the copper thickness in the circuit board hole and the copper thickness on the circuit board surface, and improve the deep plating ability. .