Manufacturing method for solving nonuniform inflation of copper bath of vertical plating line

Abstract

The invention provides a manufacturing method for solving nonuniform inflation of a copper tank of a vertical plating line, and relates to the technical field of circuit board manufacturing processes. The manufacturing method comprises the following steps that a method for plating copper required by a PCB is selected, an instrument is prepared, a solution is prepared, the solution is put into the instrument, an inorganic additive and an organic additive are added, mixing is carried out after the additives are added, waiting for completion of mixing is carried out, a designed inflating pipe is placed in the instrument, bubbles in the solution are removed, the PCB needing to be plated with copper is soaked in the instrument, and waiting for completion of copper plating is performed. Therefore, the U-shaped inflating pipe is changed into an H shape, due to the fact that connecting ports are located in the middles of the two sides of the H shape, the upward distance or the downward distance of gas is equal, a whole tank body is used for inflating, overall distribution is uniform, the wettability of a copper-plated copper surface and in holes and the bubble removing effect are enhanced, the traditional design of a vertical plating line is changed, the qualified rate of products can be obviously improved, the production quality is improved, the copper plating uniformity is improved, the consumption of copper balls can be reduced, and the cost of the copper balls is saved.

Description

Technical field [0001] The present invention relates to the technical field of circuit board manufacturing process, and in particular, a method for producing non-uniform air inveirs of vertical electroplating line copper tanks. Background technique [0002] Electroplating line, refers to the collectiveness of all electroplating equipment in the electroplating process of industrial products, and the electroplating process must be completed in the order of order, and the electroplating production line is also called electroplating flow wire. Combacha electroplating production line includes full automatic electroplating production line and manual, semi-automatic electroplating production line. The electroplating production line can be divided into a carbon production line, a production line, continuous plating, brush production line, etc., and the printed circuit board is the necessary part of the electronic product, which is a carrier that supports electronic components in electron...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a manufacturing method to solve the problem of uneven air pumping in the copper tank of the vertical electroplating line, which solves the problem of enhancing the wettability of the copper-plated copper surface and the hole, and the effect of removing air bubbles, and changes the traditional method of the vertical electroplating line. Design, which significantly improves the deep plating ability of PCB high thickness-to-diameter ratio through-hole plating, and improves production quality

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