34results about How to "Withstand voltage" patented technology

A multilayer wiring layer 400, a first inductor 310 and a second inductor 320 are formed on a substrate 10. The multilayer wiring layer is formed by alternately stacking an insulating layer and a wiring layer in this order t or more times (t≧3). The first inductor 310 is provided in the nth wiring layer in the multilayer wiring layer 400. The second inductor 320 is provided in the mth wiring layer in the multilayer wiring layer 400 (t≧m≧n+2) and positioned above the first inductor 310. No inductor is provided in any of the wiring layers positioned between the nth wiring layer and the mth wiring layer to be positioned above the first inductor 310. The first inductor 310 and the second inductor 320 constitute a signal transmitting device 300 which transmits an electrical signal in either of two directions.

In a stepping motor comprising a pair of stator yokes and a bobbin that includes a cylindrical body and two flanges, each of the two flanges radially extending outward from the cylindrical body so that the bobbin forms a squared U-shape in the axial cross-section thereof, there is provided a bobbin cover case disposed between the stator yokes and a coil wound around the bobbin, and the bobbin cover case includes an outer cover and an inner cover that are coupled to each other so as to provide a dual-layer insulating wall covering an open mouth portion of the squared U-shape, wherein the bobbin cover case inhibits a creeping discharge between the stator yokes and the coil.

A semiconductor device includes a SOI (silicon on insulator) substrate having a first region and a second region, a multilayer wiring layer formed on the SOI substrate and having an insulating layer and a wiring layer alternately stacked in this order, a first inductor formed over the SOI substrate, and a second inductor formed over the SOI substrate and positioned above the first inductor.

A semiconductor device capable of ensuring a withstand voltage of a transistor and reducing a forward voltage of a Schottky barrier diode in a package with the transistor and the Schottky barrier diode formed on chip, and a semiconductor package formed by a resin package covering the semiconductor device are provided. The semiconductor device 1 includes a semiconductor layer 22, a transistor area D formed on the semiconductor layer 22 and constituting the transistor 11, and a diode area C formed on the semiconductor layer 22 and constituting the Schottky barrier diode 10. The semiconductor layer 22 in the diode area C is thinner than the semiconductor layer 22 in the transistor area D.

A multilayer printed board comprising a plurality of capacitive coupling layers (6) each consisting of a dielectric layer (4) and a power supply layer (3) and a ground layer (5) facing each other while sandwiching the dielectric layer (4), first vias (7) connecting between the power supply layers (3) included in the plurality of capacitive coupling layers (6), and second vias (8) connecting between the ground layers (5) included in the plurality of capacitive coupling layers (6).

A manufacturing method of a silicon carbide semiconductor device includes the steps of: preparing a semiconductor substrate including a silicon carbide substrate, a drift layer and a first semiconductor layer; forming a plurality of first trenches in a cell portion; forming a gate layer on an inner wall of each first trench by an epitaxial growth method; forming a first insulation film on the surface of the semiconductor substrate; forming a gate electrode on the first insulation film for connecting to the gate layer electrically; forming a source electrode on the first insulation film for connecting to the first semiconductor layer in the cell portion; and forming a drain electrode connected to the silicon carbide substrate electrically.

A coil device comprising a coil, and a magnetic metal powder containing resin covering said coil. Said magnetic metal powder comprises at least two types of magnetic metal powders with different D50. The magnetic metal powder having larger D50 is defined as a large diameter powder, and the magnetic metal powder having smaller D50 is defined as a small diameter powder among the two types of said magnetic metal powder. Said large diameter powder is made of iron or iron based alloy. Said small diameter powder is made of Ni—Fe alloy. Said small diameter powder has D50 of 0.5 to 1.5 μm. Said large diameter powder and said small diameter powder respectively comprises an insulation coating layer.

The invention relates to on-line color-mixing electrophoresis paint, which is characterized in that the paint comprises following components with parts by weight of 50-70 parts of water-base resin, 1-3 anti-rot pigment, 6-9 titanium dioxide, 1-3 yellow pigment, 2-4 red pigment, 3-6 filling, 0.5-1 anti-immersion pigment, 0.2-0.6 dispersing agent, 1-3 neutralizing agent, 8-15 deionized water and 6-10 auxiliary solvent. The beneficial effect of the invention is that on-line color-mixing electrophoresis has the characteristics of voltage resistance, salt fog resistance and easy dispersion, can beprepared into complex pigment, and has excellent paint film property and favorable stability. The paint has excellent of pigment wetting dispersing function, can be used to research on-line color-mixing color master-batch paint through optimizing pigment, anti-immersion agent and auxiliary agent and the like, achieves the technical requirements of on-line color-mixing paint, monitors the generation of tank liquor of electrophoresis paint production flow in different time through utilizing the beam splitting and color measurement technology and gas chromatography technology, the change of paint film and color difference delta E, and realizes the on-line color-mixing.

The invention discloses a preparation method for an Al2O3 dispersion-strengthened Cu / Cr composite material. The method comprises the following steps of: 1) weighing and uniformly mixing low-solid solubility rare earth Cu-Al alloy powder, Cr powder and Cu2O, wherein the ratio of weight parts of the low-solid solubility rare earth Cu-Al alloy powder to weight parts of the Cr powder is (5-7):1, and the ratio of the weight parts of the low-solid solubility rare earth Cu-Al alloy powder to weight parts of the Cu2O is (10-12):1; 2) performing internal oxidation for 16 to 20 hours at temperature of 840 to 860 DEG C, crushing and sieving a powder mixture, and taking undersize powder of -150 meshes; 3) performing hydrogen reduction for about 2 to 3 hours at reduction temperature of about 820 to 840 DEG C; 4) pressing the treated powder into a cylindrical blank under pressing pressure of 320 to 350 MPa in a cold isostatic press; and 5) placing the cylindrical blank obtained by the step 4) into a forging and pressing die, and forging and pressing forming the cylindrical blank at 780 to 860 DEG C.

The invention relates to the technical field of heat conducting and heat dissipating devices and preparation methods and preparation devices thereof, and in particular relates to a holt-melting heat-conducting film, a heat-conducting liner including the hot-melting heat-conducting film and a preparation method and a preparation device thereof. The hot-melting heat-conducting film includes a heat conducting layer, wherein an adhesive layer is arranged on one surface of the heat conducting layer while a hot melt adhesive layer is arranged on the other surface of the heat conducting layer, a thin film layer is arranged on the adhesive layer, thus being simple in structure and good in heat conducting and heat dissipating effect; the heat conducting liner includes a hot-melting heat-conducting film and a support substrate, and contact point heat sources with a heat dissipating surface, thus improving heat dissipation efficiency; the preparation method comprises primarily forming, thermoforming, cooling for shaping and pulling and cutting to obtain finished products, so that the method is simple, production efficiency is improved, and production cost is reduced; the preparation device includes a control box, and a material rack, a primary forming mold, a thermoforming mold, a cooling shaping mold, an automatic puller, a counter and a cutting device sequentially arranged on an assembly line, one people can operated the whole assembly line, thus being saving in human and material resources.