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Ultrasound-assisted column implanting method for CuCGA (Ceramic Copper Column Grid Array) device packaging

An ultrasonic-assisted and device packaging technology, which is applied to the assembly of printed circuits with electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of difficulty in planting copper columns in arrays, great influence on the quality of planting columns, and poor heat transfer in welding.

Active Publication Date: 2019-08-02
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the problems that the post-planting of arrayed copper pillars in the existing CuCGA device package is difficult, the quality of the post-planting is greatly affected by the auxiliary mold, and it is prone to poor welding heat transfer, solder joint pores and solder post scratches and damages, etc.

Method used

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  • Ultrasound-assisted column implanting method for CuCGA (Ceramic Copper Column Grid Array) device packaging

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specific Embodiment approach 1

[0044] A method for ultrasonically assisted pillar planting for CuCGA device packaging, comprising the following steps:

[0045] Step 1. Print solder paste with non-eutectic solder composition on the arrayed pads:

[0046] Same as the traditional BGA ball planting process, a sufficient amount of non-eutectic solder paste is printed on the arrayed pads of the printed circuit board and the chip carrier substrate by means of a mature stencil printing process;

[0047] Step 2. Realize the ball planting on the pads arranged in an array on the printed circuit board and the chip carrier substrate by reflow soldering:

[0048] The solder paste on the pads arranged in an array on the printed circuit board and the chip carrier substrate is heated and melted, the flux in the solder paste removes the oxide film on the pads, the solder in the solder paste wets the pads, and Solder balls arranged in an array are formed under the action of surface tension;

[0049] Step 3. Form a positioni...

specific Embodiment approach 2

[0059] The material of the pads arranged in an array in this embodiment is any one of copper, gold, silver, nickel, tin bronze, and brass, or a combination of copper, gold, silver, nickel, tin bronze, and brass The combined multi-layer metal film pad can also be one of the metals or alloys on which other tin-based solders can wet well.

[0060] Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0062] The diameter of the pads arranged in an array in this embodiment is D, where 0.9mm≤D≤3mm, and the thickness of the pads arranged in an array is 35 μm˜100 μm.

[0063] Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to an ultrasound-assisted column implanting method for CuCGA (Ceramic Copper Column Grid Array) device packaging, and relates to the technical field of microelectronic packaging.The invention aims to solve a problem that the column implanting quality of devices is easy to be affected by assistant dies and has poor heat transfer, welding spot porosity and welding column scratches in the traditional method. The method comprises the steps of printing soldering paste with non-eutectic point solder components on welding pads arrayed in an array mode of a chip carrier substrate and a printed circuit board, and realizing solder sphere placement on the bonding pad through reflow soldering; then forming positioning holes with the same size in the arrayed solder spheres; and inserting copper columns with the same specifications into the positioning holes of the solder spheres arranged in an array mode at two ends of the substrate, and achieving double-sided implantation connection of the arrayed copper columns by adopting an ultrasound-assisted solid-liquid coexistence zone solder reflow soldering method. Ultrasound cavitation can promote the destruction of an oxide film on the surface of the copper column, the micro-flow of the solder and the inter-diffusion of interfacial atoms, and can refine the solder structure, reduce the porosity and improve the joint strength. The ultrasound-assisted column implanting method is applied to CuCGA device column implanting without being die assistance.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to an ultrasonic-assisted pillar planting method for CuCGA device packaging. Background technique [0002] In the area array package, the CuCGA (Ceramic Copper Column Grid Array) package has a higher height and greater flexibility than the CBGA (Ceramic Ball Grid Array) package because of the higher height and greater flexibility of the array copper soldering pillars. The flexural deformation of the pillars effectively releases the internal stress of the interconnection structure, thus having a higher thermal cycle life. CuCGA packaging is widely used in high-frequency, high-power, high-I / O large-chip packaging and high-reliability packaging for aviation, aerospace, and military electronic devices. [0003] The process in which the copper pillars are arranged in an array and vertically connected to the pads arranged in the array is called pillar planting. However...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/60H05K3/34
CPCH01L21/4846H01L21/4867H01L24/81H01L2224/8121H05K3/3447
Inventor 赵智力丁欣郭壮曹荣楠胡明灯
Owner HARBIN UNIV OF SCI & TECH
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