Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper Plating Solution for Blind Via Filling for HDI Boards and Carriers

A technology of electroplating copper and blind holes, which is applied in the field of material electrochemistry, can solve the problems of unstable signal transmission, low reliability of electroplating, and short service life of bath solution, so as to reduce the generation of brightener by-products, reduce the impact, and improve electroplating The effect of longevity

Active Publication Date: 2021-08-06
SHENZHEN CHENGGONG CHEM
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies in the above-mentioned technologies, the present invention provides a blind hole-filling electroplating copper solution for HDI boards and carrier boards, which solves the problem of low electroplating reliability and short bath life in the existing blind-hole electroplating process and other defects, the method of adding new additives is used to improve the stability of the bath solution, which can make the blind hole coating have better deep plating ability, excellent hole filling rate, no voids, no cracks, thin surface copper, and bright surface, which can effectively prevent blind holes. Pore ​​holes or equal wall growth lead to unstable signal transmission, high resistance, excessive power loss and other shortcomings, further improving the reliability of electronic products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper Plating Solution for Blind Via Filling for HDI Boards and Carriers
  • Copper Plating Solution for Blind Via Filling for HDI Boards and Carriers
  • Copper Plating Solution for Blind Via Filling for HDI Boards and Carriers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The formula consists of the following:

[0057] Copper sulfate pentahydrate: 200g / L

[0058] Sulfuric acid 98%: 50g / L

[0059] Chloride ion: 50mg / L

[0060] Sodium lignosulfonate: 1mg / L

[0061] Sodium dodecyl sulfate: 300mg / L

[0062] N-Alkylphthalimide: 20mg / L

[0063] Deionized water: balance

[0064] Solution preparation process: Take 1L solution as an example, take 300ml of deionized water, add copper sulfate pentahydrate: 200g; sulfuric acid: 50g, copper chloride dihydrate: 0.114g, sodium lignosulfonate: 1mg; Sodium sulfonate: 300mg; N-alkylphthalimide: 20mg, stir to dissolve, and then add deionized water to the liquid level to 1L.

[0065] Process parameters for electroplating using the copper electroplating solution prepared in this example: spray: 5 min, temperature: 25±2° C., current density: 1.5 ASD, stirring rate: 5 TO / H, time: 60 min. After the preparation of the above electroplating bath solution is completed, it needs to be electrolyzed to 2AH / L be...

Embodiment 2

[0069] The formula consists of the following:

[0070] Copper sulfate pentahydrate: 180g / L

[0071] Sulfuric acid 98%: 50g / L

[0072] Chloride ion: 50mg / L

[0073] Sodium lignosulfonate: 1.5mg / L

[0074] Sodium dodecyl sulfate: 400mg / L

[0075] N-Alkylphthalimide: 20mg / L

[0076] N-propanolamine: 40mg / L

[0077] Deionized water: balance

[0078] Solution preparation process: Take 1L solution as an example, take 300mL of deionized water, add copper sulfate pentahydrate: 180g; sulfuric acid: 50g, copper chloride dihydrate: 0.114g, sodium lignosulfonate: 1.5mg; dodecane Sodium sulfonate: 400mg; N-alkylphthalimide: 20mg, n-propanolamine: 40mg, stir to dissolve, and then add deionized water to the liquid level to 1L.

[0079] Process parameters for electroplating using the copper electroplating solution prepared in this example: spray: 5 min, temperature: 25±2° C., current density: 1.5 ASD, stirring rate: 6 TO / H, time: 60 min. After the preparation of the above electroplati...

Embodiment 3

[0083] The formula consists of the following:

[0084] Copper sulfate pentahydrate: 190g / L

[0085] Sulfuric acid 98%: 50g / L

[0086] Chloride ion: 60mg / L

[0087] Sodium 1-octanesulfonate: 2mg / L

[0088] Polyethyleneimine: 350mg / L

[0089] N-Alkylphthalimide: 20mg / L

[0090] Hexamethylenetetramine: 45mg / L

[0091] Deionized water: balance

[0092] Solution preparation process: Take 1L solution as an example, take 300mL of deionized water, add copper sulfate pentahydrate: 190g; sulfuric acid: 50g, copper chloride dihydrate: 0.137g, sodium 1-octanesulfonate: 2mg; polyethylene Imine: 350mg; N-alkylphthalimide: 20mg, hexamethylenetetramine: 45mg, stir to dissolve, and then add deionized water to the liquid level to 1L.

[0093] Process parameters for electroplating using the copper electroplating solution prepared in this example: spraying: 5min, temperature: 25±2°C, current density: 2ASD, stirring rate: 8TO / H, time: 50min. After the preparation of the above electroplatin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
concentrationaaaaaaaaaa
concentrationaaaaaaaaaa
concentrationaaaaaaaaaa
Login to View More

Abstract

The invention discloses a blind hole-filling electroplating copper solution for HDI boards and carrier boards. The electroplating copper solution includes components with the following concentrations: copper sulfate pentahydrate: 150-200g / L; sulfuric acid 98%: 40-80g / L; Chloride ion: 30‑70mg / L; Brightener: 0.5‑4mg / L; Wetting agent: 200‑500mg / L; Leveling agent: 5‑30mg / L; New additive: 30‑100mg / L; Deionized water: balance; the above components are mixed according to the concentration to form the electroplating copper solution. When electroplating the electroplating copper solution, first electrolyze the electroplating tank with a Dummy sheet to 2AH / L, and then use a current density of 1‑3A / L dm 2 Electroplating is performed between 15-35°C, and the cycle rate is 2-8TurnOver / H. The invention adopts the method of adding new additives to improve the stability of the bath solution, which can make the blind hole plating layer have better deep plating ability, excellent hole filling rate, no voids, no cracks, thinner surface copper, and bright surface, which can effectively prevent blind holes. Holes or equal-wall growth lead to unstable signal transmission, high resistance, and excessive power loss, which further improves the reliability of electronic products.

Description

technical field [0001] The invention relates to the field of material electrochemistry, in particular to a copper electroplating solution for blind hole filling for HDI boards and carrier boards. Background technique [0002] A printed circuit board (PCB) is a substrate for assembling electronic components, on which point-to-point connections and printed components are formed on a general-purpose substrate according to a predetermined design. The main function of this product is to make various electronic components form a predetermined circuit connection and play the role of relay transmission. Printed circuit board products are the basic substrates that cannot be separated from the modern information society, and are widely used in all aspects of our lives. [0003] The miniaturization and multi-functionalization of electronic products have promoted the development of printed circuit boards (PCBs) in the direction of circuit refinement and small hole miniaturization. Its ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D7/00
CPCC25D3/38C25D7/00
Inventor 姚成洪学平姚吉豪
Owner SHENZHEN CHENGGONG CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com