The invention relates to an
ultrasound-assisted column implanting method for CuCGA (
Ceramic Copper Column Grid Array) device packaging, and relates to the technical field of microelectronic packaging.The invention aims to solve a problem that the column implanting quality of devices is easy to be affected by assistant dies and has poor
heat transfer,
welding spot
porosity and
welding column scratches in the traditional method. The method comprises the steps of printing
soldering paste with non-eutectic point solder components on
welding pads arrayed in an array mode of a
chip carrier substrate and a
printed circuit board, and realizing solder sphere placement on the bonding pad through
reflow soldering; then forming positioning holes with the same size in the arrayed solder spheres; and inserting
copper columns with the same specifications into the positioning holes of the solder spheres arranged in an array mode at two ends of the substrate, and achieving double-sided implantation connection of the arrayed
copper columns by adopting an
ultrasound-assisted
solid-liquid coexistence zone solder
reflow soldering method.
Ultrasound cavitation can promote the destruction of an
oxide film on the surface of the
copper column, the micro-flow of the solder and the inter-
diffusion of interfacial atoms, and can refine the solder structure, reduce the
porosity and improve the joint strength. The
ultrasound-assisted column implanting method is applied to CuCGA device column implanting without being die assistance.