Aluminum alloy plate and producing method thereof

A technology of aluminum alloy plate and manufacturing method, applied in the direction of final product manufacturing, sustainable manufacturing/processing, climate sustainability, etc., can solve the problems of low thermal expansion coefficient, insufficient flexibility, easy cracking of glass substrates, etc., and achieve high continuous Productivity, elimination of defects in manufacturing efficiency, and excellent high-temperature resistance

Active Publication Date: 2011-08-31
FUJIFILM CORP +1
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, there are disadvantages in that the glass substrate is easily broken, requires sufficient care in handling, and has insufficient flexibility
In addition, in Patent Document 3, one of the important points of the metal strip used as the base is that the coefficient of thermal expansion (TEC) is low in order to prevent peeling or cracking of the deposited metal oxide layer.

Method used

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  • Aluminum alloy plate and producing method thereof
  • Aluminum alloy plate and producing method thereof
  • Aluminum alloy plate and producing method thereof

Examples

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Effect test

Embodiment

[0155] Hereinafter, although an Example and a comparative example demonstrate this invention, this invention is not limited to these specific examples.

[0156] (Manufacturing example of aluminum alloy plate)

[0157] Aluminum ingots with an aluminum purity of 99.9, 99.96, and 99.93% by mass were prepared, and the following treatments were sequentially performed using aluminum rolled sheets composed of aluminum alloy components shown in Table 1 in which Cu was added to adjust the copper concentration. Al-3 used an ingot with an aluminum purity of 99.93%, and Al-4 used an ingot with an aluminum purity of 99.96%. Al-1, 2, 5, 6, 7, and 8 use aluminum ingots with an aluminum purity of 99.99%. Al-9 and 10 reproduce the composition described in Patent Document 1. Al-11, 12, and 13 reproduce the composition of JIS3004 material, 6015 material, and 1050 material respectively. Al-1-7 are used in the examples of the present invention, and Al-8-13 are used in comparative examples.

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Abstract

The invention provides a an aluminum alloy plate which has good insulating properties, good voltage resistance and good high temperature resistance and a producing method of the aluminum alloy plate. The aluminum alloy plate of a substrate with insulating properties comprises 0.6-3.0 mass% of copper and other elements which contains less than 0.1 mass% of unavoidable impurities except aluminum and copper.

Description

technical field [0001] The present invention relates to an aluminum alloy plate and a manufacturing method thereof. The aluminum alloy plate is preferably used as a thin-film solar cell substrate or a printed circuit board, and has excellent high-temperature strength and withstand voltage characteristics. Background technique [0002] Solar cells are broadly classified into three types: (1) monocrystalline Si solar cells, (2) polycrystalline Si solar cells, and (3) thin-film solar cells. Compared with monocrystalline Si solar cells and polycrystalline Si solar cells that use Si wafers as substrates, thin-film solar cells use various substrates such as glass substrates, metal substrates, and resin substrates, and form thin-film light-absorbing layers on these substrates. [0003] As the light absorbing layer, Si-based thin films of amorphous Si or nanocrystalline Si, compound-based thin films such as CdS / CdTe, CIS (Cu-In-Se), and CIGS (Cu-In-Ga-Se) are used. In addition, by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/12H01L31/048H01L31/18H01L31/20
CPCY02E10/50Y02E10/541Y02P70/50
Inventor 泽田宏和上杉彰男本居彻也日比野淳
Owner FUJIFILM CORP
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