Blind hole filling electrocoppering solution for HDI plate and carrier plate

Abstract

The invention discloses a blind hole filling electrocoppering solution for an HDI plate and a carrier plate. An electrocoppering solution comprises the following components of, in concentration, 150-200 g / L of copper sulfate pentahydrate, 40-80 g / L of sulfuric acid (98%), 30-70 mg / L of chloride ions, 0.5-4 mg / L of a brightening agent, 200-500 mg / L of a wetting agent, 5-30 mg / L of a leveling agent,30-100 mg / L of a new additive, and the balance deionized water. The above components are mixed according to the concentration to form the electrocoppering solution, when the electrocoppering solutionis used for electroplating, a Dummy sheet is firstly used for electrolyzing an electroplating bath to 2 AH / L, then electroplating is carried out at a current density of 1-3 A / dm<2 >, a temperature of15-35 DEG C, and a circulation rate of 2-8 TurnOver / H. According to the solution, the stability of a bath solution is improved through the method of adding the new additive, so that a blind hole plating layer is good in deepening plating ability, excellent in hole filling rate, free of voids and cracks, thin in surface copper and bright in surface, the defects of unstable signal transmission, high resistance, excessive power loss and the like caused by blind hole voids or equal-wall growth can be effectively prevented, and the reliability of an electronic product is further improved.

Description

technical field [0001] The invention relates to the field of material electrochemistry, in particular to a copper electroplating solution for blind hole filling for HDI boards and carrier boards. Background technique [0002] A printed circuit board (PCB) is a substrate for assembling electronic components, on which point-to-point connections and printed components are formed on a general-purpose substrate according to a predetermined design. The main function of this product is to make various electronic components form a predetermined circuit connection and play the role of relay transmission. Printed circuit board products are the basic substrates that cannot be separated from the modern information society, and are widely used in all aspects of our lives. [0003] The miniaturization and multi-functionalization of electronic products have promoted the development of printed circuit boards (PCBs) in the direction of circuit refinement and small hole miniaturization. Its ...

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Problems solved by technology

[0006] Aiming at the deficiencies in the above-mentioned technologies, the present invention provides a blind hole-filling electroplating copper solution for HDI boards and carrier boards, which solves the problem of low electroplating reliability and short bath life in the existing blind-hole electroplating process and other defects, the method of adding new additives is used to improve the stability of the bath solution, which can make the blind hole coating have better deep plating ability, excellent hole filling rate, no voids, no cracks, thin surface copper, and bright surface, which can effectively prevent blind holes. Pore ​​holes or equal wall growth lead to unstable signal transmission, high resistance, excessive power loss and other shortcomings, further improving the reliability of electronic products

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