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Hole metallizing method for circuit board with high ratio of thickness to radial dimension

A high aspect ratio, hole metallization technology, applied in the direction of electrical connection formation of printed components, can solve the problems of high production cost, low current, large investment, etc., to avoid material waste, improve electroplating current density, and smooth surface. Effect

Inactive Publication Date: 2017-03-22
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above two methods require large investment and high production cost; in order to achieve high deep plating capacity, the current used is small and the efficiency will be relatively low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment provides a hole metallization method for a circuit board with a high aspect ratio, including the following steps:

[0026] S1. Perform magnetron sputtering plating on the circuit board after controlled depth drilling, back drilling, grinding and deburring;

[0027] S2, hole filling electroplating, plating a thick copper layer in the back-drilled hole after electroless copper deposition in step S1;

[0028] S3. Paste the dry film on the surface of the circuit board, make the outer layer graphics, and perform graphic electroplating, form a protective tin layer on the surface of the circuit board and the back drilling, and then remove the dry film on the surface of the board;

[0029] S4, making a hole-masking dry film on the surface of the circuit board;

[0030] S5, chemically etching the circuit board, removing the hole-masking dry film, and removing the protective tin layer.

[0031] The step S4 also includes the step of making a hole-masking film bef...

Embodiment 2

[0042] This embodiment provides a hole metallization method for a circuit board with a high aspect ratio, including the following steps:

[0043] S1. Perform magnetron sputtering plating on the circuit board after controlled depth drilling, back drilling, grinding and deburring;

[0044] S2, hole filling electroplating, plating a thick copper layer in the back-drilled hole after electroless copper deposition in step S1;

[0045] S3. Paste the dry film on the surface of the circuit board, make the outer layer graphics, and perform graphic electroplating, form a protective tin layer on the surface of the circuit board and the back drilling, and then remove the dry film on the surface of the board;

[0046] S4, making a hole-masking dry film on the surface of the circuit board;

[0047] S5, chemically etching the circuit board, removing the hole-masking dry film, and removing the protective tin layer.

[0048] The step S4 also includes the step of making a hole-masking film bef...

Embodiment 3

[0058] This embodiment provides a hole metallization method for a circuit board with a high aspect ratio, including the following steps:

[0059] S1. Perform magnetron sputtering plating on the circuit board after controlled depth drilling, back drilling, grinding and deburring;

[0060] S2, hole filling electroplating, plating a thick copper layer in the back-drilled hole after electroless copper deposition in step S1;

[0061] S3. Paste the dry film on the surface of the circuit board, make the outer layer graphics, and perform graphic electroplating, form a protective tin layer on the surface of the circuit board and the back drilling, and then remove the dry film on the surface of the board;

[0062] S4, making a hole-masking dry film on the surface of the circuit board;

[0063] S5, chemically etching the circuit board, removing the hole-masking dry film, and removing the protective tin layer.

[0064] The step S4 also includes the step of making a hole-masking film bef...

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Abstract

The invention provides a hole metallizing method for a circuit board with a high ratio of thickness to radial dimension, and solves problems that there is no tin layer for protecting the hole bottom after etching, there is no copper in the hole and thereby the circuit board is caused to be discarded because a metalized back drill hole with the high ratio of thickness to radial dimension is relatively deep and a tin layer is difficult to set at the bottom of the hole in a coating manner after pattern electroplating. Therefore, the invention proposes the method for improving the no-copper condition of a metalized back drill hole of the circuit board with the high ratio of thickness to radial dimension. The invention can effectively control the thickness of hole wall copper, and the thickness can be controlled. The method can avoid the material waste caused by the normally-used thick copper technology in the prior art, can enable the surface copper layer of the hole wall to be uniform in thickness, enables the surface to be flat, and can meet the requirements of the performances of a precise circuit element circuit board. The method is simple, is advanced in technology, improves the electroplating current density, shortens the electroplating time, improves the deep electroplating capability, and effectively reduces the pollution caused by electroplating.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a hole metallization method of a circuit board with a high thickness-to-diameter ratio. Background technique [0002] The hole metallization of the circuit board refers to plating a layer of copper on the inner wall of the through hole between the top layer and the bottom layer of the circuit board, so that the top layer and the bottom layer of the circuit board are connected to each other. The hole metallization of circuit boards is usually achieved by traditional DC electroplating. With the development of high-speed transmission technology, the capacity of circuit boards continues to increase, so the number of layers of circuit boards continues to increase, and the corresponding thickness of circuit boards continues to increase. At the same time, in order to minimize the loss of through holes, the diameter of circuit board through holes Small, re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42C23C14/35
Inventor 王少杰黄勇贺波
Owner 奥士康精密电路(惠州)有限公司
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