58results about How to "Good deep plating ability" patented technology

The invention discloses a preparation method for cyanide-free 18 k gold jewelries. The preparation method comprises the steps of plate making, mold pressing, opening and reversing, alloy mold carrying, drilling, loading, degreasing, primary activation, copper bottoming, secondary activation, gloss copper 1 plating, electrolytic degreasing, ternary activation, gold water preparation, molten copperpreparation, 18 k electroforming, gloss copper 2 plating, demolding, tin bismuth copper removal, distressing, mold carrying, embedding, welding, combination, polishing, cooling, deoiling, electrolyticdegreasing, gold plating, pure water washing, drying, quality inspection, character printing, packing and delivery in sequence; and then, the cyanide-free 18 k gold jewelries are obtained. The preparation method is simple in process and easy to operate, obviously improves the jewelry quality, reduces the gold loss, and contains no cyanide-contained poisonous substance in the preparation process to achieve environmental protection and safety; the hardness and the toughness of the 18 k gold jewelries are prominently improved to preferably guarantee the stability of the jewelries in the wearingprocess; and further, electroforming liquid is excellent in stability, dispersibility and deep plating capacity, can be prepared beforehand for future use, and improves the production efficiency.

The present invention provides a vertical continuous electroplating hole filling line for PCB board processing. The vertical continuous electroplating hole filling line comprises a plurality of sub-lines arranged in a side-by-side manner, and is characterized in that each sub-line comprises a material feeding mechanism, a pretreatment device, a front shifting device, an electroplating pretreatment device, a multi-stage electroplating copper cylinder, a rear shifting device, a post-treatment device and a deplating device, wherein the material feeding mechanism, the pretreatment device, the front shifting device, the electroplating pretreatment device, the multi-stage electroplating copper cylinder, the rear shifting device, the post-treatment device and the deplating device are sequentially connected, the material inlet end of the material feeding mechanism is connected to an automatic plate feeding device, the material inlet end of the automatic plate feeding device is provided with a plate feeding conveying belt, and the material outlet end of the post-treatment device is sequentially connected to a central positioning machine, a corner turning machine, a horizontal plate drying machine and an automatic plate collection device. According to the present invention, with the vertical continuous electroplating hole filling line, the thickness uniformity of the plating layer at blind holes, buried holes and other hole filling positions of the high density circuit board, the deep plating ability, the hole filling ability and the bonding force are good, the shape is beautiful, the consistency of the hole wall plating layer and the plate surface plating layer is good, the operation, the maintenance and the repair are convenient, the structure is compact, the occupation space is small, the generated waste gas is less, and the environmental protection advantage is provided.

The invention discloses a platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and an electroplating method adopting the platinum electroplating solution. The electroplating solution comprises 4-6 g / L of dihydrogen dinitrosulfatoplatinate calculated by platinum, 100-140 g / L of water-soluble phosphate calculated by phosphate radicals, 4-8 mg / L of sodium dodecyl sulfate or dodecyl sulfate and sulfamic acid capable of adjusting the pH of the electroplating solution to be 1-2. According to the invention, dihydrogen dinitrosulfatoplatinate is used as platinum main salt, phosphate is used as brightener salt, dodecyl sulfate is used as an additive, and sulfamic acid is used for adjusting the pH of the electroplating solution to be acidic, so that the obtained electroplating solution has better dispersancy and deep plating capacity, and is high in cathode current efficiency and excellent in performance. A plating layer obtained by electroplating through the electroplating solution under alkaline conditions is low in porosity, high in brightness and good in quality.

The invention provides zinc-nickel alloy electroplating liquid. The zinc-nickel alloy electroplating liquid comprises 30-50 g / L of zinc chloride, 10-20 g / L of zinc acetate, 30-40 g / L of nickel sulfate, 100-150 g / L of sodium hydroxide, 20-40 g / L of a complexing agent, 5-10 g / L of a brightener and water. The brightener comprises sodium glycolate, sodium sulfamate, toluenesulfonamide and propargyl alcohol in a ratio of (1-2): (1-2): (3-5): (3-5); and the complexing agent comprises sodium citrate, ethylenediamine and triethanolamine in a mass ratio of (1-2): (3-5): (3-5). According to the electroplating liquid, zinc chloride, zinc acetate and nickel sulfate are used as main salt, and the brightener and the complexing agent with specific compositions are matched, so that a plating layer obtained by electroplating not only has good deep plating capability, but also has good wear resistance, high brightness and good neutral salt mist resistance.

The invention discloses an electroplating solution for HEDP (1-hydroxyethylidene-1, 1-diphosphonic) cyanide-free copper plating and an electroplating method. The electroplating solution includes: 14-20g / L Cu2(OH)2CO3, 82123g / L HEDP, 20-40g / L citrate and 3-7g / L nitrate. The electroplating solution provided by the invention adopts HEDP as the coordination agent and citrate as the auxiliary coordination agent, so that the electroplating solution has good dispersion force and deep plating ability, high cathode current efficiency, and excellent performance. The coating obtained by electroplating of the electroplating solution under an alkaline condition has low porosity and good quality.

The invention discloses electroplate liquid and an electroplate method for cyanide-free gold plating of antimony-contained sulfite. The electroplate liquid is composed of 10-15 g / L of gold chloride in terms of gold, 78-94 g / L of sulfite in terms of sulfite radicals, 0.20-0.58 g / L of alcoholamine and 0.08-0.22 g / L of antimonous oxide. According to the electroplate liquid, the sulfite serves as main coordination agents, the alcoholamine serves as electron accelerators, the antimonous oxide serves as brightening agents, and the gold chloride serves as main gold salt, so that the obtained electroplate liquid is good in dispersion capacity and covering capacity, cathode currents are high in efficiency, and the electroplate liquid is excellent in performance. By the adoption of the electroplate liquid, plating obtained through electroplating under the alkaline condition is low in porosity, high in brightness and good in quality.

The invention discloses an iodide-added thiosulfate cyanide-free gold-electroplating solution and an electroplating method. The gold-electroplating solution comprises 10-15 g / L by gold of gold trichloride, 100-140 g / L by thiosulfate radical of thiosulfate, 78-94 g / L by sulfite radical of sulfite, 30-55 g / L by iodine of iodide, 1-4 g / L of an alcohol amine compound, and 0.30-0.60 g / L by selenite radical of selenite. In the gold-electroplating solution, iodide is taken as a stabilizing agent; thiosulfate is taken as a complexant; the alcohol amine compound is taken as the electron accelerant; selenite is taken as a brightener; and gold trichloride is taken as main gold salt. Therefore, the obtained gold-electroplating solution is relatively good in dispersion and deep electroplating ability, high in cathodic current efficiency, and excellent in electroplating solution performance. Through adopting the electroplating solution in an alkaline condition, a plated layer obtained through electroplating is low in porosity, high in brightness, and excellent in plating quality.