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Electroplating liquid and electroplating method of biurea cyanide-free copper plating

A cyanide-free copper plating and electroplating solution technology, applied in the field of copper electroplating technology, can solve the problems of unsatisfactory plating solution performance and poor plating quality, and achieve the effects of excellent plating solution performance, good plating quality and good deep plating ability.

Inactive Publication Date: 2015-05-20
WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing cyanide-free copper plating generally has the technical defects that the performance of the plating solution is not ideal and the quality of the coating is not strong, which seriously restricts the complete replacement of cyanide-free copper plating in the industry.

Method used

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  • Electroplating liquid and electroplating method of biurea cyanide-free copper plating
  • Electroplating liquid and electroplating method of biurea cyanide-free copper plating
  • Electroplating liquid and electroplating method of biurea cyanide-free copper plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The formulation of the electroplating solution is as follows:

[0038]

[0039] Plating process conditions: the pulse width of single pulse square wave current is 0.2ms, the duty cycle is 30%, and the average current density is 1A / dm 2 ; The pH is 10.5, the temperature is 50°C, and the electroplating time is 80min.

Embodiment 2

[0041] The formulation of the electroplating solution is as follows:

[0042]

[0043] Plating process conditions: the pulse width of single pulse square wave current is 0.3ms, the duty cycle is 25%, and the average current density is 1.2A / dm 2 ; The pH is 10, the temperature is 45°C, and the electroplating time is 70min.

Embodiment 3

[0045] The formulation of the electroplating solution is as follows:

[0046]

[0047] Plating process conditions: the pulse width of single pulse square wave current is 0.4ms, the duty cycle is 20%, and the average current density is 1.4A / dm 2 ; The pH is 8.5, the temperature is 35°C, and the electroplating time is 50min.

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Abstract

The present invention discloses an electroplating liquid and an electroplating method of biurea cyanide-free copper plating. The electroplating liquid comprises 10-23 g / L of Cu2(OH)2CO3, 30-85 g / L of biurea, 20-40 g / L of citrate, 3-7 g / L of nitrate, and 0.2-0.6 g / L of uracil. According to the electroplating liquid of the present invention, the biurea is adopted as the coordination agent, and the citrate is adopted as the auxiliary coordination agent, such that the electroplating liquid characteristics of good dispersion, good deep plating ability, high cathode current efficiency, and excellent plating liquid performance. In addition, the plating layer obtained through electroplating under the alkaline condition has characteristics of low porosity and good quality.

Description

technical field [0001] The invention relates to the technical field of copper electroplating technology, in particular to an electroplating solution and an electroplating method for biurea cyanide-free copper plating. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid, and also soluble in heated concentrated sulfuric acid, and it acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright nickel and micr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38C25D5/18
Inventor 曾雄燕
Owner WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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