Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

VCP copper plating process for flexible printed circuit board

A flexible circuit board and flexible printing technology, which is applied to printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of high bending times of flexible circuit board, high-density circuit etching micro-short circuit, large thickness of copper plating on the board surface, etc. , to achieve the effect of solving the film alignment problem, wide application prospects, and improving deep plating ability

Inactive Publication Date: 2019-10-11
东莞市斯坦得电子材料有限公司
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The line width / line spacing is mostly 0.075mm / -0.05mm, because the deep plating ability directly has a great impact on the subsequent etching quality. Therefore, the depth capability is poor and the thickness of copper plating on the board surface is large, resulting in high-density line etching. micro short circuit
[0004] 2. The number of bending times of flexible circuit boards is getting higher and higher. Generally, the number of bending times is between 500,000 and 700,000 times. The poor ductility directly causes the line to break after a large number of bendings, resulting in an open circuit (micro-open circuit) ) seriously affect the signal transmission

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0048] Taking preferred embodiment 2 as an example, the present invention performs copper plating on the copper plating solution configured with various components according to the following process steps, and the specific steps are as follows:

[0049] (1) Clean the vertical continuous copper plating tank;

[0050] (2) Continue to wash with deionized water circulation for 30 minutes;

[0051] (3) Add copper plating solution and copper plating additive to VCP copper plating tank, copper plating solution comprises copper sulfate pentahydrate, sulfuric acid and hydrochloric acid, and copper plating additive solution comprises polyethylene glycol, sodium polydithiodipropane sulfonate and healthy that green;

[0052] (4) Adjust the temperature to 25°C;

[0053] (5) Start the circulating filter pump;

[0054] (6) Put the flexible circuit board to be electroplated into the vertical continuous VCP copper plating tank;

[0055] (7) Adjust the current density to 2.5A / dm2, electropl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a VCP copper plating process for a flexible printed circuit board. The VCP copper plating process comprises the following steps of firstly, cleaning a vertical continuous copperplating tank; continuously washing with deionized water, adding the deionized water, copper sulfate pentahydrate, sulfuric acid, hydrochloric acid and a copper-plated additive (polyethylene glycol, sodium polythiodipropionate and Janus Green) into the copper plating tank, starting a circulation filter pump, inputting the to-be-electroplated flexible circuit board into the tank, and starting the current; after electroplating, taking out the circuit board, and cleaning the circuit board with water; and after blow-drying by hot air, transferring the circuit board into a pattern transferring procedure. According to the vertical continuous (VCP) copper plating process for the flexible printed circuit board, after the flexible circuit board is plated copper, the flexibility is stronger and theexpansion shrinkage of the flexible circuit board is smaller, and the deep plating capability of a through hole is higher, so that the bending resistance of the flexible circuit board is greatly improved, the film alignment in subsequent pattern transfer is facilitated, etching of the flexible circuit board with high-density line width / line distance (0.05 mm / 0.05 mm) is more facilitated, the product quality and the product reliability are improved, the production process is pollution-free, and the process is suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of flexible printed circuit board processing, and in particular relates to a VCP copper plating process for flexible printed circuit boards. Background technique [0002] With the continuous improvement of high-density circuits, flexible printed circuit boards have higher copper plating ability and ductility, and the requirements for the expansion and contraction of copper-plated boards are also getting higher and higher. The board has the following deficiencies: [0003] 1. The line width / line spacing is mostly 0.075mm / -0.05mm, because the deep plating ability directly has a great impact on the subsequent etching quality. Therefore, the depth capability is poor and the copper plating thickness on the board is large, resulting in high-density line etching. micro short circuit. [0004] 2. The number of bending times of flexible circuit boards is getting higher and higher. Generally, the number of bending t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D3/38H05K3/18
CPCC25D3/38H05K3/188
Inventor 董先友
Owner 东莞市斯坦得电子材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products