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Method for improving deep plating capacity of electrocoppering

A technology of electroplating copper and electroplating copper layers, which is applied in the direction of electrolytic process, electrolytic components, cells, etc., can solve the problems of reduced production capacity, board surface quality problems, waste of resources, etc., and achieve the effect of improving deep plating ability

Active Publication Date: 2018-06-26
艾威尔电路(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, raising the temperature to improve the deep plating ability will bring risks to the organic additives in the copper cylinder. If the temperature is too high, the organic additives will be decomposed, resulting in quality problems on the board surface, and reducing the current density will directly reduce the production capacity. Lead to low production capacity and waste of resources

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for improving electroplated copper deep plating ability, comprising the following steps:

[0024] A. Configure the electroplating solution, the electroplating solution includes,

[0025] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutane carboxylic acid 17g / L, manganese disodium edetate 3g / L, 4-methyl-2 - sodium oxopentanoate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, and the balance is water;

[0026] B. Inject the electroplating solution into the electroplating tank, and put the circuit substrate vertically into the electroplating tank;

[0027] C. Control the temperature of the electroplating solution at 52°C, conduct electroplating with electricity, and control the current density at 16A / dm 2 ;

[0028] D. When the thickness of the electroplated copper layer increases to 55% of the target thickness, the temperature of the electroplating solution is raised to 65°C, and the current density is reduced to 5.5...

Embodiment 2

[0040] A method for improving electroplated copper deep plating ability, comprising the following steps:

[0041] A. Configure the electroplating solution, the electroplating solution includes,

[0042] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutane carboxylic acid 17g / L, manganese disodium edetate 3g / L, 4-methyl-2 - sodium oxopentanoate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, and the balance is water;

[0043] B. Inject the electroplating solution into the electroplating tank, and put the circuit substrate vertically into the electroplating tank;

[0044] C. Control the temperature of the electroplating solution at 52°C, conduct electroplating with electricity, and control the current density at 16A / dm 2 ;

[0045] D. When the thickness of the electroplated copper layer increases to 55% of the target thickness, the temperature of the electroplating solution is raised to 65°C, and the current density is reduced to 5.5...

Embodiment 3

[0057] A method for improving electroplated copper deep plating ability, comprising the following steps:

[0058] A. Configure the electroplating solution, the electroplating solution includes,

[0059] Copper sulfate 150g / L, sulfuric acid 380g / L, sodium nitrite 6g / L, 3-oxocyclobutane carboxylic acid 17g / L, manganese disodium edetate 3g / L, 4-methyl-2 -Sodium oxopentanoate 10g / L, brightener 6g / L, smoothing agent 6g / L, modifier 3g / L, also includes 1-ethyl-3-methylimidazole potassium hexafluorophosphate 6g / L, remaining amount of water;

[0060] B. Inject the electroplating solution into the electroplating tank, and put the circuit substrate vertically into the electroplating tank;

[0061] C. Control the temperature of the electroplating solution at 52°C, conduct electroplating with electricity, and control the current density at 16A / dm 2 ;

[0062] D. When the thickness of the electroplated copper layer increases to 55% of the target thickness, the temperature of the electro...

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PUM

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Abstract

The invention discloses a method for improving deep plating capacity of electrocoppering. The method comprises the steps of A, preparing an electroplating solution including copper sulfate, sulfuric acid, sodium nitrite, 3-oxo-cyclobutylcarboxylic acid, manganese disodium EDTA trihydrate, 4-methyl-2-oxovaleric acid sodium, a brightening agent, a smoothening agent, a modifying agent and the balancewater; B, pouring the electroplating solution into an electroplating bath; and vertically arranging a circuit substrate into the electroplating bath; C, performing the first-stage electroplating; D,performing the second-stage electroplating; and E, performing the third-stage electroplating. With the adoption of the method, the shortages in the prior art can be solved; and the deep plating capacity of electrocoppering is improved.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a method for improving the deep plating ability of electroplated copper. Background technique [0002] Due to the emphasis on light, thin, short and small HDI era has become the mainstream of the PCB industry. In the process of electroplating copper, the requirements and standards of deep blind hole and high aspect ratio through hole electroplating, better copper quality and board surface uniformity have now become important and key influences. A key indicator of , especially important for the production of circuit boards. In the existing technology, increasing the deep plating capacity by raising the temperature will bring risks to the organic additives in the copper cylinder. If the temperature is too high, the organic additives have been decomposed, resulting in quality problems on the board surface, and reducing the current density will directly reduce the production capacity. ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D21/12
CPCC25D3/38C25D21/12
Inventor 吴青春马亚磊龙军华谢飞
Owner 艾威尔电路(深圳)有限公司
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