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A kind of Pb-sn-sb-ag alloy solder and preparation method thereof

A technology of pb-sn-sb-ag and alloy solder, which is applied in the direction of metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of insufficient wettability of Cu and cannot meet the use requirements, etc., and achieve brazing manufacturability Good, avoid excessive erosion, inhibit erosion effect

Active Publication Date: 2018-11-16
BEIJING INST OF NONFERROUS METALS & RARE EARTH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Pb-5Sn-10Sb (wt%) solder imported from Europe has a suitable melting temperature and good brazing processability, but its wettability to Cu is not enough to meet the use requirements

Method used

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  • A kind of Pb-sn-sb-ag alloy solder and preparation method thereof
  • A kind of Pb-sn-sb-ag alloy solder and preparation method thereof
  • A kind of Pb-sn-sb-ag alloy solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: prepare Pb-Sn-Sb-Ag alloy solder (one)

[0026] Step 1: Weighing the metal raw material

[0027] Weigh 158 grams of Sn, 0.1 grams of Ag, 78 grams of Sb and 763.9 grams of Pb respectively;

[0028] Step 2: Alloy Casting

[0029] Put the weighed Pb, Sn, Sb and Ag metal raw materials in a graphite crucible by using an intermediate frequency induction furnace, heat to 500°C for melting by using an intermediate frequency induction furnace, cool down to 350°C after the metal is melted, and keep it warm for 5 minutes. Carry out casting, make the Pb-Sn-Sb-Ag alloy ingot of diameter 30mm bar;

[0030] Step 3: Wire Preparation

[0031] The casted alloy rod-shaped ingot is extruded by an extruder to make a welding wire with a diameter of 1 mm.

Embodiment 2

[0032] Embodiment 2: prepare Pb-Sn-Sb-Ag alloy solder (two)

[0033] Step 1: Weighing the metal raw material

[0034] Weigh 159 grams of Sn, 0.5 grams of Ag, 76 grams of Sb and 764.5 grams of Pb respectively;

[0035] Step 2: Alloy Casting

[0036] Put the weighed Pb, Sn, Sb and Ag metal raw materials in a graphite crucible by using an intermediate frequency induction furnace, heat to 500°C for melting by using an intermediate frequency induction furnace, cool down to 350°C after the metal is melted, and keep it warm for 5 minutes. Carry out casting, make the Pb-Sn-Sb-Ag alloy ingot of thickness 5mm plate;

[0037] Step 3: Solder Foil Preparation

[0038] The alloy plate-shaped ingot after melting and casting is rolled by a rolling mill to make a welding foil with a thickness of 0.1 mm.

[0039] The obtained Pb-Sn-Sb-Ag alloy solder was used for brazing test, the base material was pure Cu sheet, brazing was completed on a heating platform, and the brazing temperature was 2...

Embodiment 3

[0040] Embodiment 3: prepare Pb-Sn-Sb-Ag alloy solder (three)

[0041] Step 1: Weighing the metal raw material

[0042] Weigh 160 grams of Sn, 10 grams of Ag, 75 grams of Sb and 755 grams of Pb respectively;

[0043] Step 2: Alloy Casting

[0044] Put the weighed Pb, Sn, Sb and Ag metal raw materials in a graphite crucible by using an intermediate frequency induction furnace, heat to 500°C for melting by using an intermediate frequency induction furnace, cool down to 350°C after the metal is melted, and keep it warm for 5 minutes. Carry out casting, make the Pb-Sn-Sb-Ag alloy ingot of diameter 30mm bar;

[0045] Step 3: Solder Powder Preparation

[0046] Using the gas atomization powder making method, using nitrogen as the atomizing gas, place the obtained rod-shaped ingot under the conditions of a pressure of 0.6MPa and a temperature of 350°C, and gas atomize it into an alloy powder. The alloy powder, Through sieving, the alloy solder powder with a particle size of 25um-4...

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Abstract

Pb-Sn-Sb-Ag alloy brazing filler metal is mainly used for soldering of metal coatings of an electronic device. The brazing filler metal comprises, by weight, 15.5-16.5wt % of Sn, 7.0-8.0wt% of Sb, 0.01-1.2wt% of Ag and the balance of Pb. The brazing filler metal is moderate in melting temperature, has excellent wettability for the metal coatings, and is good in brazing process and applicable to soldering of silver (alloy) coatings, gold coatings and copper of electronic devices, and thermal impact resistance of brazing seams is good.

Description

technical field [0001] The invention relates to a low-temperature brazing filler metal for aluminum and aluminum alloy, in particular to a Sn-Zn-Ag-Ni alloy brazing filler metal. Background technique [0002] In the electronics industry, the quality of solder products directly affects the soldering process, performance indicators and service life of electronic devices. For special-purpose electronic devices such as aerospace, it is required that the Pb content in the solder is greater than 3%, and it has good wettability to gold plating, silver (alloy) plating, and copper, and it is preferably eutectic solder. Especially for complex devices, there is a need for graded brazing, which requires graded solders with melting temperatures ranging from 100°C to 400°C. InPbAg, SnPb, SnPbAg, etc. in existing commercial solders can meet some requirements, but solders with a melting temperature of 200°C to 250°C are still blank. The Pb-5Sn-10Sb (wt%) solder imported from Europe has a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/0227B23K35/0233B23K35/0244B23K35/268B23K35/40C22C11/06
Inventor 张国清原辉
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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