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Magnet structure, magnet unit and magnetron sputtering device comprising same

A magnetron sputtering, magnet unit technology, applied in the direction of magnets, magnetic objects, permanent magnets, etc., can solve the problems of excessive working time, increased manufacturing costs, and the adjustment of magnetic field strength cannot be formed locally, and achieves improvement. The effect of internal distribution

Active Publication Date: 2019-07-30
ULVAC KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods all increase the manufacturing cost, and the intensity of the magnetic field is adjusted by hand, and the adjustment of the magnetic field intensity cannot be formed locally, so there are problems such as requiring repeated operations several times, and much work time.

Method used

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  • Magnet structure, magnet unit and magnetron sputtering device comprising same
  • Magnet structure, magnet unit and magnetron sputtering device comprising same
  • Magnet structure, magnet unit and magnetron sputtering device comprising same

Examples

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Embodiment Construction

[0036] Hereinafter, an embodiment will be described in detail with reference to the drawings. The same reference symbols shown in the various figures denote the same components.

[0037] Various modifications can be added to the embodiments described below. The examples described below are not limited to the embodiments, and should be understood to include all changes, equivalents, and substitutions thereto.

[0038] The terms used in the examples are used only to describe a specific example, and do not limit the examples. A singular expression includes a plural expression unless it is clearly defined in the text. In this specification, terms such as "comprising" or "having" designate the existence of features, numbers, steps, actions, constituent elements, parts or combinations described in the specification. It should be understood that one or more than one The existence or additional possibility of other features or numbers, steps, actions, constituent elements, componen...

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Abstract

The present invention relates to a magnet and the like which can be used for a magnetron sputtering device. A magnet structure for a magnetron sputtering device of the present invention comprises: a permanent magnet; and a wire surrounding the permanent magnet.

Description

technical field [0001] The present invention relates to a magnet structure and the like that can be used in a magnetron sputtering device, and particularly relates to a magnet structure, a magnet unit, and a magnetron sputtering device that can improve uniformity in a sputtering process. Background technique [0002] A sputtering device is a device for coating thin films on substrates when manufacturing semiconductors, FPDs (LCDs, OLEDs, etc.) or solar cells. In addition, sputtering devices can also be used in roll-to-roll devices. A magnetron sputtering (magnetron sputtering) device in the sputtering device uses the gas injected into the lead chamber (chamber) in a vacuum state to generate plasma, and the ionized gas particle ions and the target material to be plated After the collision, the technology of plating the particles sputtered by the collision on the substrate. In this case, the magnetic field lines are formed in the future, and the magnet unit faces the substra...

Claims

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Application Information

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IPC IPC(8): H01J37/34C23C14/34H01F7/122H01F7/02
CPCC23C14/34H01F7/02H01F7/122H01J37/34H01F7/021H01J37/3405H01J37/3452C23C14/3407
Inventor 金正健苏秉镐金宣映禹昌远赵成基
Owner ULVAC KOREA
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