38results about How to "Avoid excessive erosion" patented technology

The invention discloses clad material solid / liquid composite horizontal continuous casting and forming equipment and method, and belongs to the technical field of clad material continuous casting. According to the clad material solid / liquid composite horizontal continuous casting and forming equipment and method, the measures that a core material protection device, a flow guide pipe, an inversion solidification device and the like are adopted and mounted below a crucible, core materials are not heated in advance, the inversion solidification device with small capacity is designed, the core materials are prevented from penetrating through clad layer melt metal for a long time, the melt metal flows out from the bottom of the crucible by relying on self-weight, and the size of the inversion solidification device and the size of a water-cooled crystallizer are controlled effectively are taken, the high quality clad materials of needed shapes and sizes are formed through horizontal continuous casting, and the equipment and the method are especially suitable for horizontal continuous casting forming of the large-size clad materials which are hard to reel up and has the melting point of the clad layer metal lower than that of the core material metal. The equipment and method have the advantages that the equipment is simple in structure, parts are easy to replace, operation and maintenance are convenient to carry out, layout is reasonable and compact, production efficiency is high, investment is small, automatic control is easy to achieve, large-scale industrial production is facilitated, the procedure of the forming process is short, energy is saved, environment is protected, efficiency is high, cost is low, the combination freedom of the clad layer metal and the core material metal is large, and the prepared clad materials are good in quality and performance.

A first insulating layer is disposed on a second surface of a semiconductor substrate, and has an opening. A second insulating layer is disposed on the second surface and separated from the first insulating layer. A stack includes, in sequence on the second surface, a side n-type epitaxial layer and first and second p-type epitaxial layers that are made of a gallium-nitride-based material. The stack has an outer side wall having a portion formed of the second p-type epitaxial layer, an inner side wall extending from the second insulating layer, and a top surface. The n-type contact layer is disposed on the top surface. The source electrode portion is in contact with the n-type contact layer on the top surface, and is in contact with the second p-type epitaxial layer on the outer side wall. A gate insulating film is disposed on the inner side wall.

A first insulating layer (41) is provided on a second surface (P2) of a semiconductor substrate (31), and has an opening (OP). A second insulating layer (6) is provided on the second surface (P2), andis separated from the first insulating layer (41). A laminate (51) sequentially comprises, on the second surface (P2), a lateral n-type epitaxial layer (7) and first and second p-type epitaxial layers (8, 9), said layers being formed from a gallium nitride material. The laminate (51) has an outer side wall (SO) which has a portion that is formed of the second p-type epitaxial layer (9), an innerside wall (SI) which extends from the second insulating layer (6), and a top surface (ST). An n-type contact layer (12) is provided on the top surface (ST). A source electrode part (14) is in contactwith the n-type contact layer (12) on the top surface (ST), while being in contact with the second p-type epitaxial layer (9) on the outer side wall (SO). A gate insulating film (16) is provided on the inner side wall (SI).

The invention relates to the technical field of packaging bag paper production, in particular to a production process of aluminized laser paper. The production process comprises the following steps: 1) coating a release agent on a substrate to form a release layer; 2) drying the substrate coated with a release material; 3) imprinting a dried film so that the surface of the substrate can have a laser pattern; 4) conducting vacuum aluminum plating on the substrate, and then conducting protected layer coating on a specified position; 5) immersing the substrate coated with the protected layer in an alkaline liquid pool for aluminum washing and drying again; 6) conducting spot-coating on the surface of the substrate, then compounding the substrate and base paper through a compound device and then drying again; 7) curing composite paper, peeling off the substrate, and transferring the laser pattern to the surface of the base paper. After the release agent is used on the substrate, the durability, compression resistance, solvent resistance, and low temperature resistance are improved, and at the same time, and an alkaline solution can be effectively prevented from excessively eroding thesubstrate when aluminum is washed.

Low head loss systems are detailed. The systems may include chambers having low impedance to water flow therethrough and repositionable gates or other valves within the chambers. The valves may direct water as a function of whether an associated heating device is active. At least some gates may incorporate poppet valves or other high-flow by-passes.

A gas assisted spray nozzle assembly having a nozzle body in the form of a one piece hollow tubular member, such as a single cylindrical pipe section, which defines a mixing zone and a downstream barrel extension zone. A liquid inlet and an impingement pin are supported by said tubular member in opposed relation to each other at the mixing zone, and pressurized gas inlet is provided at an upstream end of the tubular member. The impingement pin in this case has an impingement surface radially offset from a central axis of the mixing zone on a side opposite the liquid inlet for receiving pressurized liquid and redirecting the liquid toward the central axis for enhanced intermixing with and atomization by the pressurized gas stream.

The invention provides a method for raising coral tree seedlings, which belongs to the technical field of coral tree planting, comprising: 1) pretreatment: taking coral tree seeds and disinfecting them in potassium permanganate solution at 36-38°C; The pretreated coral tree seeds are acid-etched with a mixed concentrated sulfuric acid solution containing ether; 3) Hormone treatment: the acid-etched coral tree seeds are soaked in an ethanol solution containing indole acetic acid and fluorenemethanol; 4) germination by low-temperature stratification : Carry out wet and cold stratification germination to coral tree seeds with 3-5 year old pine sawdust; 5) Sowing: Seedlings are sown after being disinfected and disinfested, and germinate and grow into seedlings. The beneficial effects are: the method is easy to implement, can effectively awaken coral tree seeds in a dormant state, helps to stimulate the growth and development of radicles, accelerates the germination of radicles, improves the germination rate of seeds, accelerates germination, and the germinated seedlings are strong and transplanted. Planted high survival rate.

The invention discloses a method for oxidizing a brake master cylinder, which comprises the following steps of: 1, hanging, namely hanging the brake master cylinder to a rack special for oxidizing the brake master cylinder; 2, performing weak acid oil removal treatment; 3, preparing anode oxidizing tank liquor; 4, performing anode oxidization treatment; and 5, taking out the brake master cylinder, cleaning, and performing enclosed drying treatment. The brake master cylinder treated by the method meets the industrial requirements on quality such as film thickness, roughness, hardness and the like.

Pb-Sn-Sb-Ag alloy brazing filler metal is mainly used for soldering of metal coatings of an electronic device. The brazing filler metal comprises, by weight, 15.5-16.5wt % of Sn, 7.0-8.0wt% of Sb, 0.01-1.2wt% of Ag and the balance of Pb. The brazing filler metal is moderate in melting temperature, has excellent wettability for the metal coatings, and is good in brazing process and applicable to soldering of silver (alloy) coatings, gold coatings and copper of electronic devices, and thermal impact resistance of brazing seams is good.