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Leveling agent solution and its preparation method and application

A technology of leveling agent and solution, applied in the field of leveling agent solution and its preparation, can solve the problems of concave orifice of plated plate, general deep plating ability, ravines on the surface of plated parts, etc., so as to change the leveling effect, The effect of improving the throwing power

Active Publication Date: 2017-06-16
GUANGDONG GUANGHUA SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The leveling agents used in foreign acid copper electroplating that are sold abroad, we found in the experiment that some of the currently sold leveling agents caused the hole of the plated plate to be concave or even the surface of the plated plate to appear grooves in actual use, and most of the deep plating ability In general, cannot fully meet the needs of circuit board manufacturing

Method used

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  • Leveling agent solution and its preparation method and application
  • Leveling agent solution and its preparation method and application
  • Leveling agent solution and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Put 9.2g (75.6mmol) of 4-dimethylaminopyridine and 21mL of water into a 100ml three-necked flask. Put the flask into a 60°C oil bath, slowly add 12.7g (63.0mmol) 1,4-butanediol diglycidyl ether through a constant pressure dropping funnel under stirring, continue stirring for half an hour, and raise the temperature of the oil bath to 95 °C, reflux for 18 hours. Heating was stopped, and when the temperature of the reaction system dropped to 70°C, 2.15g (17.64mmol) of 1,3-propane sultone was added, and the reaction was stirred at 70°C for 4 hours. Stop the reaction, cool to room temperature, and adjust the pH to 2-3 with 2 g of 50% sulfuric acid to obtain a leveler solution A, wherein the concentration of the leveler is 40-60 wt%.

[0044] Take 1.5L of basic solution in Harlem tank, add butyl polyoxyethylene polyoxypropylene ether (EO / PO copolymer) inhibitor solution, the concentration is 0.35g / L; add sulfonic acid disulfide brightener (SPS ) solution with a concentratio...

Embodiment 2

[0046] Put 5.1g (75.6mmol) of imidazole and 16mL of water into a 100ml three-necked flask. Put the flask into a 60°C oil bath, slowly add 11g (63.0mmol) ethylene glycol diglycidyl ether through a constant pressure dropping funnel under stirring, continue stirring for half an hour, raise the temperature of the oil bath to 95°C, and reflux for 15 Hour. Heating was stopped, and when the temperature of the reaction system dropped to 60°C, 0.92g (7.56mmol) of 1,3-propane sultone was added, and the reaction was stirred at 60°C for 3 hours. Stop the reaction, cool to room temperature, and adjust the pH to 2-3 with 3g of 50% sulfuric acid to obtain a leveler solution B, wherein the concentration of the leveler is 40-60wt%.

[0047]Take 1.5L base solution in Harlem tank, add butyl polyoxyethylene polyoxypropylene ether (EO / PO copolymer) inhibitor solution, the concentration is 0.25g / L; add sulfonic acid disulfide brightener (SPS ) solution, the concentration is 2.2ppm; add the levele...

Embodiment 3

[0049] The synthesis method of the leveler solution B is the same as in Example 2.

[0050] Take 1.5L of basic solution in Harlem tank, add butyl polyoxyethylene polyoxypropylene ether (EO / PO copolymer) inhibitor solution, the concentration is 0.8g / L; add sulfonic acid disulfide brightener (SPS ) solution with a concentration of 7.5ppm; add leveler solution B with a concentration of 0.035ml / L and stir evenly. According to the aforementioned operation process, put into the electroplating plate, electroplating at a current density of 3.6ASD for 45 minutes, the copper surface of the obtained plated piece is bright and smooth, and the deep plating ability of the 0.25mm hole test is 78.63%.

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Abstract

The invention relate to a leveling agent solution and a preparation method and application thereof. The leveling agent solution is obtained in the mode that a nitrogenous heterocyclic compound and a diepoxide compound are polymerized and then 1,3-propane sultone is used for an alkylation reaction. The leveling agent solution, a brightener and an inhibitor are used together, and a good electroplating effect can be obtained in electroplating of circuit board through holes.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a leveling agent solution and its preparation method and application. Background technique [0002] Acid copper plating has important applications in the electronics industry, especially in the manufacture of printed circuit boards and semiconductors. There is wiring on each layer of the printed circuit board multilayer board, and the circuit connection between layers is realized through metallized holes. The existing hole metallization is realized by copper plating. During the through hole electroplating process, due to the limitation of the electric field distribution, the current density distribution in the hole is extremely uneven, and the current density at the hole is large. In the hole, especially the hole The current density in the middle is very small, and the result is that the thickness of the copper plating at the orifice is much greater than that in t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
Inventor 程骄高健郑臣谋肖定军彭代明陈梓侠刘彬云
Owner GUANGDONG GUANGHUA SCI TECH
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